An electronic device includes a packaging box, multiple connecting pins, and an electronic unit mounted to a base of the packaging box and including multiple wires. The base includes a wire holding platform having multiple spaced-apart insertion through holes. The connecting pins are mounted to the wire holding platform, and each have a first wire connecting portion mounted in a corresponding insertion through hole, having a first through hole and a first electrically connecting portion connected between the first wire connecting portion and a circuit board. Each of the wires has two electrically conductive portions, each of which is connected to the first wire connecting portion of a corresponding connecting pin.

A power semiconductor module includes an insulating circuit substrate; a printed circuit board disposed over the insulating circuit substrate; and a plurality of terminals each having a rod-shaped portion and including a first protrusion and a second protrusion each protruding laterally form a side face of the rod-shaped portion; wherein at least one of the plurality of terminals is inserted to one of the through-holes of the printed circuit board and is locked to the one of the through-holes via the first protrusion, and wherein at least another one of the plurality of terminals is inserted to another one of the through-holes of the printed circuit board and is locked to said another one of the through-holes via the second protrusion, and an end of the at least another one of the plurality of terminals is electrically connected to a conductive plate on the insulating circuit substrate.

A tolerance compensation element is for circuit configurations having a DCB (direct copper bonded) substrate and a PCB (printed circuit board). A circuit configuration further includes the tolerance compensation element. A tolerance compensation element is positioned in a targeted manner between the DCB substrate and PCB in a gap A for the contact-connection of components on the DCB substrate via additive manufacturing and is formed so as to close the gap.

The objective of the present invention is to provide an electronic control device with which it is possible to improve the flow of hot water, during molding, between openings through which connectors penetrate, in a case of an electronic control device, the size of which has increased as a result of an increase in the level of functionality of the electronic control device, while suppressing deformation of said case. There are at least three connectors. At least three openings through which the connectors are inserted are provided in one plane in a case. A printed circuit board is housed inside the case, and the connectors are electrically connected thereto. The third opening is disposed between the first opening and the second opening. The third opening is disposed in a position furthest from a center C of a plane, in the longitudinal direction of the case.

A power supply comprises a casing with a port; a main board placed in the casing and having a power conversion circuit; a sub-board electrically connected to the power conversion circuit and provided with at least one first connector; and a communication module. The power conversion circuit has at least one electrical connection terminal. A first interface of the first connector faces the port. The communication module comprises a first circuit board and a communication circuit disposed on the first circuit board, the first circuit board has an electrical connection part electrically connected to the communication circuit, the electrical connection part has a first state of connecting with the first interface so that the communication module and the power conversion circuit are electrically connected, and a second state of detaching from the first interface so that the communication module is separated from and electrically disconnected with the sub-board.

A housing includes a first chassis and a second chassis which are each formed of a metal sheet. Support projections integrally formed with support pieces formed in the first chassis are fitted into support holes of a circuit board on both left and right sides of a connector. A lower surface of the circuit board is supported by receiving portions formed in the support pieces, and part of the circuit board facing the connector is pressed downward by a pressing projection formed in the second chassis.

An element-accommodating package which can improve frequency characteristics of an element-accommodating package having a coaxial connector, and a mounting structure are provided. An element-accommodating package includes a metallic substrate, a frame, a first coaxial connector, a second coaxial connector, and a circuit board. A groove is provided between one side of the frame and a side surface of the circuit board and between a first signal line and a second signal line.

The present disclosure pertains to an arrangement comprising a housing, a circuit board arranged in the housing and at least one flat contact to connect the circuit board with an electrical component arranged outside of the housing, whereby the housing has a breakthrough that the flat contact protrudes from, whereby the circuit board has breakthrough that the flat contact reaches through, that the circuit board has a contact tab on the side facing away from the housing breakthrough and whereby a molded seal is inserted in the housing breakthrough and the molded seal positively encloses the flat contact and whereby the contact tab is connected with the flat contact in an electrically conductive manner.

A control unit device for a motor vehicle includes a circuit board, on which a plurality of electronic components are disposed. The electronic components are electrically coupled to one another by conductor tracks on the circuit board. A substantially gas-impermeable cover is materially joined or bonded to the circuit board in such a way that the cover, together with the circuit board, forms a closed cavity in which the electronic components and the associated conductor tracks are located. A method for producing the control unit device is also provided.

An electronic controller which includes a cover connected to a base plate, a housing, and a printed circuit board disposed in the housing. The base plate includes a press-fit inspection opening or aperture, and a cover is placed on the base plate over the opening, creating a seal path between the cover and the edge of the opening in the base plate. In one embodiment, there is a sealant, such as room temperature vulcanization (RTV) or heat cured sealant, dispensed on the sheet metal base plate around the perimeter of the opening, and the sealant is cured to prevent the formation of a leak path. Prior to the curing process, the cover is held in place by a pressure sensitive adhesive (PSA), as the sealant is cured. The controller is treated to a curing process to cure the sealant between the cover and the base plate.