A shared floating gate device, the device including an. nFET, a pFET including a different material than that of the nFET, and a floating gate.

A method of forming a FG OTP/MTP cell with a P+ drain junction at the NCAP region and the resulting device are provided. Embodiments include forming MVPW regions laterally separated in a p-sub; forming a MVNW region in the p-sub between the MVPW regions; forming a first RX, a second RX, and a third RX in the MVPW and MVNW regions, respectively; forming a first and a second pair of floating gates separated over and perpendicular to the first and second RX and the second and third RX, respectively; forming a N+ source region between and adjacent to each FG of the first and the second pair in the second RX; and forming a pair of P+ drain regions in the second RX, each P+ drain region adjacent to a FG of the first pair and a FG of the second pair and remote from the N+ source region.

A shared floating gate device, the device including an nFET, a pFET including a different material than that of the nFET, and a floating gate.

The present disclosure includes apparatuses, methods, and systems for preventing parasitic current during program operations in memory. An embodiment includes a sense line, an access line, and a memory cell. The memory cell includes a first transistor having a floating gate and a control gate, wherein the control gate of the first transistor is coupled to the access line, and a second transistor having a control gate, wherein the control gate of the second transistor is coupled to the access line, a first node of the second transistor is coupled to the sense line, and a second node of the second transistor is coupled to the floating gate of the first transistor. The memory cell also includes a diode, or other rectifying element, coupled to the sense line and a node of the first transistor.

A non-volatile memory device comprises an array of non-volatile memory cells, a controller in communication with the non-volatile memory cell, a row driver including a plurality of high-voltage switches for applying high-voltages to non-volatile memory cells, a column driver including a plurality of sensing circuits for monitoring the data of the non-volatile memory cells; and, a plurality of time delay circuits, wherein the time delay circuit is configured to reduce peak current caused by simultaneous application of high voltages to the non-volatile memory cells or simultaneous detection of current flowing across bit lines of the non-volatile memory cells.

Device and method of forming a non-volatile memory (NVM) device are disclosed. The NVM device includes NVM cells disposed on a substrate in a device region. The NVM cell includes a floating gate (FG) with first and second FG sidewalls disposed on the substrate and an intergate dielectric layer disposed over the FG and substrate. Re-entrants are disposed at corners of the intergate dielectric which are filled by dielectric re-entrant spacers. An access gate (AG) with first and second AG sidewalls is disposed on the substrate adjacent to the FG such that the second AG sidewall is adjacent to a first FG sidewall and separated by the intergate dielectric layer and the re-entrant spacers prevent AG from filling the re-entrants. A first source/drain (S/D) region is disposed in the substrate adjacent to the first AG sidewall and a second S/D region is disposed in the substrate adjacent to the second FG sidewall.

A method of forming a FG OTP/MTP cell with a P+ drain junction at the NCAP region and the resulting device are provided. Embodiments include forming MVPW regions laterally separated in a p-sub; forming a MVNW region in the p-sub between the MVPW regions; forming a first RX, a second RX, and a third RX in the MVPW and MVNW regions, respectively; forming a first and a second pair of floating gates separated over and perpendicular to the first and second RX and the second and third RX, respectively; forming a N+ source region between and adjacent to each FG of the first and the second pair in the second RX; and forming a pair of P+ drain regions in the second RX, each P+ drain region adjacent to a FG of the first pair and a FG of the second pair and remote from the N+ source region.

Semiconductor device, memory arrays, and methods of forming a memory cell include or utilize one or more memory cells. The memory cell(s) include a first nanosheet transistor located on top of a substrate and connected to a first terminal, a second nanosheet transistor located on top of the first nanosheet transistor and connected in parallel to the first nanosheet transistor and connected to a second terminal, where the first and second nanosheet transistors share a common floating gate and a common output terminal, and an access transistor connected in series to the common output terminal and a low voltage terminal, the access transistor configured to trigger hot-carrier injection to the common floating gate to change a voltage of the common floating gate.

A shared floating gate device, the device including an nFET, a pFET including a different material than that of the nFET, and a floating gate.

An integrated circuit includes an insulating layer overlying a semiconductor substrate. A semiconductor layer of a first conductivity type overlies the insulating layer. A plurality of projecting regions that are spaced apart from each other overly the semiconductor layer. A sequence of PN junctions are in the semiconductor layer. Each PN junction is located at an edge of an associated projecting region. Each PN junction also extends vertically from an upper surface of the semiconductor layer to the insulating layer.