Patent classifications
H01G4/228
ELECTRONIC SYSTEM WITH POWER DISTRIBUTION NETWORK INCLUDING CAPACITOR COUPLED TO COMPONENT PADS
An electronic system comprising a substrate with a substrate conductor pattern including substrate pads; a semiconductor component with active circuitry, and component pads coupled to the active circuitry of the semiconductor component and connected to the substrate pads of the substrate; a power source interface for receiving power from a power source; and a power distribution network for distributing power from the power source interface to the active circuitry of the semiconductor component. The power distribution network includes a first capacitor realized by conductive structures comprised in the semiconductor component, the first capacitor being coupled to a first component pad and a second component pad of the semiconductor component; a second capacitor arranged between the substrate and the semiconductor component, the second capacitor being coupled to the first component pad and the second component pad of the component package; and a power grid portion of the substrate conductor pattern.
ELECTRICAL STORAGE MODULE
An electrical storage module includes an insulating substrate that opposes an electrical storage group including a plurality of electrical storage devices and includes a plurality of through-holes, a plurality of current collecting foils that are arranged side by side at intervals from each other on a first surface of the insulating substrate on a side opposite to a surface that opposes the electrical storage group, and an insulating sheet that is disposed to cover the plurality of current collecting foils. The plurality of current collecting foils include a first current collecting foil and a second current collecting foil that are adjacent to each other at an interval in a direction parallel to the first surface. The first current collecting foil includes a first lead part in a tongue shape that extends from an edge, is inserted into a hole of the insulating substrate, and is electrically connected to a positive electrode of a battery, and the second current collecting foil includes a second lead part in a tongue shape that extends from the edge, is inserted into the hole of the insulating substrate, and is electrically connected to a negative electrode of the battery.
RELAY CONNECTOR
Provided is a relay connector including a relay terminal including a first connection portion configured to connect to a first device side terminal and a second connection portion configured to connect to a second device side terminal; a clamping member including a first clamping portion configured to clamp the first device side terminal together with the first connection portion and a second clamping portion configured to clamp the second device side terminal together with the second connection portion; a lower case configured to hold the relay terminal; and an upper case configured to hold the clamping member, wherein a connector case includes a first insertion opening and a second insertion opening; and guide portions are formed on the clamping member, the guide portions guiding the first device side terminal inserted from the first insertion opening and the second device side terminal inserted from the second insertion opening.
Ground electrical path from an MLCC filter capacitor on an AIMD circuit board to the ferrule of a hermetic feedthrough
An EMI/energy dissipating filter for an active implantable medical device (AIMD) comprises a first gold braze sealing an insulator to the ferrule of a glass-to-metal seal (GTMS) and a lead wire that is sealed in a passageway through the insulator by a second gold braze. A circuit board is disposed adjacent to the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization connected to its active electrode plates and a ground end metallization connected to its ground electrode plates. A ground electrical path extends from the ground end metallization of the chip capacitor, through a circuit board ground plate disposed on or within the circuit board, and to the ferrule. An active electrical path extends from the active end metallization of the chip capacitor to the lead wire of the GTMS.
Multilayer ceramic capacitor and board having the same mounted thereon
A multilayer capacitor includes a capacitor body including first and second dielectric layers and internal electrodes, and including first to sixth surfaces; first and second external electrodes disposed on the fifth and sixth surfaces; and third and fourth external electrodes disposed on the third and fourth surfaces. The internal electrodes include: a first internal electrode disposed on the first dielectric layer and connected to the first and second external electrodes; a second internal electrode disposed on the first dielectric layer and connected to the third external electrode; a third internal electrode disposed on the first dielectric layer and connected to the fourth external electrode; and a fourth internal electrode disposed on the second dielectric layer and overlapping at least a portion of the first to third internal electrodes.
Multilayer ceramic capacitor and board having the same mounted thereon
A multilayer capacitor includes a capacitor body including first and second dielectric layers and internal electrodes, and including first to sixth surfaces; first and second external electrodes disposed on the fifth and sixth surfaces; and third and fourth external electrodes disposed on the third and fourth surfaces. The internal electrodes include: a first internal electrode disposed on the first dielectric layer and connected to the first and second external electrodes; a second internal electrode disposed on the first dielectric layer and connected to the third external electrode; a third internal electrode disposed on the first dielectric layer and connected to the fourth external electrode; and a fourth internal electrode disposed on the second dielectric layer and overlapping at least a portion of the first to third internal electrodes.
Method of manufacturing capacitor structure and capacitor structure
A capacitor structure is provided, which includes a contact layer, an insulating layer, a bottom conductive plate, a dielectric layer and a top conductive plate. The contact layer has first, second, third, fourth and fifth portions arranged from periphery to center. The insulating layer is disposed over the contact layer and has an opening exposing the contact layer. The bottom conductive plate is disposed in the opening and including first, second and third portions extending along a depth direction of the opening and separated from each other and in contact with the first, third and fifth portions of the contact layer, respectively. The dielectric layer is conformally disposed on the bottom conductive plate and in contact with the second and fourth portions of the contact layer. The top conductive plate is disposed on the dielectric layer. A method of manufacturing the capacitor is also provided.
Method of manufacturing capacitor structure and capacitor structure
A capacitor structure is provided, which includes a contact layer, an insulating layer, a bottom conductive plate, a dielectric layer and a top conductive plate. The contact layer has first, second, third, fourth and fifth portions arranged from periphery to center. The insulating layer is disposed over the contact layer and has an opening exposing the contact layer. The bottom conductive plate is disposed in the opening and including first, second and third portions extending along a depth direction of the opening and separated from each other and in contact with the first, third and fifth portions of the contact layer, respectively. The dielectric layer is conformally disposed on the bottom conductive plate and in contact with the second and fourth portions of the contact layer. The top conductive plate is disposed on the dielectric layer. A method of manufacturing the capacitor is also provided.
Capacitor for multiple replacement applications
An apparatus suitable for use in an air-conditioning system and configured to provide a plurality of selectable capacitance values includes a plurality of capacitive devices and a pressure interrupter cover assembly. Each of the capacitive devices has a first capacitor terminal and a second capacitor terminal. The pressure interrupter cover assembly includes a deformable cover, a set of capacitor cover terminals, a common cover terminal, and a set of insulation structures. The apparatus also includes a conductor configured to electrically connect the second capacitor terminal of at least one of the capacitive devices to the common cover terminal.
Capacitor for multiple replacement applications
An apparatus suitable for use in an air-conditioning system and configured to provide a plurality of selectable capacitance values includes a plurality of capacitive devices and a pressure interrupter cover assembly. Each of the capacitive devices has a first capacitor terminal and a second capacitor terminal. The pressure interrupter cover assembly includes a deformable cover, a set of capacitor cover terminals, a common cover terminal, and a set of insulation structures. The apparatus also includes a conductor configured to electrically connect the second capacitor terminal of at least one of the capacitive devices to the common cover terminal.