An electronic component includes an electronic component element and a barrier film. The electronic component element has external electrodes at both ends thereof. The barrier film covers at least a part of a periphery of the electronic component element. The barrier film includes an insulating film having electrical insulating property and a clay layer containing clay.

An electronic component includes an electronic component element and a barrier film. The electronic component element has external electrodes at both ends thereof. The barrier film covers at least a part of a periphery of the electronic component element. The barrier film includes an insulating film having electrical insulating property and a clay layer containing clay.

In a multilayer ceramic electronic component, a stacked body includes a first outer layer and a first outermost internal electrode layer. The first outer layer defines a first main surface. The first outermost internal electrode layer is adjacent to the first outer layer. The first outermost internal electrode layer is in contact with a first external electrode at a first end surface. The thickness of the first outer layer at the first end surface is greater than the thickness of the first outer layer at the center or approximate center in a length direction.

A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and a plurality of internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween, and an external electrode formed outside the ceramic body. The external electrode includes an electrode layer, and a thickness T1 of the electrode layer corresponding to a central region of the ceramic body in a thickness direction is 5 μm or more and 30 μm or less, a thickness T2 of the electrode layer corresponding to a region in which an outermost internal electrode is located is 5 μm or more and 15 μm or less, and a thickness T3 of the electrode layer corresponding to a corner portion of the ceramic body is 0.1 μm or more and 10 μm or less.

A second busbar is provided that has a second electrode terminal and a second connection terminal. A first busbar is provided that has a first electrode terminal, a lateral side coupler, an overhang, and a first connection terminal. The first electrode terminal and/or the second electrode terminal has a protruding piece for connection (connecting protrusion). This protruding piece is elastically depressible in response to contact with an electrode surface of a capacitor element unit inserted from an opposite side of the lateral side coupler across a space between the first and second electrode terminals.

A second busbar is provided that has a second electrode terminal and a second connection terminal. A first busbar is provided that has a first electrode terminal, a lateral side coupler, an overhang, and a first connection terminal. The first electrode terminal and/or the second electrode terminal has a protruding piece for connection (connecting protrusion). This protruding piece is elastically depressible in response to contact with an electrode surface of a capacitor element unit inserted from an opposite side of the lateral side coupler across a space between the first and second electrode terminals.

A ceramic electronic component includes a multilayer chip having a substantially rectangular parallelepiped shape and including a first multilayer structure and a second multilayer structure disposed on each of top and bottom faces of the first multilayer structure, the first multilayer structure including first ceramic dielectric layers having a first width in a first direction in which side faces of the multilayer chip are opposite to each other, the second multilayer structure including second internal electrode layers having a second width less than the first width in the first direction, and a pair of external electrodes formed from the respective two edge faces to at least one of side faces of the multilayer chip, wherein main components of the first and second internal electrode layers differ from a main component of the external electrodes.

An electronic device 10 comprises chip capacitors 20a and 20b, an accommodation recess 62 accommodating the chip capacitors 20a and 20b, and a case 60 including a protrusion 64 partitioning the accommodation recess 62 into a first accommodation space 62a and a second accommodation space 62b along the X-axis direction. The protrusion 64 includes a first protrusion 64a and a second protrusion 64b disposed away from the first protrusion 64a along the Y-axis direction. The first protrusion 64a and the second protrusion 64b are disposed with a communication space 69 provided between the first protrusion 64a and the second protrusion 64b, so that the first accommodation space 62a and the second accommodation space 62b communicate.

An electronic device 10 comprises chip capacitors 20a and 20b, an accommodation recess 62 accommodating the chip capacitors 20a and 20b, and a case 60 including a protrusion 64 partitioning the accommodation recess 62 into a first accommodation space 62a and a second accommodation space 62b along the X-axis direction. The protrusion 64 includes a first protrusion 64a and a second protrusion 64b disposed away from the first protrusion 64a along the Y-axis direction. The first protrusion 64a and the second protrusion 64b are disposed with a communication space 69 provided between the first protrusion 64a and the second protrusion 64b, so that the first accommodation space 62a and the second accommodation space 62b communicate.

A method of manufacturing a winding capacitor package structure is provided. The method of manufacturing the winding capacitor package structure includes: forming a base layer on an inner bottom surface of a casing structure; placing a winding assembly and a part of a conductive assembly inside an accommodating space of the casing structure; sequentially forming a plurality of filling layers between the winding assembly and the casing structure; and then placing a bottom carrier frame on a bottom portion of the casing structure so as to match with the casing structure. The casing structure includes a rough inner surface, and the base layer and the filling layer are limited inside the casing structure through a friction provided by the rough inner surface of the casing structure.