A capacitor component includes a lamination portion in which first and second internal electrodes are disposed to face each other in a first direction and separated from each other by a dielectric layer, and a body comprising the lamination portion and first and second connection portions disposed on both sides of the lamination portion in a second direction, perpendicular to the first direction, and connected to the first and second internal electrodes. The first and second connection portions each include a metal layer including nickel and disposed on the lamination portion and a ceramic layer disposed on the metal layer, and an average thickness of each of the first and second internal electrodes is 0.4 μm or less.

A capacitor component includes a lamination portion in which first and second internal electrodes are disposed to face each other in a first direction and separated from each other by a dielectric layer, and a body comprising the lamination portion and first and second connection portions disposed on both sides of the lamination portion in a second direction, perpendicular to the first direction, and connected to the first and second internal electrodes. The first and second connection portions each include a metal layer including nickel and disposed on the lamination portion and a ceramic layer disposed on the metal layer, and an average thickness of each of the first and second internal electrodes is 0.4 μm or less.

An electronic component has capacitor chips where terminal electrodes are formed on both end surfaces, individual metal terminals connected to the terminal electrodes, an insulation case accommodating the capacitor chips, and a connecting portion interconnecting a plurality of the insulation cases.

A multilayer electronic component includes a body including a plurality of dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connected to the first surface and the second surface and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other, a plurality of internal electrodes disposed inside of the body, exposed to the first surface and the second surface, and having one ends exposed to the third or fourth surfaces, side margin portions disposed on the first surface and the second surface, and external electrodes disposed on the third surface and the fourth surface. The side margin portions and the plurality of dielectric layers include a metal, and a total amount of the metal included in the side margin portions is greater than that of the plurality of dielectric layers.

A multilayer ceramic capacitor includes a body including dielectric ceramic layers and internal electrode layers, and an external electrode. The body includes a capacitance generating portion where the dielectric ceramic layers and the internal electrode layers are alternately stacked in a thickness direction, a main surface covering portion on a main surface of the capacitance generating portion, a side surface covering portion on a side surface of the capacitance generating portion, and an end surface covering portion on an end surface of the capacitance generating portion. Each internal electrode layer includes an exposed portion exposed at the end surface, the end surface covering portion partially covers the exposed portion, and the external electrode is connected to the internal electrode layers and covers the end surface covering portion and a portion of the exposed portion of, the portion of the exposed portion not being covered by the end surface covering portion.

A multilayer ceramic capacitor includes a multilayer body including dielectric ceramic layers laminated in the lamination direction, first and second main surfaces opposed in the lamination direction, first and second lateral surfaces opposed in a width direction, first and second end surfaces opposed in a length direction, a pair of external electrodes. The dielectric ceramic layers each include at least one selected from Ca, Zr, and Ti. The pair of external electrodes include first and second external electrodes respectively on the first and second lateral surfaces. A length direction is longer than the lamination direction or the width direction.

A multilayer ceramic capacitor includes a multilayer body including an inner layer portion including internal electrode layers and inner dielectric layers laminated alternately, and internal electrode layers at both ends thereof in a lamination direction, and outer dielectric layers covering the inner layer portion, and two external electrodes on both end surfaces of the multilayer body in a length direction intersecting the lamination direction. The inner and outer dielectric layers each include grains, and a difference between an average grain size of grains in the inner dielectric layers and an average grain size of grains in the outer dielectric layers is about 100 nm or less.

A multi-layer ceramic electronic component includes a ceramic body and a pair of external electrodes. The ceramic body includes a pair of main surfaces perpendicular to a first axis, a pair of end surfaces perpendicular to a second axis, a pair of side surfaces perpendicular to a third axis, and internal electrodes drawn to the end surfaces, and has a substantially rectangular parallelepiped shape. The external electrodes each include an end-surface-covering portion that covers one of the end surfaces, and a main-surface-covering portion that is formed to be continuous from the end-surface-covering portion and covers a part of the main surface. The main-surface-covering portion includes a conductive resin layer, and first and second convex portions formed on the basis of a shape of the conductive resin layer, each swelling toward the center in the direction of the second axis, and disposed apart from each other in the third axis direction.

A multi-layer ceramic electronic component includes a ceramic body and a pair of external electrodes. The ceramic body includes a pair of main surfaces perpendicular to a first axis, a pair of end surfaces perpendicular to a second axis, a pair of side surfaces perpendicular to a third axis, and internal electrodes drawn to the end surfaces, and has a substantially rectangular parallelepiped shape. The external electrodes each include an end-surface-covering portion that covers one of the end surfaces, and a main-surface-covering portion that is formed to be continuous from the end-surface-covering portion and covers a part of the main surface. The main-surface-covering portion includes a conductive resin layer, and first and second convex portions formed on the basis of a shape of the conductive resin layer, each swelling toward the center in the direction of the second axis, and disposed apart from each other in the third axis direction.

A thin film capacitor having a multilayer structure including a first electrode, a first dielectric layer, a second dielectric layer, and a second electrode in this order. The second dielectric layer and the second electrode are in contact. The first dielectric layer includes a perovskite type compound. The second dielectric layer includes a perovskite type compound or an oxide of M. When X1 and X2a represents an absolute value of an average energy for formation of an oxide of a cationic element included in a B site of the perovskite type compound included in the first dielectric layer and the second dielectric layer respectively, and X2b represents an absolute value of an average energy for formation of an oxide of M included in the second dielectric layer, then X2a<X1 and X2a≤1000 kJ/mol are satisfied or X2b<X1 and X2b≤1000 kJ/mol are satisfied.