A fingerprint sensor having electrostatic discharge (ESD) protection includes a first ESD protection electrode and a second ESD protection electrode. The first ESD protection electrode is connected to an ESD protection circuit for providing an ESD path, where the first ESD protection electrode and a fingerprint sensor electrode array are formed in a same layer of the fingerprint sensor. The second ESD electrode is connected to the first ESD electrode via multiple conductive via.

The present invention relates to an electronic device comprising a capacitive fingerprint sensor having a fingerprint sensing surface forming part of an exterior surface of the electronic device; a protective film arranged on the exterior surface of the electronic device comprising the fingerprint sensing surface; wherein the protective film is arranged to at least partially cover the fingerprint sensing surface; and wherein the protective film comprises an electrically conductive pattern covering the fingerprint sensing surface, the electrically conductive pattern being configured to enable verification of a functionality of the fingerprint sensor. The invention also relates to a method of manufacturing an electronic device comprising a fingerprint sensor, and to a method of verifying a functionality of a fingerprint sensor.

A pixel module and a fingerprint identification system are provided. The pixel module includes: a top-layer electrode, configured to receive a contact of a finger, a contact capacitance being formed between the top-layer electrode and the finger; a pixel circuit, configured to detect a capacitance value of the contact capacitance; and a resistor, coupled between the top-layer electrode and the pixel circuit. The pixel module suppresses the electrostatic current formed by the electrostatic charges, thereby achieving the effect of electrostatic protection.

A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints from the top side, and/or that comprise a sensor die directly electrically connected to conductive elements of a plate through which fingerprints are sensed.

A package structure, an electronic device and a method for manufacturing the package structure are presented. The package structure comprises: a substrate (100), a sensing module (200) disposed on an upper surface of the substrate (100) and electrically connected to the substrate (100), and a package colloid (300) disposed on the upper surface of the substrate (100) and coating at least one portion of the sensing module (200), wherein the sensing module (200) comprises a capacitive sensor (210) and an optical sensor (220), and the package colloid (300) comprises at least one portion of a photic zone (310) disposed corresponding to the optical sensor (220). Thus, the capacitive sensor and the optical sensor can be packaged in one package structure, so as to improve the degree of integration of the package structure and save the package space.

A fingerprint identification module includes a substrate, a sensing die, a mold compound layer and a circuit board. The substrate includes plural electrical contacts. The plural electrical contacts are exposed outside the substrate. The sensing die is attached on the substrate and electrically connected with the substrate so as to sense a fingerprint image. The mold compound layer is formed on the substrate to encapsulate the sensing die. The circuit board includes plural connection pads. The circuit board and the substrate are electrically connected with each other through the plural connection pads and the plural electrical contacts. The substrate and the circuit board are not integrally formed with each other.

A fingerprint identification module includes a substrate, a fingerprint sensor die, a cover plate and a mold compound layer. The fingerprint sensor die is attached on the substrate for sensing a fingerprint image. The mold compound layer is formed over the substrate. The fingerprint sensor die and the cover plate over the substrate are molded together through the mold compound layer, and the cover plate is exposed. The fingerprint identification module has small thickness and enhanced sensing accuracy.

Provided are a fingerprint reading device and a fingerprint reading method that can appropriately read a fingerprint even when reading a fingerprint of a relatively soft finger that may be easily subjected to significant elastic deformation. The fingerprint reading device includes: a placement portion on which a finger is placed, provided with a reading face so as to be able to move between first and second positions; a drive unit that causes the reading face to move between the first and second positions; and a reading unit that reads a fingerprint when the reading face is positioned at the first position, the drive unit causes the reading face to move to the second position and further move from the second position to the first position, and the reading unit reads a fingerprint when the reading face has moved from the second position to the first position.

A piezoelectric polyvinylidene fluoride (PVDF) material, a method for manufacturing the same, and a fingerprint recognition module are provided. The polyvinylidene PVDF material includes PVDF, a first solvent, a second solvent, a fluorosurfactant, and an inducing material. Material of the inducing material is one of carbon nanotubes, carbon black, and gold nanorods. Because of the high anisotropy of the inducing material, molecular orientation of the PVDF material is induced, thereby improving piezoelectric performance of the piezoelectric PVDF material. Problems of conventional piezoelectric PVDF materials, which are used in ultrasonic fingerprint recognition modules, such as poor piezoelectric performance and high-energy loss are improved.

According to one embodiment, a sensor includes a panel. The panel includes a cell having a detection surface and a non-detection surface, and a support substrate formed of resin and bonded to the non-detection surface of the cell. The cell includes an insulating substrate formed of resin and having a first surface and a second surface, a first protective layer facing the second surface of the insulating substrate, and a sensor electrode disposed between the insulating substrate and the first protective layer. A thickness of the support substrate is greater than a thickness of the insulating substrate, and is greater than a thickness of the first protective layer.