Disclosed is an assembly including a busbar that includes: a first layer that defines: first layer top and bottom surfaces; first layer first and second ends; and a first layer center region between the first layer first and second ends; and the first layer forms first layer perforations of different sizes about the first layer center region so perforations closer to the first layer first end are smaller than perforations spaced apart therefrom; a second layer that is disposed against and electrically isolated from the first layer bottom surface, wherein the second layer defines connector orifices having a same size as each other that are aligned with the first layer perforations; and a first capacitor supported against and electrically connected to the first layer top surface, wherein the first capacitor includes busbar connectors that respectively extend through the first layer perforations to electrically connect with the connector orifices.

A power capacitor unit including a casing, first and second layers of capacitor elements wherein the first layer of capacitor elements are stacked on the second layer of capacitor elements, a first busbar assembly connected to the capacitor elements of the first layer, a second busbar assembly connected to the capacitor elements of the second layer, wherein the first busbar assembly and the second busbar assembly are arranged between the first layer of capacitor elements and the second layer of capacitor elements, a heat conducting layer provided between the first busbar assembly and the second busbar assembly, wherein the heat conducting layer is in thermal contact with the casing, thereby conducting heat from the first busbar assembly and the second busbar assembly to the casing, and wherein the casing is electrically insulated from the first busbar assembly and the second busbar assembly.

A power capacitor unit including a casing, first and second layers of capacitor elements wherein the first layer of capacitor elements are stacked on the second layer of capacitor elements, a first busbar assembly connected to the capacitor elements of the first layer, a second busbar assembly connected to the capacitor elements of the second layer, wherein the first busbar assembly and the second busbar assembly are arranged between the first layer of capacitor elements and the second layer of capacitor elements, a heat conducting layer provided between the first busbar assembly and the second busbar assembly, wherein the heat conducting layer is in thermal contact with the casing, thereby conducting heat from the first busbar assembly and the second busbar assembly to the casing, and wherein the casing is electrically insulated from the first busbar assembly and the second busbar assembly.

A box-shaped inner case (3) is accommodated in a box-shaped outer case (2), and refrigerant flow passages (27) are formed at five surfaces except opening surfaces (14, 24) by gaps between the inner and outer cases. A Gap of an opening edge of the outer case (2) and an opening edge of the inner case (3) is covered with a frame-shaped cover (6). A capacitor element (4) formed from a film capacitor is placed in the inner case (3), and the inner case (3) is filledwithpottingmaterial (5) having thermal conductivity so that the capacitor element (4) except the terminals (4a, 4b) is embedded. Cooling water flows along a longitudinal direction of the outer case (2) with one of refrigerant pipe connecters (15) being a refrigerant inlet and the other of the refrigerant pipe connecters (15) being a refrigerant outlet.

A box-shaped inner case (3) is accommodated in a box-shaped outer case (2), and refrigerant flow passages (27) are formed at five surfaces except opening surfaces (14, 24) by gaps between the inner and outer cases. A Gap of an opening edge of the outer case (2) and an opening edge of the inner case (3) is covered with a frame-shaped cover (6). A capacitor element (4) formed from a film capacitor is placed in the inner case (3), and the inner case (3) is filledwithpottingmaterial (5) having thermal conductivity so that the capacitor element (4) except the terminals (4a, 4b) is embedded. Cooling water flows along a longitudinal direction of the outer case (2) with one of refrigerant pipe connecters (15) being a refrigerant inlet and the other of the refrigerant pipe connecters (15) being a refrigerant outlet.

Provided is an improved electronic component package. The electronic component package comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination. The electronic component package also includes a structural lead frame comprising multiple leads wherein each lead is mounted to at least one first external termination and the structural lead frame comprises at least one break away feature between adjacent leads.

A multilayer ceramic electronic component includes an element body and a terminal electrode. The element body includes internal electrode layers and insulation layers alternately laminated in a lamination direction. The terminal electrode is formed on an outer surface of the element body to be contacted and connected with the internal electrode layers. The terminal electrode includes an end-side electrode part and an upper-side electrode part. The end-side electrode part covers a leading end of the element body where the internal electrode layers are led. The upper-side electrode part is formed on a part of an upper surface of the element body and continues to the end-side electrode part. The terminal electrode is not substantially formed on a lower surface of the element body located on the other side of the upper surface along the lamination direction.

A multilayer ceramic electronic component includes an element body and a terminal electrode. The element body includes internal electrode layers and insulation layers alternately laminated in a lamination direction. The terminal electrode is formed on an outer surface of the element body to be contacted and connected with the internal electrode layers. The terminal electrode includes an end-side electrode part and an upper-side electrode part. The end-side electrode part covers a leading end of the element body where the internal electrode layers are led. The upper-side electrode part is formed on a part of an upper surface of the element body and continues to the end-side electrode part. The terminal electrode is not substantially formed on a lower surface of the element body located on the other side of the upper surface along the lamination direction.

Film capacitor includes capacitor unit that has capacitor elements, upper bus bar, and lower bus bar. Capacitor elements have upper end electrodes and lower end electrodes that are connected to upper bus bar and lower bus bar, respectively. Film capacitor further includes case containing capacitor unit and being filled with filler resin, cooling plate near capacitor unit, and plate springs. Cooling plate is connected to a cooler and discharges heat generated from capacitor elements into the cooler. Plate springs apply an elastic force to capacitor unit in a direction toward cooling plate.

Film capacitor includes capacitor unit that has capacitor elements, upper bus bar, and lower bus bar. Capacitor elements have upper end electrodes and lower end electrodes that are connected to upper bus bar and lower bus bar, respectively. Film capacitor further includes case containing capacitor unit and being filled with filler resin, cooling plate near capacitor unit, and plate springs. Cooling plate is connected to a cooler and discharges heat generated from capacitor elements into the cooler. Plate springs apply an elastic force to capacitor unit in a direction toward cooling plate.