A capacitor structure and a power converter are provided. The capacitor structure includes a parallel cell combination, and the parallel cell combination includes a plurality of cells and a plurality of current collectors. In the parallel cell combination: the cells are connected in parallel, and the poles connected in parallel are respectively connected with other devices through corresponding confluence points. Same poles of two adjacent cells are connected through a corresponding current collector, and the current-carrying specifications of each current collector is lower than the current-carrying requirements of a confluence point of a corresponding pole. That is to say, a conductor that implements the parallel connection of the cells is no longer a whole copper plate, but the individual current collectors, thus realizing the reduction of the cost of the conductor material.

A discrete electrical component is disclosed, including a component member having at least one lead; and a base member on which the component member is supported. The electrical component further includes at least one compliant pin member, each compliant pin member having a first end portion configured for press-fit engagement in a printed circuit board and a second end portion electrically connected to the at least one lead of the component member. The at least one compliant pin at least partly extends through or into the base member.

A discrete electrical component is disclosed, including a component member having at least one lead; and a base member on which the component member is supported. The electrical component further includes at least one compliant pin member, each compliant pin member having a first end portion configured for press-fit engagement in a printed circuit board and a second end portion electrically connected to the at least one lead of the component member. The at least one compliant pin at least partly extends through or into the base member.

A biocompatible electrical connection includes: a substrate; a ferrule having a concentric flange at a first end of the ferrule; a first adhesive; and a second adhesive. The substrate includes a hole having a diameter that is a specified amount larger than an outside diameter of the ferrule forming an annular space between the hole and the ferrule, the first adhesive adheres a first surface of the concentric flange of the ferrule to a first surface of the substrate, and the second adhesive fills the annular space between the hole and the ferrule.

A semiconductor device is provided having a semiconductor substrate with a circuit layer provided on a first main surface of the semiconductor substrate. The circuit layer includes a first and second electrode layers with a dielectric layer disposed therebetween, a first outer electrode electrically connected to the first electrode layer and a second outer electrode electrically connected to the second electrode layer. When the circuit layer is viewed from above, the first electrode layer has a first facing portion facing the second electrode layer in the thickness direction and a first non-facing portion not facing the second electrode layer, and the second electrode layer has a second facing portion facing the first electrode layer in the thickness direction and a second non-facing portion not facing the first electrode layer.

A thin-film device that includes a wiring electrode which contains copper. A terminal electrode is formed on a first region of the first main surface of the wiring electrode. A first close-contact layer made of a material different from copper and that has a shape covering, in a continuous manner, a second region of the first main surface of the wiring electrode, the second region being adjacent to the first region, and the side surface of the wiring electrode that is continuous with the second region.

A thin-film device that includes a wiring electrode which contains copper. A terminal electrode is formed on a first region of the first main surface of the wiring electrode. A first close-contact layer made of a material different from copper and that has a shape covering, in a continuous manner, a second region of the first main surface of the wiring electrode, the second region being adjacent to the first region, and the side surface of the wiring electrode that is continuous with the second region.

A capacitor that includes a substrate, a lower electrode on the substrate, a dielectric film on the lower electrode, an upper electrode on a part of the dielectric film, a protective layer that covers the lower electrode and the upper electrode, and an external electrode that penetrates the protective layer. The external electrode is formed only in a region defined by a periphery of the upper electrode in a plan view of the capacitor viewed from an upper surface thereof towards the substrate.

A capacitor that includes a substrate, a lower electrode on the substrate, a dielectric film on the lower electrode, an upper electrode on a part of the dielectric film, a protective layer that covers the lower electrode and the upper electrode, and an external electrode that penetrates the protective layer. The external electrode is formed only in a region defined by a periphery of the upper electrode in a plan view of the capacitor viewed from an upper surface thereof towards the substrate.

An electronic component includes a laminate in which first internal electrodes and second internal electrodes are alternately laminated in a lamination direction with dielectric layers interposed therebetween, the laminate including a first main surface and a second main surface opposite to each other in the lamination direction, a first side surface and a second side surface opposite to each other in a width direction, and a first end surface and a second end surface opposite to each other in a length direction, a first external electrode provided on a surface of the laminate and electrically connected to the first internal electrodes, a second external electrode provided on a surface of the laminate and electrically connected to the second internal electrodes, and side margin portions each including a dielectric including Ca, Zr, and Ti.