Systems and methods for releasing semiconductor dies during pick and place operations are disclosed. In one embodiment, a system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further includes a cooling member coupleable to a cold fluid source and configured to direct a cold fluid supplied by the cold fluid source toward the support substrate at the pick station. The cold fluid cools a die attach region of the substrate where the semiconductor die is attached to the substrate to facilitate removal of the semiconductor die.

In component mounting device, if a rotary head held by a head holder greatly deviates from a specified reference, a CPU executes a process for a holding error. The process for the holding error includes a process of holding a rotary head again by the head holder or the like, for example. If the rotary head greatly deviates from a specified reference and the component mounting process is executed as is, there is a fear that poor precision will occur during component mounting. Therefore, the CPU does not execute the component mounting process but executes the process for the holding error.

A substrate tray for accommodating at least one ceramic substrate therein including: an accommodation part including a first opening part of which the upper side is open so that the ceramic substrate can be accommodated and withdrawn; and a support part formed on the circumference of the accommodation part so as to support the side wall circumference of the ceramic substrate, wherein the support part includes: an inner wall in contact with at least one surface of the ceramic substrate; an outer wall spaced a predetermined distance from the inner wall; an upper surface for connecting the inner wall to the outer wall; and a second opening part formed to be open in the direction opposite to the first opening part at a location facing the upper surface between the inner wall and the outer wall.

In a component mounter, a cut and clinch unit is arranged below a circuit board that is conveyed by a conveyance device, and the cut and clinch unit can be moved to a given position by a moving device. When imaging a fiducial mark of the circuit board using an imaging device, the cut and clinch unit is moved such that an identification assistance sticker arranged on the cut and clinch unit is positioned as the background to the fiducial mark. The color of the circuit board surrounding the fiducial is white and the color of the identification assistance sticker is black. Thus, the outline of the fiducial mark is clear and the fiducial mark can be appropriately recognized based on the image data.

A mounting head includes a pickup nozzle, a shaft member, a drive unit, and a position retainer. The shaft member has a cylindrical shape and moves in an axial direction to switch a pressure applied to the pickup nozzle between negative and positive pressures. First and second movement ends in the axial direction are negative and positive pressure application positions, respectively, where negative and positive pressure, respectively, is applied to the pickup nozzle. The drive unit includes a drive source that moves a movable portion in the axial direction. The movable portion contacts the shaft member when moved in the axial direction, to move the shaft member between the negative and positive pressure application positions. During a power-off period of the drive source, the position retainer holds the movable portion in a predetermined position away from the shaft member located at the negative or positive pressure application positions.

In embodiments, a PCB reflow process may be carried out by the components of an automated system working together to separate PCBs from reflow carriers and transport the reflow carriers back to a previous station of the PCB reflow system. The automated reflow carrier recycling system that is described herein may include a clip unlocking mechanism, a PCB pickup mechanism, a shifter, one or more lifters, and one or more overhead conveyors.

A support pin arrangement determination assisting method includes: displaying an image including a board image that indicates a shape and an arrangement of an already mounted component on an already mounted surface; inputting an arrangement position of a support pin to the displayed image; superimposing a pin arrangement image indicating the input arrangement position on the board image to create a composite image; and displaying the composite image. The composite image, a first pin arrangement image, and a second pin arrangement image are superimposed on the board image. The first pin arrangement image is generated by inputting an arrangement position in a state that the board is positioned at the first mounting work position, and the second pin arrangement image is generated on the basis of the first pin arrangement image with an assumption that the board is positioned at the second mounting work position.

When a workpiece holder holding a workpiece is rocked around a lateral rocking axis by a work stage of a mounter and the workpiece is positioned so that one mounting surface of the workpiece faces a predetermined direction to be worked, a component is mounted on the one mounting surface by a mounting head of the mounter. When a posture of the workpiece in the workpiece holder is changed by a posture changing head of a posture changer and thereafter the workpiece holder in which the posture of the workpiece is changed is rocked around the lateral rocking axis by the work stage of the mounter and the workpiece is positioned so that the other mounting surface of the workpiece faces a predetermined direction to be worked, a component is mounted on the other mounting surface by the mounting head of the mounter.

Disclosed is a machine for transferring electronic components onto electronic cards (4), including: a conveyor (1) on which the electronic cards (4) file past in succession, and sensors (3) disposed along the conveyor in such a way as to determine the position of the electronic cards (4) filing along the conveyor (1). The density of the sensors (3) along the conveyor (1) is sufficiently high such that an electronic card (4) does not leave the field of a sensor (3) before it has entered the field of another sensor (3), over at least a part of the length of the conveyor (1).

A system including at least one inspection machine and an NG board discharge machine which moves an NG board to a checking position visible to a worker. The system acquires positional information of a circuit board during conveyance, and stores the NG board by associating a work result for the NG board with the positional information. In this manner, the positional information of the NG board is acquired. Based on the positional information, it is determined whether or not the circuit board conveyed to the NG board discharge machine is the NG board. When the circuit board conveyed to the NG board discharge machine is the NG board, a checking-purpose working machine discharges the NG board to the checking position.