Passive alignment and connection between a fiber array and a plurality of optical waveguides terminating along an edge of a photonic IC is provided by a controlled mating between V-grooves formed in a fiber support substrate and alignment ridges formed to surround waveguide terminations along an edge of a photonic IC. The V-grooves of the fiber support substrate are spaced to define the same pitch as the waveguides on the photonic IC, with the height and width of the alignment ridges formed to engage with the V-grooves upon mating of the fiber support substrate with the photonic IC. The individual fibers are positioned within associated V-grooves such that their endfaces are retracted from a proximal end portion of the support structure. It is this proximal end portion that mates with the alignment ridges on the photonic IC.

An optical system includes a photonics chip, a bridge waveguide structure formed on the chip, and an optical fiber disposed over the chip and optically aligned with the bridge waveguide structure. A cavity between the bridge waveguide structure and the chip is at least partially filled with an adhesive resin and a filler material having a coefficient of thermal expansion (CTE) less than that of the adhesive resin. The filler material may include filler particles dispersed throughout the adhesive resin, or a discrete layer of material separate from the adhesive resin. The composite adhesive material filling the cavity has an effective coefficient of thermal expansion less than the coefficient of thermal expansion of conventional adhesive resins. This lower effective CTE improves the survivability of the overlying bridge waveguide structure following thermal cycling of the optical system.

An optical coupling device for routing optical signals for use in an optical communications module, in which defined on a base are a structured surface having a surface profile that reshapes and/or reflect an incident light, and an alignment structure defined on the base, configured with a surface feature to facilitate positioning an optical component on the base in optical alignment with the structured surface to allow light to be transmitted along a defined path between the structured surface and the optical component. The structured surface and the alignment structure are integrally defined on the base by stamping a malleable material of the base. The alignment structure facilitates passive alignment of the optical component on the base in optical alignment with the structured surface to allow light to be transmitted along a defined path between the structured surface and the optical component. The structured surface has a reflective surface profile, which reflects and/or reshape incident light.

An integrated module includes a first component having a photonic device and electrical pads at a first side and a second side opposite to the first side, and a second component having electrical pads and bonded to the first component by matching their electrical pads. An optical signal is incident from an external medium to the photonic device through an anti-reflection coating at the second side of the first component, a partially-etched opening, or an etch-through opening. The opening can either be in the first component so the optical signal is incident at the photonic device from the second side or the opening can be in the second component so the optical signal is incident at the photonic device through part of the second component. When bonding the first component to the second component, a protrusion and indentation pair can be used to increase the alignment accuracy.

An optical integrated circuit (IC) structure includes: a substrate including a fiber slot formed in an upper surface of the substrate and extending from an edge of the substrate, and an undercut formed in the upper surface and extending from the fiber slot; a semiconductor layer disposed on the substrate; a dielectric structure disposed on the semiconductor layer; an interconnect structure disposed in the dielectric structure; a plurality of vents that extend through a coupling region of the dielectric structure and expose the undercut; a fiber cavity that extends through the coupling region of dielectric structure and exposes the fiber slot; and a barrier ring disposed in the dielectric structure, the barrier ring surrounding the interconnect structure and routed around the perimeter of the coupling region.

An optical circuit board of the present disclosure includes a wiring board and an optical waveguide. The wiring board includes a mounting region for an optical component on an upper surface of the wiring board. The optical waveguide is located in a region adjacent to the mounting region, and includes, over the upper surface of the wiring board, a lower cladding layer, a plurality of cores extending in a first direction, and an upper cladding layer in this order, and is provided with alignment marks on the lower cladding layer. The lower cladding layer includes a first region in which the plurality of cores are located, and two second regions located facing the first region across a groove at positions between which the plurality of cores are sandwiched. The optical waveguide includes a first surface facing the mounting region, and end surfaces of the plurality of cores are exposed thereon.

A projection device includes multiple optical fiber mounting mechanisms. Each of the optical fiber mounting mechanisms includes an optical fiber extending along a first direction as an axis direction, a signal circuit extending along the first direction, and a mounting structure. The optical fiber includes an engaging section. The mounting structure surrounds the engaging section of the optical fiber and the signal circuit. The mounting structure includes an installation portion extending radially relative to the first direction. The installation portion includes a surface and multiple elements exposed from the surface. The surface includes a normal direction parallel with the first direction. A first length of the engaging section of the optical fiber protruding from the surface of the installation portion is longer than lengths of the elements protruding from the surface.

Waveguide substrate connection systems and methods are provided herein. An example waveguide assembly comprises a first substrate having a first waveguide, a second substrate having a second waveguide, an adhesive, and one or more spacers. A height for the one or more spacers is less than 10 m. The adhesive and the one or more spacers provide a composite material configured to assist in securing the first substrate and the second substrate together to align the first waveguide and the second waveguide. When the first substrate and the second substrate are attached together via the adhesive, the one or more spacers are configured to maintain a desired gap spacing therebetween so as to optimize coupling efficiency between the first waveguide and the second waveguide. The desired gap spacing corresponds to the height for the one or more spacers.

An optical system includes a photonics chip, a bridge waveguide structure formed on the chip, and an optical fiber disposed over the chip and optically aligned with the bridge waveguide structure. A cavity between the bridge waveguide structure and the chip is at least partially filled with an adhesive resin and a filler material having a coefficient of thermal expansion (CTE) less than that of the adhesive resin. The filler material may include filler particles dispersed throughout the adhesive resin, or a discrete layer of material separate from the adhesive resin. The composite adhesive material filling the cavity has an effective coefficient of thermal expansion less than the coefficient of thermal expansion of conventional adhesive resins. This lower effective CTE improves the survivability of the overlying bridge waveguide structure following thermal cycling of the optical system.

The invention relates to an optical fiber mounted photonic integrated circuit device, wherein the tolerance for positioning in terms of the coupling between the single mode optical fibers and the optical waveguides provided on the photonic integrated circuit device is increased. An optical waveguide core group is provided in such a manner where a plurality of optical waveguide cores having a portion that is tapered in the direction of the width within a plane are aligned parallel to each other at intervals that allow for mutual directional coupling and that are narrower than the width of the core of the single mode optical fiber, and the inclined connection end surface of the single mode optical fiber and the upper surface of an end portion of the optical waveguide cores face each other for coupling.