Patent classifications
H01G4/018
Dielectric film and power capacitor comprising dielectric film
A dielectric film is provided. The dielectric film includes a dielectric polymer substrate having two surfaces opposite to each other and a coating layer formed on at least one of the two surfaces of the dielectric polymer substrate by chemical vapor deposition polymerization and/or irradiation polymerization. A power capacitor includes the dielectric film. A process for preparing the dielectric film is provided.
Precision capacitor
In a described example, a method for forming a capacitor includes: forming a capacitor first plate over a non-conductive substrate; flowing ammonia and nitrogen gas into a plasma enhanced chemical vapor deposition (PECVD) chamber containing the non-conductive substrate; stabilizing a pressure and a temperature in the PECVD chamber; turning on radio frequency high frequency (RF-HF) power to the PECVD chamber; pretreating the capacitor first plate for at least 60 seconds; depositing a capacitor dielectric on the capacitor first plate; and depositing a capacitor second plate on the capacitor dielectric.
Precision capacitor
In a described example, a method for forming a capacitor includes: forming a capacitor first plate over a non-conductive substrate; flowing ammonia and nitrogen gas into a plasma enhanced chemical vapor deposition (PECVD) chamber containing the non-conductive substrate; stabilizing a pressure and a temperature in the PECVD chamber; turning on radio frequency high frequency (RF-HF) power to the PECVD chamber; pretreating the capacitor first plate for at least 60 seconds; depositing a capacitor dielectric on the capacitor first plate; and depositing a capacitor second plate on the capacitor dielectric.
Electrical energy storage device and method for producing an electrical energy storage device
Electrical energy storage device (1), including at least one electrical component (2) and a busbar (5) for electrical power distribution, where the electrical component (2) is arranged on the busbar (5), and at least a first contact side (11) and/or a second contact side (12) of the electrical component (2) is connected to the busbar (5) by a contact element (8), and wherein the contact element (8) is formed at least partially as a mesh (7). The electrical component (2) is preferably a capacitor.
Electrical energy storage device and method for producing an electrical energy storage device
Electrical energy storage device (1), including at least one electrical component (2) and a busbar (5) for electrical power distribution, where the electrical component (2) is arranged on the busbar (5), and at least a first contact side (11) and/or a second contact side (12) of the electrical component (2) is connected to the busbar (5) by a contact element (8), and wherein the contact element (8) is formed at least partially as a mesh (7). The electrical component (2) is preferably a capacitor.
Capacitor and method for manufacturing the same
A capacitor that includes a substrate, a dielectric portion, and a conductor layer. The dielectric portion includes a thick film portion and a thin film portion. The thick film portion has a thickness larger than the average thickness of the dielectric portion in a direction perpendicular to the first main surface. The thin film portion has a thickness smaller than the average thickness of the dielectric portion in the direction perpendicular to the first main surface. The thick film portion has a larger relative permittivity than the thin film portion.
Capacitor and method for manufacturing the same
A capacitor that includes a substrate, a dielectric portion, and a conductor layer. The dielectric portion includes a thick film portion and a thin film portion. The thick film portion has a thickness larger than the average thickness of the dielectric portion in a direction perpendicular to the first main surface. The thin film portion has a thickness smaller than the average thickness of the dielectric portion in the direction perpendicular to the first main surface. The thick film portion has a larger relative permittivity than the thin film portion.
Trench capacitor with extended dielectric layer
An improved trench capacitor structure is disclosed that allows for the formation of narrower capacitors. An example capacitor structure includes a first conductive layer on the sidewalls of an opening through a thickness of a dielectric layer, a capacitor dielectric layer on the first conductive layer, a second conductive layer on the capacitor dielectric layer, and a conductive fill material on the second conductive layer. The capacitor dielectric layer laterally extends above the opening and along a top surface of the dielectric layer, and the conductive fill material fills a remaining portion of the opening.
Trench capacitor with extended dielectric layer
An improved trench capacitor structure is disclosed that allows for the formation of narrower capacitors. An example capacitor structure includes a first conductive layer on the sidewalls of an opening through a thickness of a dielectric layer, a capacitor dielectric layer on the first conductive layer, a second conductive layer on the capacitor dielectric layer, and a conductive fill material on the second conductive layer. The capacitor dielectric layer laterally extends above the opening and along a top surface of the dielectric layer, and the conductive fill material fills a remaining portion of the opening.
CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE
A capacitor structure includes a first comb-shaped electrode, a second comb-shaped electrode, a bottom electrode, an insulator layer, and a top electrode. The first comb-shaped electrode has a first pad and first fingers connecting to the first pad. The second comb-shaped electrode has a second pad and second fingers connecting to the first pad, wherein one of the second fingers is disposed between two adjacent first fingers. The bottom electrode includes a first portion, a second portion and a third portion which are spaced apart, wherein the first portion and the third portion are electrically coupled to the first comb-shaped electrode and the second comb-shaped electrode, respectively. The insulator layer is disposed over the bottom electrode. The top electrode is disposed over the insulator layer.