Some embodiments include a capacitor. The capacitor has a first electrode with a lower pillar portion, and with an upper container portion over the lower pillar portion. The lower pillar portion has an outer surface. The upper container portion has an inner surface and an outer surface. Dielectric material lines the inner and outer surfaces of the upper container portion, and lines the outer surface of the lower pillar portion. A second electrode extends along the inner and outer surfaces of the upper container portion, and along the outer surface of the lower pillar portion. The second electrode is spaced from the first electrode by the dielectric material. Some embodiments include assemblies (e.g., memory arrays) which have capacitors. Some embodiments include methods of forming capacitors.

Some embodiments include a capacitor. The capacitor has a first electrode with a lower pillar portion, and with an upper container portion over the lower pillar portion. The lower pillar portion has an outer surface. The upper container portion has an inner surface and an outer surface. Dielectric material lines the inner and outer surfaces of the upper container portion, and lines the outer surface of the lower pillar portion. A second electrode extends along the inner and outer surfaces of the upper container portion, and along the outer surface of the lower pillar portion. The second electrode is spaced from the first electrode by the dielectric material. Some embodiments include assemblies (e.g., memory arrays) which have capacitors. Some embodiments include methods of forming capacitors.

Some embodiments include a capacitor. The capacitor has a first electrode with a lower pillar portion, and with an upper container portion over the lower pillar portion. The lower pillar portion has an outer surface. The upper container portion has an inner surface and an outer surface. Dielectric material lines the inner and outer surfaces of the upper container portion, and lines the outer surface of the lower pillar portion. A second electrode extends along the inner and outer surfaces of the upper container portion, and along the outer surface of the lower pillar portion. The second electrode is spaced from the first electrode by the dielectric material. Some embodiments include assemblies (e.g., memory arrays) which have capacitors. Some embodiments include methods of forming capacitors.

Some embodiments include a capacitor. The capacitor has a first electrode with a lower pillar portion, and with an upper container portion over the lower pillar portion. The lower pillar portion has an outer surface. The upper container portion has an inner surface and an outer surface. Dielectric material lines the inner and outer surfaces of the upper container portion, and lines the outer surface of the lower pillar portion. A second electrode extends along the inner and outer surfaces of the upper container portion, and along the outer surface of the lower pillar portion. The second electrode is spaced from the first electrode by the dielectric material. Some embodiments include assemblies (e.g., memory arrays) which have capacitors. Some embodiments include methods of forming capacitors.

A multilayer capacitor includes a capacitor body including a first capacitance forming region and a second capacitance forming region disposed to face each other with a connection region of a predetermined thickness in which an internal electrode is not formed disposed therebetween, a thickness of the first capacitance forming region being greater than a thickness of the second capacitance forming region. The first capacitance forming region includes first and second internal electrodes. The second capacitance forming region includes a third and fourth internal electrodes. The connection region includes at least one dummy electrode disposed to have a shorter average distance to the first capacitance forming region than to the second capacitance forming region.

A multilayer capacitor includes a capacitor body including a first capacitance forming region and a second capacitance forming region disposed to face each other with a connection region of a predetermined thickness in which an internal electrode is not formed disposed therebetween, a thickness of the first capacitance forming region being greater than a thickness of the second capacitance forming region. The first capacitance forming region includes first and second internal electrodes. The second capacitance forming region includes a third and fourth internal electrodes. The connection region includes at least one dummy electrode disposed to have a shorter average distance to the first capacitance forming region than to the second capacitance forming region.

An insulative feedthrough attachable to an active implantable medical device includes a feedthrough body having a material which is both electrically insulative, biocompatible and separates a body fluid side from a device side. A passageway is disposed through the feedthrough body. A composite conductor is disposed within the passageway and has a body fluid side metallic wire electrically conductive to a device side metallic wire. The body fluid side metallic wire extends from a first end disposed inside the passageway to a second end on the body fluid side. The device side metallic wire extends from a first end disposed inside the passageway to a second end on the device side. The body fluid side metallic wire is hermetically sealed to the feedthrough body. The body fluid side metallic wire is biocompatible and is not the same material as the device side metallic wire.

An insulative feedthrough attachable to an active implantable medical device includes a feedthrough body having a material which is both electrically insulative, biocompatible and separates a body fluid side from a device side. A passageway is disposed through the feedthrough body. A composite conductor is disposed within the passageway and has a body fluid side metallic wire electrically conductive to a device side metallic wire. The body fluid side metallic wire extends from a first end disposed inside the passageway to a second end on the body fluid side. The device side metallic wire extends from a first end disposed inside the passageway to a second end on the device side. The body fluid side metallic wire is hermetically sealed to the feedthrough body. The body fluid side metallic wire is biocompatible and is not the same material as the device side metallic wire.

A capacitor that prevents generation of a substrate capacitance composed of an upper electrode, a substrate, and a lower electrode. Specifically, the capacitor includes a substrate; a lower electrode disposed on the substrate; a dielectric film disposed on the lower electrode; an upper electrode disposed on a part of the dielectric film; and a first terminal electrode that is connected to the upper electrode. Moreover, the upper electrode and the first terminal electrode are formed in a region for forming the lower electrode in a plan view of the capacitor viewed from the first terminal electrode side.

A capacitor that prevents generation of a substrate capacitance composed of an upper electrode, a substrate, and a lower electrode. Specifically, the capacitor includes a substrate; a lower electrode disposed on the substrate; a dielectric film disposed on the lower electrode; an upper electrode disposed on a part of the dielectric film; and a first terminal electrode that is connected to the upper electrode. Moreover, the upper electrode and the first terminal electrode are formed in a region for forming the lower electrode in a plan view of the capacitor viewed from the first terminal electrode side.