H01G4/01

FILTER CIRCUIT AND MULTILAYERED FILTER DEVICE

A filter circuit includes a pair of balanced input ports, a pair of balanced output ports, and first and second resonators provided in parallel between the pair of balanced input ports and the pair of balanced output ports in a circuit configuration, the first and second resonators being magnetically coupled to each other. Between the first resonator and the second resonator, a capacitor is present but no inductor is present in the circuit configuration.

FILTER CIRCUIT AND MULTILAYERED FILTER DEVICE

A filter circuit includes a pair of balanced input ports, a pair of balanced output ports, and first and second resonators provided in parallel between the pair of balanced input ports and the pair of balanced output ports in a circuit configuration, the first and second resonators being magnetically coupled to each other. Between the first resonator and the second resonator, a capacitor is present but no inductor is present in the circuit configuration.

CAPACITOR STRUCTURE WITH VIA EMBEDDED IN POROUS MEDIUM
20230307185 · 2023-09-28 ·

A capacitor structure that includes a substrate; a conductive layer above the substrate; and a porous layer, above the conductive layer, having pores that extend perpendicularly from a top surface of the porous layer toward the conductive layer. The porous layer comprises a first region in which pores conductive wires are disposed, and a second region in which pores a metal-insulator-metal (MIM) structure is disposed. The first region may be used as a via to contact a bottom electrode of the capacitor structure.

CAPACITOR STRUCTURE WITH VIA EMBEDDED IN POROUS MEDIUM
20230307185 · 2023-09-28 ·

A capacitor structure that includes a substrate; a conductive layer above the substrate; and a porous layer, above the conductive layer, having pores that extend perpendicularly from a top surface of the porous layer toward the conductive layer. The porous layer comprises a first region in which pores conductive wires are disposed, and a second region in which pores a metal-insulator-metal (MIM) structure is disposed. The first region may be used as a via to contact a bottom electrode of the capacitor structure.

HYDROPHILIC COMPOSITIONS
20220002462 · 2022-01-06 ·

A process of forming a cross-linked electronically active hydrophilic co-polymer is provided and includes the steps of: a. mixing an intrinsically electronically active material and at least one compound of formula (I) with water to form an intermediate mixture; b. adding at least one hydrophilic monomer, at least one hydrophobic monomer, and at least one cross-linker to the intermediate mixture to form a co-monomer mixture; and c. polymerising the co-monomer mixture. Formula (I) is defined as:

##STR00001##

where R.sup.1 and R.sup.2 are independently optionally substituted C.sub.1-C.sub.6 alkyl and X.sup.− is an anion.

HYDROPHILIC COMPOSITIONS
20220002462 · 2022-01-06 ·

A process of forming a cross-linked electronically active hydrophilic co-polymer is provided and includes the steps of: a. mixing an intrinsically electronically active material and at least one compound of formula (I) with water to form an intermediate mixture; b. adding at least one hydrophilic monomer, at least one hydrophobic monomer, and at least one cross-linker to the intermediate mixture to form a co-monomer mixture; and c. polymerising the co-monomer mixture. Formula (I) is defined as:

##STR00001##

where R.sup.1 and R.sup.2 are independently optionally substituted C.sub.1-C.sub.6 alkyl and X.sup.− is an anion.

Hydrophilic compositions

A process of forming a cross-linked electronically active hydrophilic co-polymer is provided and includes the steps of: a. mixing an intrinsically electronically active material and at least one compound of formula (I) with water to form an intermediate mixture; b. adding at least one hydrophilic monomer, at least one hydrophobic monomer, and at least one cross-linker to the intermediate mixture to form a co-monomer mixture; and c. polymerising the co-monomer mixture. Formula (I) is defined as: ##STR00001##
where R.sup.1 and R.sup.2 are independently optionally substituted C.sub.1-C.sub.6 alkyl and X.sup.− is an anion.

Hydrophilic compositions

A process of forming a cross-linked electronically active hydrophilic co-polymer is provided and includes the steps of: a. mixing an intrinsically electronically active material and at least one compound of formula (I) with water to form an intermediate mixture; b. adding at least one hydrophilic monomer, at least one hydrophobic monomer, and at least one cross-linker to the intermediate mixture to form a co-monomer mixture; and c. polymerising the co-monomer mixture. Formula (I) is defined as: ##STR00001##
where R.sup.1 and R.sup.2 are independently optionally substituted C.sub.1-C.sub.6 alkyl and X.sup.− is an anion.

Multilayer ceramic capacitor and substrate including the same
11170938 · 2021-11-09 · ·

A multilayer ceramic capacitor includes a body including a dielectric layer, and first and second internal electrodes configured to be layered in a third direction with the dielectric layer interposed therebetween and having first and second connection portions, respectively, and including first, second, third, fourth, fifth and sixth surfaces; a first external electrode disposed on the fifth surface of the body; and a second external electrode disposed on the fifth surface of the body. The first internal electrode is exposed to the third surface and the fifth surface of the body through the first connection portion, and the second internal electrode is exposed to the fourth surface and the fifth surface of the body through the second connection portion.

Multilayer ceramic capacitor and substrate including the same
11170938 · 2021-11-09 · ·

A multilayer ceramic capacitor includes a body including a dielectric layer, and first and second internal electrodes configured to be layered in a third direction with the dielectric layer interposed therebetween and having first and second connection portions, respectively, and including first, second, third, fourth, fifth and sixth surfaces; a first external electrode disposed on the fifth surface of the body; and a second external electrode disposed on the fifth surface of the body. The first internal electrode is exposed to the third surface and the fifth surface of the body through the first connection portion, and the second internal electrode is exposed to the fourth surface and the fifth surface of the body through the second connection portion.