A multilayer electronic component according to another exemplary embodiment of the present disclosure may prevent penetration of moisture by disposing the sealing portions between an external electrode and a body, wherein the sealing portions includes a first sealing portion and a second sealing portion, and an average length of the second sealing portion is 20 μm or more.

A multilayer electronic component according to another exemplary embodiment of the present disclosure may prevent penetration of moisture by disposing the sealing portions between an external electrode and a body, wherein the sealing portions includes a first sealing portion and a second sealing portion, and an average length of the second sealing portion is 20 μm or more.

The high voltage feed-through capacitor comprises a feed-through capacitor unit, a resin coating the feed-through capacitor unit, and a bond structure between the feed-through capacitor unit and the resin. The feed-through capacitor unit includes an element body including first and second principal surfaces opposing each other, a first electrode on the first principal surface, a second electrode on the second principal surface, a through conductor electrically connected to the first electrode, and a terminal conductor electrically connected to the second electrode. The bond structure chemically bonds a first surface of the feed-through capacitor unit and a second surface of the resin.

The high voltage feed-through capacitor comprises a feed-through capacitor unit, a resin coating the feed-through capacitor unit, and a bond structure between the feed-through capacitor unit and the resin. The feed-through capacitor unit includes an element body including first and second principal surfaces opposing each other, a first electrode on the first principal surface, a second electrode on the second principal surface, a through conductor electrically connected to the first electrode, and a terminal conductor electrically connected to the second electrode. The bond structure chemically bonds a first surface of the feed-through capacitor unit and a second surface of the resin.

A multilayer electronic component includes a body including a dielectric layer and internal electrodes stacked in a first direction with the dielectric layer interposed therebetween and external electrodes including a first electrode layer connected to the internal electrodes and including Ni, and a second electrode layer disposed on the first electrode layer and including an Ni—Cu alloy. A Cu content of the second electrode layer is 70 mol to 90 mol compared to 100 mol of the total content of Ni and Cu of the second electrode layer.

A multilayer electronic component includes a body including a dielectric layer and internal electrodes stacked in a first direction with the dielectric layer interposed therebetween and external electrodes including a first electrode layer connected to the internal electrodes and including Ni, and a second electrode layer disposed on the first electrode layer and including an Ni—Cu alloy. A Cu content of the second electrode layer is 70 mol to 90 mol compared to 100 mol of the total content of Ni and Cu of the second electrode layer.

A ceramic electronic component includes: a body including dielectric layers and internal electrodes; and external electrodes disposed on the body and connected to the internal electrodes, in which the dielectric layers include a plurality of dielectric crystal grains, an average number of dielectric crystal grains per unit thickness (1 μm) of the dielectric layers is 8 or more, and td is 0.5 μm or less, td being an average thickness of at least one of the dielectric layers.

A ceramic electronic component includes: a body including dielectric layers and internal electrodes; and external electrodes disposed on the body and connected to the internal electrodes, in which the dielectric layers include a plurality of dielectric crystal grains, an average number of dielectric crystal grains per unit thickness (1 μm) of the dielectric layers is 8 or more, and td is 0.5 μm or less, td being an average thickness of at least one of the dielectric layers.

A multilayer ceramic capacitor includes a multilayer body including dielectric layers laminated on each other, inner electrode layers laminated on the dielectric layers, first and second main surfaces, first and second end surfaces, and first and second lateral surfaces, first and second external electrodes on the first and second end surfaces, an inner layer portion in which the inner electrode layers are opposed to each other, outer layer portions on first and second main surface sides and first and second lateral surface sides. Voids are provided in the outer layer portions on the first and second lateral surface sides. A ratio of a total area of the voids relative to an area of the outer layer portion on the first or second lateral surface side in a cross section of the multilayer body is greater than or equal to about 0.02% and less than or equal to about 0.2%.

A multilayer ceramic capacitor includes a multilayer body including dielectric layers laminated on each other, inner electrode layers laminated on the dielectric layers, first and second main surfaces, first and second end surfaces, and first and second lateral surfaces, first and second external electrodes on the first and second end surfaces, an inner layer portion in which the inner electrode layers are opposed to each other, outer layer portions on first and second main surface sides and first and second lateral surface sides. Voids are provided in the outer layer portions on the first and second lateral surface sides. A ratio of a total area of the voids relative to an area of the outer layer portion on the first or second lateral surface side in a cross section of the multilayer body is greater than or equal to about 0.02% and less than or equal to about 0.2%.