An electronic component includes a laminate in which first internal electrodes and second internal electrodes are alternately laminated in a lamination direction with dielectric layers interposed therebetween, the laminate including a first main surface and a second main surface opposite to each other in the lamination direction, a first side surface and a second side surface opposite to each other in a width direction, and a first end surface and a second end surface opposite to each other in a length direction, a first external electrode provided on a surface of the laminate and electrically connected to the first internal electrodes, a second external electrode provided on a surface of the laminate and electrically connected to the second internal electrodes, and side margin portions each including a dielectric including Ca, Zr, and Ti.

A capacitor module includes a capacitor element, a plurality of connection terminals for electrically connecting the capacitor element to a semiconductor module and a power supply that are another equipment, and an exterior coating that includes a resin film having electrical insulating property and wraps the capacitor element except the plurality of connection terminals.

A capacitor module includes a capacitor element, a plurality of connection terminals for electrically connecting the capacitor element to a semiconductor module and a power supply that are another equipment, and an exterior coating that includes a resin film having electrical insulating property and wraps the capacitor element except the plurality of connection terminals.

A capacitor that includes an insulating substrate; a capacitance forming portion including a metal porous body, a dielectric film, and a conductive film; and a sealing portion that seals the capacitance forming portion. The capacitance forming portion is on a first main surface of the insulating substrate. A first external connection line including a first via conductor penetrating the insulating substrate from the first main surface side toward the second main surface side is connected to the metal porous body; and a second external connection line including a second via conductor penetrating the insulating substrate from the first main surface side toward the second main surface side is connected to the conductive film. When viewed in a normal direction of the first main surface, the first via conductor and the second via conductor are both in a region where the capacitance forming portion is disposed.

A method for manufacturing a stacked capacitor structure includes: forming a first patterned structure over a substrate; forming a first bottom electrode over the first patterned structure; depositing a first dielectric film over the first bottom electrode; depositing a first top electrode layer over the first dielectric film; forming a first vertical interconnect structure; forming a second patterned structure over the first top electrode layer; forming a second bottom electrode over the second patterned structure and electrically connected to the first bottom electrode through the first vertical interconnect structure; depositing a second dielectric film over the second bottom electrode; depositing a second top electrode layer over the second dielectric film; and forming a second vertical interconnect structure extending from the first top electrode layer. The second top electrode layer is electrically connected to the first top electrode layer through the second vertical interconnect structure.

The disclosure is directed to methods and systems for a battery configured to store a first energy in a chemical form of the battery at a battery voltage level; an electrical load configured to draw an electrical current from the battery in response to an energy requirement of the electrical load, wherein the battery voltage level is configured to decrease in response to the electrical current being drawn from the battery by the electrical load; and a capacitor module in electrical communication with the battery and configured to store a second energy as an electric field of the capacitor module at a capacitor voltage level. The capacitor module can be in electrical communication with the load via the battery and can be configured to convey at least a portion of the second energy to the battery or to the load in response to a voltage differential between the capacitor voltage level and the battery voltage level exceeding a threshold to prevent the battery voltage level from dropping below a battery voltage threshold.

The disclosure is directed to methods and systems for a battery configured to store a first energy in a chemical form of the battery at a battery voltage level; an electrical load configured to draw an electrical current from the battery in response to an energy requirement of the electrical load, wherein the battery voltage level is configured to decrease in response to the electrical current being drawn from the battery by the electrical load; and a capacitor module in electrical communication with the battery and configured to store a second energy as an electric field of the capacitor module at a capacitor voltage level. The capacitor module can be in electrical communication with the load via the battery and can be configured to convey at least a portion of the second energy to the battery or to the load in response to a voltage differential between the capacitor voltage level and the battery voltage level exceeding a threshold to prevent the battery voltage level from dropping below a battery voltage threshold.

A wiring board includes an insulating layer, a thin film capacitor laminated on the insulating layer, an interconnect layer electrically connected to the thin film capacitor, and an encapsulating resin layer laminated on the thin film capacitor. The interconnect layer includes a pad protruding from the thin film capacitor. The encapsulating resin layer is a mold resin having a non-photosensitive thermosetting resin as a main component thereof. The encapsulating resin layer exposes a top surface of the pad, and covers at least a portion of a side surface of the pad.

An electronic component has capacitor chips where terminal electrodes are formed on both end surfaces, individual metal terminals connected to the terminal electrodes, an insulation case accommodating the capacitor chips, and a connecting portion interconnecting a plurality of the insulation cases.

An electronic component has capacitor chips where terminal electrodes are formed on both end surfaces, individual metal terminals connected to the terminal electrodes, an insulation case accommodating the capacitor chips, and a connecting portion interconnecting a plurality of the insulation cases.