A capacitor includes a body including a plurality of dielectric layers and internal electrodes which are alternately stacked, and a compensation region formed in the interior of the body, the compensation region including portions of the plurality of dielectric layers and including a central portion and an end portion extended from the central portion. A thickness of the central portion of the compensation region is between 4 and 13 times as great as that of a dielectric layer among the plurality of dielectric layers on which the internal electrodes are formed.

A multilayer ceramic capacitor that includes a laminated body having a plurality of ceramic layers including crystal grains that have a perovskite structure, and a plurality of internal electrode layers; and external electrodes on first and second end surfaces of the laminated body and electrically connected to respective sets of the plurality of internal electrodes. In the ceramic layers, when the content of Ti is 100 parts by mol, the ceramic layers contain Ca at 0.10 to 15.00 parts by mol; Mg at 0.0010 to 0.0097 parts by mol; R at 0.50 to 4.00 parts by mol; M at 0.10 to 2.00 parts by mol; and Si at 0.50 to 2.00 parts by mol, and core parts of the crystal grains contain Ca.

A multi-layer ceramic capacitor includes a multi-layer unit, a side margin, and a bonding unit. The multi-layer unit includes ceramic layers and internal electrodes. The ceramic layers are made of first ceramics and laminated in a first direction, the first ceramics having a first average crystal grain diameter. The internal electrodes are disposed between the ceramic layers. The side margin is made of second ceramics and covers the multi-layer unit from a second direction orthogonal to the first direction, the second ceramics having a second average crystal grain diameter. The bonding unit is made of third ceramics and disposed between the multi-layer unit and the side margin, the third ceramics having a third average crystal grain diameter that is larger than the first average crystal grain diameter and the second average crystal grain diameter.

A method of manufacturing a multilayer ceramic capacitor includes preparing a laminate including ceramic layers and internal electrode layers arranged in a stacking direction and including two or more exposure regions at which the internal electrode layers and the ceramic layer interposed between the internal electrode layers are both exposed, and transferring a first conductive paste to the laminate. The laminate includes two longitudinal end surfaces, and four surfaces orthogonal or substantially orthogonal to the end surfaces and, on at least one of the four surfaces, a protrusion in which the exposure region protrudes outward. In the transfer step, the first conductive paste is applied to a transfer jig including a groove, and the first conductive paste in the groove is transferred to a surface of the protrusion.

A mounting substrate on which at least any one of three kinds of electronic components including a first electronic component, a second electronic component, and a third electronic component are able to be mounted includes a pair of first edge portions and a pair of second edge portions. When a dimension of the first electronic component in its length direction is designated as L1, a dimension of the first electronic component in its width direction is designated as W1, a dimension of the second electronic component in its length direction is designated as L2, and a dimension of the second electronic component in its width direction is designated as W2, a dimension of the third electronic component in its width direction is any one of W1 and W2, and a dimension of the third electronic component in its length direction is L2 when the dimension of the third electronic component in its width direction is W1, and is L1 when the dimension of the third electronic component in its width direction is W2. At least one or more of the third electronic components are mounted on the mounting substrate.

A multi-layer ceramic capacitor includes a body. The body includes a capacitance forming unit, a cover, and a side margin. The capacitance forming unit includes ceramic layers laminated in a first direction and internal electrodes disposed between the ceramic layers. The cover covers the capacitance forming unit from the first direction. The side margin covers the capacitance forming unit from a second direction orthogonal to the first direction. The capacitance forming unit includes a surface layer portion adjacent to the cover. Ends of the internal electrodes in the second direction in the surface layer portion are curved toward the cover.

A multilayer capacitor includes a body including dielectric layers and first and second internal electrodes alternately disposed with dielectric layers interposed therebetween. First and second external electrodes are on the body and connected to the first and second internal electrodes, respectively. The first and second internal electrodes are plating layers. A manufacturing method of a multilayer capacitor includes preparing a plurality of laminated sheets including internal electrodes, dummy electrodes, and dielectric layers. The plurality of laminated sheets, and covers on and below the laminated sheets, are simultaneously stacked and then cured to prepare a cured product. The cured product is then diced depending on the size of the capacitor to prepare a body where the internal electrodes and the dummy electrodes are partially exposed. External electrodes are formed on external surfaces of the body using the dummy electrodes as seeds in a plating method.

In a method of manufacturing a laminated electronic component, in a step of obtaining a laminate, a position of a second green sheet with respect to a first green sheet is determined such that an overall width of a first portion printed on the first green sheet and a second portion printed on the second green sheet becomes substantially equal to a width of the first portion or a width of the second portion.

A mounting substrate on which at least any one of three kinds of electronic components including a first electronic component, a second electronic component, and a third electronic component are able to be mounted includes a pair of first edge portions and a pair of second edge portions. When a dimension of the first electronic component in its length direction is designated as L1, a dimension of the first electronic component in its width direction is designated as W1, a dimension of the second electronic component in its length direction is designated as L2, and a dimension of the second electronic component in its width direction is designated as W2, a dimension of the third electronic component in its width direction is any one of W1 and W2, and a dimension of the third electronic component in its length direction is L2 when the dimension of the third electronic component in its width direction is W1, and is L1 when the dimension of the third electronic component in its width direction is W2. At least one or more of the third electronic components are mounted on the mounting substrate.

One object is to improve the insulation reliability of a laminated ceramic capacitor. The body of a laminated ceramic capacitor according to one embodiment includes a first internal electrode layer, a second internal electrode layer, and a ceramic layer. The ceramic layer is disposed between the first internal electrode layer and the second internal electrode layer and contains crystal grains of ceramic material. The crystal grains each include a core portion and a shell portion covering the core portion. The shell portion includes one or more intra-shell pores.