A support pin arrangement determination assisting method includes displaying an image including a board image that indicates a shape and an arrangement of an already mounted component on the already mounted surface; inputting an arrangement position of the support pin to the displayed image; and displaying a composite image in which a pin arrangement image indicating the input arrangement position is superimposed on the board image. A planar image of the support pin in the pin arrangement image includes an image of a top portion of a shaft and an image of a contact portion which is located on a tip side of the top portion, which has a sectional shape smaller than that of the top portion, and which contacts and supports a lower surface of the board.

There is provided technology which is a component mounting machine which mounts electronic components onto a circuit substrate and is capable of displaying a movable region of an inner portion of the component mounting machine within a same image. The component mounting machine is provided with a fixed camera which monitors the inner portion of the component mounting machine and a display section which is capable of displaying a captured image of the fixed camera. The fixed camera is capable of imaging a range from a pickup position at which the suction nozzle picks up the electronic component which is supplied from the component feeder to a mounting position at which the electronic component is mounted onto the circuit substrate within the same image.

Four parts of a unity is described here, centered around the multi-tier conductive circuits. The detachable production platform is a prerequisite for manufacturing of these circuits as described. The solder-dispenser is necessary if the circuits are made of anything but magnetic metal powder, or if the means for containing solder material are made solid, and the device-dispenser replaces conventional pick-n-place machines to provide devices to a circuit much quicker and much cheaper.

The multi-tier conductive circuit that is the central idea and the final product of the presented innovations is highly flexible and highly cost efficient.

The trend of miniaturizing all kinds of electronic equipments has been the outset for these innovations and it is our firm belief that all the industry could benefit highly from such a circuit.

There is provided a system 10 including at least one of inspection machines 20 and 22 and an NG board discharge machine 24 which moves an NG board to a checking position visible to a worker. The system 10 acquires positional information of a circuit board during conveyance, and stores the NG board by associating a work result for the NG board with the positional information. In this manner, the positional information of the NG board is acquired. Based on the positional information, it is determined whether or not the circuit board conveyed to the NG board discharge machine is the NG board. When the circuit board conveyed to the NG board discharge machine is the NG board, a checking-purpose working machine discharges the NG board to the checking position. In this manner, it is not necessary to arrange the checking-purpose working machine adjacent of a downstream side of the inspection machines, and it is possible to arrange another working machine between the checking-purpose working machine and the inspection machine. In addition, even when the multiple inspection machines are arranged in the system, one checking-purpose working machine can correspond to the multiple inspection machines.

An electronic component mounter having a mounting head includes: a board transporter (transport mechanism) that transports a board with a transport belt supporting the board; a recognizer (a board recognition camera or a height sensor) that is provided in the mounting head and recognizes a state of a front surface of the transport belt; and a determiner (wear determiner) that determines a degradation state (wear degree) of the transport belt based on the state of the front surface of the transport belt recognized by the recognizer.

A board work device provided with mounting head that performs work with respect to a circuit board, slider on which the mounting head is mounted, moving device that moves the slider to any position, and support pin gripping device for gripping support pins which is provided on the slider on the opposite side to the side on which the mounting head is mounted.

A mounting machine acquires identification information arranged in a back-up plate, from the back-up plate. The mounting machine controls a conveyance unit so as to change a conveyance lane based on mounting conditions when the acquired identification information is identification information which is included in the mounting conditions of a printed circuit board. Meanwhile, in the mounting machine, when the acquired identification information is not the identification information which is included in the mounting conditions of the printed circuit board, the conveyance lane is stopped from being changed. In this manner, a conveyance width of the conveyance lane is not changed when the back-up plate which is ready to be subjected to mounting processing and matches the mounting conditions is not mounted.

An apparatus for disassembling an electronic component from a circuit board includes a base, a controller, a positioning assembly, and a heating and suction assembly. The controller is fixed to the base. The positioning assembly is arranged on the base and coupled to the controller. The positioning assembly is configured to be controlled by the controller to position the circuit board at a first predetermined position. The heating and suction assembly is movably arranged on the base and coupled to the controller. The heating and suction assembly is moved to a second predetermined position to heat the electronic component and moved to a third predetermined position to attract and hold the heated electronic component by suction, whereby the electronic component is disassembled from the circuit board.

A board work device includes a housing device, a holding device, a moving device, a first lane and a second lane, a corresponding relationship acquisition device, a priority order acquisition device, and a control device. The holding device exchangeably holds a board work tool that performs a board work on a board. The corresponding relationship acquisition device acquires a corresponding relationship between the types of the board work tool and each of the multiple board works for each of the boards. The control device controls the holding device and the moving device such that, when performing the board work based on the acquired corresponding relationship, in a predetermined case, the board work that is capable of being performed in the other lane is performed without exchanging the board work tool currently being held.

The invention relates to a soldering module (3) for the, in particular selective, soldering of components to a circuit board (14), having a soldering nozzle (32) for creating a solder wave. It is proposed that the soldering module (3) comprises a linear conveyor (8), in particular a belt conveyor or a chain conveyor, for applying solder to the circuit board (14) by moving the circuit board (14) in a conveying direction over the solder wave, and that the linear conveyor (8) is tiltable, in particular about a first tilting axis (23).