Provided are a flexible organic-inorganic passivation film and a method of forming the same. The flexible organic-inorganic passivation film includes an organic-inorganic passivation film formed by alternately and repeatedly forming an organic film and an inorganic film on a substrate. The organic film is formed by stacking plasma-process generated material on a material layer thereunder. The plasma-process generated material is formed by plasma processing a hydrocarbon or a fluorocarbon.

A carbon nanotube field effect transistor (CNFET), that has a channel formed of carbon nanotubes (CNTs), includes a layered deposit of a nonstoichiometric doping oxide (NDO), such as HfO.sub.X, where the concentration of the NDO varies through the thickness of the layer(s). An n-type metal-oxide semiconductor (NMOS) CNFET made in this manner can achieve similar ON-current, OFF-current, and/or threshold voltage magnitudes to a corresponding p-type metal-oxide semiconductor (PMOS) CNFET. Such an NMOS and PMOS can be used to achieve a symmetric complementary metal-oxide semiconductor (CMOS) CNFET design.

A display device including a base member, a circuit layer, a display layer, a thin film encapsulation layer, and a touch sensor layer. The base member includes a first area and a second area disposed adjacent to the first area. The circuit layer is disposed on the base member to cover the first area and to expose the second area. The display layer is disposed on the circuit layer to display an image. The thin film encapsulation layer is disposed on the display layer. The touch sensor layer is disposed on the thin film encapsulation layer and includes an organic layer extending from an upper portion of the thin film encapsulation layer to cover at least a portion of the exposed second area.

A barrier film laminate (1) comprising an organic layer (4) that is situated in between two inorganic layers (2,3). The organic layer comprises submicron getter particles (5) at an amount between 0.01 and 0.9% by weight. The barrier film laminate can be used for encapsulating organic electronic devices such as OLEDs. The long term homogenous transparency makes this laminate in particular suited for protecting the light emitting side of an OLED.

A process for producing a viscous epoxy syrup from at least one liquid multifunctional epoxy, comprising the steps of: adding an initiator selected from the group consisting of electron-poor monoisocyanate, photoinitiator and thermal initiator to at least one liquid multifunctional epoxy; mixing the components; polymerizing the multifunctional epoxy such that the viscosity of the resulting epoxy syrup is at least twice as high, preferably at least four times as high and in particular at least ten times as high as the viscosity of the employed epoxy in the unreacted state
makes it possible to produce epoxy adhesives having pressure-sensitive properties.

The present invention relates to organic thin film sensors and the preparation and use thereof in sensing applications, and in particular in glucose sensing. The sensor is characterised by a layered structure comprising a porous wicking layer whose surface is configured to receive a liquid sample. An enzyme is disposed on or within the porous layer for facilitating the generation of a charge carrier from an analyte. A polymer layer in contact with the porous layer is connected to an ohmic conductor for applying a gate voltage to the polymer layer, the polymer layer being conductive to the charge carrier; and an organic semiconducting layer is connected to a source electrode and a drain electrode.

An encapsulating composition and an organic electronic device comprising the same, and the encapsulating composition which is capable of effectively blocking moisture or oxygen penetrating into the organic electronic device from the outside to secure the lifetime of the organic electronic device, implementing a top-emitting organic electronic device, being applied in an inkjet method, and providing a thin display.

The present application provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside, and has excellent spreadability, is applicable to thin organic electronic devices and has excellent hardness of the cured product after curing, without causing an inter-circuit interference problem.

The present disclosure relates to a method for manufacturing a printed electronic device using multi-passivation and the printed electronic device. The method for manufacturing a printed electronic device using multi-passivation includes printing a printed electronic device including a gate electrode, a dielectric layer, a semiconductor layer, a source electrode and a drain electrode; and printing a multi-passivation layer of a multi-layer structure for passivating the printed electronic device by using amorphous fluoropolymer.

A semiconductor device includes a substrate, a first electrode located on the substrate, a metal halide perovskite layer located on the first electrode, a second electrode located on the metal halide perovskite layer, and passivation molecules that passivate the metal halide perovskite layer. The metal halide perovskite layer has (1) a top surface defect located in a top surface and (2) an inter-grain defect located at an interface between two adjacent grains, and the passivation molecules passivate at least one of the top surface defect and the inter-grain defect.