An element body of a multilayer capacitor has a plurality of first electrodes and a plurality of second electrodes. At least one of the first electrodes is curved such that a first main body portion is located on an outer side of a first extending portion in a first direction, and at least one of the second electrodes is curved such that a second main body portion is located on an outer side of a second extending portion in the first direction. The following expressions (1) to (6) are satisfied for lengths L0 to L4 in a second direction and distances TL1 to TL3 between main surfaces.

0.03≤L1/L0≤0.1  (1)

0.1≤L2/L0≤0.25  (2)

0.75≤L3/L0≤0.9  (3)

0.9≤L4/L0≤0.97  (4)

0≤(TL1−TL2)/TL1≤0.02  (5)

0≤(TL1−TL3)/TL1≤0.02  (6)

An interdigitated metal-insulator-metal capacitor structure is formed by a first unitary body of a first conductive material that includes a first metal plate, a first set of interdigitated electrodes protruding upwards from a top surface of the first metal plate, and a first set of connecting vias protruding downwards from a bottom surface of the first metal plate. A second unitary body of a second conductive material is disposed above the first unitary body and electrically separated from the first unitary body by an insulating layer. The second unitary body includes a second metal plate, a second set of interdigitated electrodes protruding downwards from a bottom surface of the second metal plate, and a second set of connecting vias protruding upwards from a top surface of the second metal plate. The first set of interdigitated electrodes are interleaved with the second set of interdigitated electrodes.

An interdigitated metal-insulator-metal capacitor structure is formed by a first unitary body of a first conductive material that includes a first metal plate, a first set of interdigitated electrodes protruding upwards from a top surface of the first metal plate, and a first set of connecting vias protruding downwards from a bottom surface of the first metal plate. A second unitary body of a second conductive material is disposed above the first unitary body and electrically separated from the first unitary body by an insulating layer. The second unitary body includes a second metal plate, a second set of interdigitated electrodes protruding downwards from a bottom surface of the second metal plate, and a second set of connecting vias protruding upwards from a top surface of the second metal plate. The first set of interdigitated electrodes are interleaved with the second set of interdigitated electrodes.

A multi-layer ceramic electronic component includes: a ceramic body including first and second internal electrodes laminated in a first axis direction, first and second main surfaces facing in the first axis direction, and first and second end surfaces facing in a second axis direction orthogonal to the first axis, the first and second internal electrodes being drawn to those end surfaces; a first external electrode covering the first end surface and extending to the first main surface; and a second external electrode covering the second end surface and extending to the first main surface. Each external electrode includes a first region including a first outermost layer mainly containing tin and extending from the end surface to the first main surface, and a second region free from an outermost layer mainly containing tin and disposed adjacent to the first region in the first axis direction on the end surface.

A multi-layer ceramic electronic component includes: a ceramic body including first and second internal electrodes laminated in a first axis direction, first and second main surfaces facing in the first axis direction, and first and second end surfaces facing in a second axis direction orthogonal to the first axis, the first and second internal electrodes being drawn to those end surfaces; a first external electrode covering the first end surface and extending to the first main surface; and a second external electrode covering the second end surface and extending to the first main surface. Each external electrode includes a first region including a first outermost layer mainly containing tin and extending from the end surface to the first main surface, and a second region free from an outermost layer mainly containing tin and disposed adjacent to the first region in the first axis direction on the end surface.

Apparatuses and methods are provided for a capacitor including two more plates. The capacitor includes one or more teeth cut in an edge of at least one plate of the two or more plates. The one or more teeth extends from the edge of the at least one plate to a point at a length into the at least one plate. Other aspects are described.

Apparatuses and methods are provided for a capacitor including two more plates. The capacitor includes one or more teeth cut in an edge of at least one plate of the two or more plates. The one or more teeth extends from the edge of the at least one plate to a point at a length into the at least one plate. Other aspects are described.

An array substrate and a display device. The array substrate includes a base substrate, a first electrode, a first insulating layer and a second electrode. The first electrode is on the base substrate; the first insulating layer is on a side of the first electrode away from the base substrate; the second electrode is on a side of the first insulating layer away from the first electrode. The second electrode is provided with a first through-hole and a slit communicated with the first through-hole and extending from the first through-hole to an edge of the second electrode, and an orthographic projection of the first electrode on the base substrate completely falls within an orthographic projection of the second electrode, the first through-hole and the slit on the base substrate. At this time, the first electrode, the second electrode, and the first insulating layer can constitute a capacitor.

A semiconductor device is provided that includes a substrate 10 with first and second opposing main surfaces, a circuit layer disposed on the first main surface, and a first resin body on a surface of the circuit layer opposite from the substrate. The circuit layer includes first and second electrode layers on a side of the semiconductor substrate, a dielectric layer disposed between the electrode layers, a first outer electrode electrically connected to the first electrode layer and extended to the surface of the circuit layer, and a second outer electrode electrically connected to the second electrode layer and extended to the surface of the circuit layer. The first resin body is between the first and second outer electrodes in a plan view, and in sectional view, a tip end of the first resin body is positioned higher than tip ends of the first and second outer electrodes.

A capacitor structure and a power convertor are provided by the present disclosure. The capacitor structure includes a housing and at least one core arranged inside the housing, and two electrodes of the capacitor structure are respectively led out from two ends of the housing. Thus, the pole piece required in a case that electrodes are led from the same end of the housing is omitted, thereby saving material cost. Besides, the housing and the core are respectively hollow structures, and the internal heat of the capacitor structure can be ventilated and dissipated through the corresponding hollow part, thereby improving the heat dissipation performance of the capacitor structure. In addition, by arranging the fin heat dissipation teeth on the housing, the heat dissipation area can be increased to further improve the heat dissipation efficiency.