A projection system includes a first optical system and a second optical system disposed on an enlargement side of the first optical system. The first optical system includes a first lens group having positive power, a second lens group disposed on the enlargement side of the first lens group and having negative power, and an optical path deflector disposed between the first lens group and the second lens group. The second optical system includes a reflection member having a concave reflection surface. The second lens group includes three aspherical lenses. Conditional Expression (1) below is satisfied,

0.25<|F|×FNO/Ymax<0.5  (1)

where F represents the focal length of the entirety of the projection system, FNO represents the F number of the projection system, and Ymax represents a maximum image height in a reduction-side conjugate plane.

Control instructions are transmitted to receivers by modulating light sources to generate light beams that are modulated with digital data streams for inducing control instructions in the light beams. Each light beam is applied to a pixel shaper element of a pixel shaper assembly to produce a light pixel, each light pixel carrying the control instructions of the light beam, each light pixel having a perimeter defined by the pixel shaper element. The pixel shaper assembly combines the light pixels into an image without significant overlap or voids between the light pixels. The light pixels are directed toward a projector lens for transmission toward the receivers. In a receiver, an optical receiver detects a light pixel. A controller decodes the control instructions received in the detected light pixel and uses the control instructions to control a function of the receiver.

A LiDAR apparatus includes a first substrate, a laser diode on a surface of the substrate for outputting light, a fast axis collimator (FAC) lens receiving the light and generating an at least partially collimated light beam, a polarizing beam splitter optically coupled to the FAC lens, at least a portion of the light beam passing through the polarizing beam splitter to a region being observed by the LiDAR apparatus. An opaque coating on the back side of an aperture element coupled to the polarizing beam splitter is patterned to provide a transparent aperture. At least a portion of light returning to the LiDAR apparatus from the region being observed is directed by the polarizing beam splitter, through the transparent aperture in the opaque coating on the aperture element, through the at least partially reflective optical element to an optical detector mounted on the substrate.

Various embodiments may relate to an optical system. The optical system may include a lens structure configured to generate an outgoing Gaussian beam based on an incoming Gaussian beam. The optical system may also include a light source configured to provide the incoming Gaussian beam to the lens structure. The lens structure may be a flat lens or a phase plate.

The present invention discloses a solder paste laser induced forward transfer device and method. The device comprises a laser, a beam shaping module, an optical path adjustment module, a solder paste transfer module and a computer control system, wherein the laser is connected to the beam shaping module, followed by the optical path adjustment module, and the solder paste transfer module is located below the optical path adjustment module. The beam shaping module comprises a beam expanding lens, an aperture, a flat-top beam shaper and a spatial light modulator. The optical path adjustment module comprises a two-dimensional galvanometer and an f-θ lens. The solder paste transfer module consists of a transparent substrate, a solder paste film, a clamp, a Z-axis lifting table, a receiving substrate, and an XYZ precise moving platform. The computer control system consists of a computer and drivers of other devices. The device and method can achieve mask-free, non-contact and high-precision solder paste transfer, thereby greatly shortening the production cycle and reducing the production cost.

A beam shaper (1) for shaping a laser beam is provided, including a first beam shaping section (2) designed for shaping a central part of the laser beam, and a second beam shaping section (3) designed for shaping a peripheral part of the laser beam. Moreover, a device for laser beam treatment of a workpiece and a method for laser beam treatment of a workpiece are provided.

An optical imaging lens may include a first, a second, a third, a fourth, a fifth and a sixth lens elements positioned in an order from an object side to an image side. The optical imaging lens may satisfy AAG/(T3+T6)≥2.500, wherein a sum of five air gaps from the first lens element to the sixth lens element along the optical axis is represented by AAG, a thickness of the third lens element along the optical axis is represented by T3, and a thickness of the sixth lens element along the optical axis is represented by T6.

A detector (110) for an optical detection of at least one object (112) is proposed. The detector (110) comprises: —at least one transfer device (120), wherein the transfer device (120) comprises at least two different focal lengths (140) in response to at least one incident light beam (136); —at least two longitudinal optical sensors (132), wherein each longitudinal optical sensor (132) has at least one sensor region (146), wherein each longitudinal optical sensor (132) is designed to generate at least one longitudinal sensor signal in a manner dependent on an illumination of the sensor region (146) by the light beam (136), wherein the longitudinal sensor signal, given the same total power of the illumination, is dependent on a beam cross-section of the light beam (136) in the sensor region (146), wherein each longitudinal optical sensor (132) exhibits a spectral sensitivity in response to the light beam (136) in a manner that two different longitudinal optical sensors (132) differ with regard to their spectral sensitivity; wherein each optical longitudinal sensor (132) is located at a focal point (138) of the transfer device (120) related to the spectral sensitivity of the respective longitudinal optical sensor (132); and —at least one evaluation device (150), wherein the evaluation device (150) is designed to generate at least one item of information on a longitudinal position and/or at least one item of information on a color of the object (112) by evaluating the longitudinal sensor signal of each longitudinal optical sensor (132). Thereby, a simple and, still, efficient detector for an accurate determining of a position and/or a color of at least one object in space is provided.

Methods and systems for generating non-diffracting light sheets for multicolor fluorescence microscopy are disclosed. A method for generating a non-diffracting light patterned Bessel sheet comprises transmitting an input light beam through a Fourier transform lens the input light beam has a spatial intensity pattern at a first plane, and a Fourier plane is formed after the Fourier transform lens to obtain a first light beam; transmitting the first light beam through an annulus mask to obtain a second light beam; and transmitting the second light beam through an excitation objective lens to form a non-diffracting patterned light sheet. A method for generating a non-diffracting light line Bessel sheet comprises transmitting an input light beam at a first lane through an annulus mask to obtain a first light beam; and transmitting the first light beam through an excitation objective lens to form a non-diffracting Bessel light sheet.

A laser irradiation method of irradiating, with a pulse laser beam, an irradiation object in which an impurity source film is formed on a semiconductor substrate includes: reading fluence per pulse of the pulse laser beam with which a rectangular irradiation region set on the irradiation object is irradiated and the number of irradiation pulses the irradiation region is irradiated, the fluence being equal to or larger than a threshold at or beyond which ablation potentially occurs to the impurity source film when the irradiation object is irradiated with pulses of the pulse laser beam in the irradiation pulse number and smaller than a threshold at or beyond which damage potentially occurs to the surface of the semiconductor substrate; calculating a scanning speed Vdx; and moving the irradiation object at the scanning speed Vdx relative to the irradiation region while irradiating the irradiation region with the pulse laser beam at the repetition frequency f.