A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode including an electrode layer disposed on the body and connected to the internal electrode and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a metal wire, a conductive metal, and a base resin.

According to an embodiment, a capacitor includes a conductive substrate, a conductive layer and a dielectric layer. The conductive substrate has a first main surface and a second main surface. The first main surface includes sub-regions. Each sub-region is provided with recesses or projections each having a shape extending in one direction and arranged in a width direction thereof. One or more of the sub-regions and another one or more of the sub-regions are different from each other in a length direction of the recesses or protrusions. The conductive layer covers sidewalls and bottom surfaces of the recesses or sidewalls and top surfaces of the projections. The dielectric layer is interposed between the conductive substrate and the conductive layer.

A capacitor is provided. The capacitor includes a first electrode layer and a second electrode layer; and a first dielectric layer and a second dielectric layer, wherein the first dielectric layer and the second dielectric layer are disposed between the first electrode layer and the second electrode layer. The first dielectric layer includes a first dielectric powder and a first organic resin, and the second dielectric layer includes a second dielectric powder and a second organic resin. In particular, the weight ratio of the first dielectric powder to the first organic resin is greater than the weight ratio of the second dielectric powder to the second organic resin.

Methods, apparatuses, and systems related to forming a capacitor using a sacrificial material are described. An example method includes forming a first silicate material on a substrate. The method further includes forming a first nitride material on the first silicate material. The method further includes forming a second silicate material on the first nitride material. The method further includes forming a second nitride material on the second silicate material. The method further includes forming a sacrificial material on the second nitride material. The method further includes forming a column of capacitor material through the first silicate material, the first nitride material, the second silicate material, the second nitride material, and the sacrificial material. The method further includes removing the sacrificial material to expose a top portion of the capacitor material.

A chip component includes a substrate that has a first surface and a second surface on a side opposite to the first surface, a plurality of wall portions that are formed on a side of the first surface by using a part of the substrate, that have one end portion and one other end portion, and that are formed of a plurality of pillar units, a support portion that is formed around the wall portions by using a part of the substrate and that is connected to at least one of the end portion and the other end portion of the wall portions, and a capacitor portion formed by following a surface of the wall portion, in which each of the pillar units includes a central portion and three convex portions that extend from the central portion in three mutually different directions in a plan view and in which the wall portion is formed by a connection between the convex portions of the pillar units that adjoin each other.

A multilayer ceramic electronic component includes a laminate, a first external electrode on a first end surface of the laminate, and a second external electrode on a second end surface of the laminate. The laminate includes a central layer portion in which each first internal electrode layer and each second internal electrode layer oppose each other with a dielectric ceramic layer therebetween, peripheral layer portions sandwiching the central layer portion in a lamination direction, and side margins sandwiching the central layer portion and the peripheral layer portions in a width direction. The side margins each include an inner layer disposed closest to the laminate, an outer layer disposed farthest from the laminate, and a buffer layer disposed between the inner layer and the outer layer.

A thin film high polymer laminated capacitor includes: a laminated chip including dielectric layers, and internal electrode layers including first metal layers including a first metal vapor-deposited on the dielectric layers, and second metal layers including a second metal vapor-deposited on the first metal layers. The dielectric layers and the internal electrode layers being laminated and bonded alternately, and external electrodes formed on one end and the other end of the laminated chip. The laminated chip having a first region having the first metal layers formed on the dielectric layers, which are laminated alternately, and edge regions having the second metal layers formed on layers connected to the one end and layers connected to the other end in the first metal layers, which are laminated alternately, the first region having a capacitor function region, and the edge region having a heavy edge.

Present disclosure provide a capacitor includes: a semiconductor substrate; a laminated structure including n conductive layers and m dielectric layer(s), the i-th conductive layer being provided with at least one i-th isolation trench, the (i+1)-th conductive layer being provided above the i-th conductive layer and in the i-th isolation trench, isolation trenches in odd-numbered and even-numbered conductive layers having a first and a second overlap region in a vertical direction respectively, and the first overlap region not overlapping the second overlap region, where m, n, and i are positive integers, n2, and 1in1; at least one first external electrode electrically connected to all odd-numbered conductive layer(s) through a first conductive via structure in the second overlap region; and at least one second external electrode electrically connected to all even-numbered conductive layer(s) through a second conductive via structure in the first overlap region.

A multilayer ceramic electronic component includes a ceramic body including first and second internal electrodes disposed to face each other and a dielectric layer interposed therebetween. When an average thickness of the dielectric layer is denoted as td, an average thickness of the first and second internal electrodes is denoted as te, and a standard deviation of thicknesses of an internal electrode, measured at a plurality of points in a predetermined region of the internal electrode, is denoted as te, a ratio of the standard deviation of thicknesses of the internal electrode to the average thickness of the dielectric layer, which is denoted as te/td, satisfies 0.12te/td0.21.

A baking slurry composition for producing a green sheet of the present invention contains inorganic powder, a polyvinyl alcohol resin, acrylic polymer, and water. The acrylic polymer has a glass transition temperature higher than or equal to 50 C. and lower than or equal to 30 C. and an acid value greater than or equal to 50 mg KOH/g and less than or equal to 200 mg KOH/g. The acrylic polymer has a weight percentage of more than or equal to 0.1 and less than or equal to 5.0 relative to a total solid content of the baking slurry composition.