G11C11/4125

SEMICONDUCTOR DEVICE AND METHOD FOR DRIVING THE SEMICONDUCTOR DEVICE
20200235733 · 2020-07-23 ·

To provide a semiconductor device that generates a stable negative potential with high accuracy and achieves lower power consumption. The semiconductor device includes a voltage conversion circuit, a comparator, a logic circuit, a transistor, and a capacitor. The voltage conversion circuit has a function of outputting, as a second signal, a signal obtained by conversion of a voltage of an input first signal in response to a clock signal output from the logic circuit. The comparator has a function of being controlled to be supplied with or not supplied with a power supply voltage in response to a power gating signal. The transistor has a function of holding an output voltage of the comparator in the capacitor in a period during which the transistor is in an off state. The logic circuit has a function of switching between supply and stop of the clock signal on the basis of the voltage held in the capacitor in a period during which the power supply voltage to the comparator is stopped.

SRAM with Error Correction in Retention Mode
20200227115 · 2020-07-16 ·

A method for storing information in SRAM bit cell arrays provides for lowering voltage supplied to the SRAM bit cell arrays, with voltage lowering controlled by a connected voltage control circuit. Writing, reading, and correcting information storable in the SRAM bit cell arrays is accomplished using an error correcting code (ECC) block connected to at least some of the SRAM bit cell arrays. The ECC block is configurable to repair stored information.

Hybrid configuration memory cell

A configuration memory cell includes a latch portion including a cross-coupled latch having complementary output nodes, and a programmable read-only memory (PROM) portion coupled to one of the complementary output nodes of the latch portion, the PROM portion including a programmable and erasable ReRAM device.

MEMORY DEVICE
20200219547 · 2020-07-09 ·

A memory device capable of reading reference data while achieving optimization of electric power consumption is provided. A memory device includes a memory area storing reference data of N (1) dimensions each composed of M (1) bits. A number of memory grains each composed of nonvolatile memory and power drivers paired with the memory grains to supply electrical power to the memory grains are provided in each region specified by column lines in the number and M row lines, the number being one to N inclusive. When the power driver receives a control signal from the corresponding one of the column lines, a control signal from the corresponding one of the M row lines, and a clock signal, the power driver supplies electrical power to the memory grain in synchronization with the clock signal.

STATIC RANDOM-ACCESS MEMORY STRUCTURE AND RELATED FABRICATION METHOD
20200219891 · 2020-07-09 ·

A static random-access memory structure includes a substrate, a first conductive type transistor, a second conductive type transistor and a capacitor unit. The first conductive type transistor and the second conductive type transistor are disposed on the surface of the substrate, and the capacitor unit is positioned between the transistors. The capacitor unit includes a first electrode, a second electrode, and a dielectric layer disposed between the first electrode and the second electrode. The first electrode includes a plurality of first protrudent portions and a planar portion. The first protrudent portions are connected to the first planar portion and protrude from the top surface of the planar portion. The second electrode covers the top surface of the first protrudent portions and formed between adjacent first protrudent portions.

Static random access memory

A static random access memory (SRAM) structure includes a first inverter comprising a first pull-up transistor and a first pull-down transistor, a second inverter comprising a second pull-up transistor and a second pull-down transistor, a first pass transistor coupled to the first inverter, and a second pass transistor coupled to the second inverter. Preferably, the first inverter is coupled to a first tunnel magnetoresistance (TMR) structure and the second inverter is coupled to a second TMR structure.

IMPLEMENTING SEU DETECTION METHOD AND CIRCUIT

A method and a circuit for implementing single event upset (SEU) parity detection, and a design structure on which the subject circuit resides are provided. The circuit implements detection of unwanted state changes due to SEUs, noise or other event in a latch having a default state of zero. The latch includes an L1 latch and an L2 latch with the L2 latch having the connected output and is used and monitored for a flip. A pair of series-connected field effect transistors (FETs) is connected between a drive input of a parity control circuit and ground potential. An inverted output of the L1 latch and a true output of the L2 latch is applied to a respective gate of the pair of series-connected FETs.

METHOD FOR CONTROLLING POWER SUPPLY IN SEMICONDUCTOR DEVICE

A method for controlling power supply in a semiconductor device including a CPU and a PLD which can hold data even in an off state is provided. The semiconductor device includes a processor, a programmable logic device, and a state control circuit. The programmable logic device includes a first nonvolatile memory circuit and has a function of holding data obtained by arithmetic processing of the programmable logic device when it is turned off. The state control circuit obtains data on the amount of a task performed by the programmable logic device in accordance with an operation of the processor. The programmable logic device detects the state of progress of the task and outputs a signal to the state control circuit. The state control circuit monitors the amount of the task and the state of progress of the task and turns off the programmable logic device when the task is completed.

SEMICONDUCTOR DEVICE AND DATA RETENTION METHOD
20200143876 · 2020-05-07 ·

A semiconductor device has a first memory circuit comprising a first memory cell comprising a first field effect transistor, a second memory circuit comprising a second memory cell comprising a second field effect transistor, and a regulator for converting the first power supply potential to a second voltage value lower than the voltage value of the first power supply potential. The second gate length of the second field effect transistor is longer than the first gate length of the first field effect transistor, the first memory cell is supplied with a second power supply potential through regulator, and the second memory cell is supplied with a first power supply potential.

Soft error-resilient latch

A latch is provided. The latch includes a plurality of storage nodes including a plurality of data storage nodes configured to store a data bit having one of two states and a plurality of complementary data storage nodes configured to store a complement of the data bit. The latch includes a plurality of supply voltage multi-dependency stages respectively corresponding to the plurality of storage nodes. Each supply voltage multi-dependency stage has an output coupled to a storage node and at least two control inputs respectively coupled to at least two other storage nodes of the plurality of storage nodes. The supply voltage multi-dependency stage is configured to cause a state of the data bit stored in the storage node to change from a first state to a second state in response a change in both states of two data bits respectively stored in the at least two other storage nodes.