The present disclosure provides a coiled capacitor comprising a coil formed by a flexible multilayered tape, and a first terminating electrode and a second terminating electrode which are located on butts of the coil. The flexible multilayered tape contains the following sequence of layers: first metal layer, a layer of a plastic, second metal layer, a layer of energy storage material. The first metal layer forms ohmic contact with the first terminating electrode and the second metal layer forms ohmic contact with the second terminating electrode. The energy storage material comprises material selected from the list comprising rylene fragments, doped oligoaniline and p-oligo-phenylene, supramolecular structures, colloidal composite with dispersion (suspension) of electro-conductive anisometric particles in an insulator matrix, material comprises a surfactant.

The present disclosure provides a coiled capacitor comprising a coil formed by a flexible multilayered tape, and a first terminating electrode and a second terminating electrode which are located on butts of the coil. The flexible multilayered tape contains the following sequence of layers: first metal layer, a layer of a plastic, second metal layer, a layer of energy storage material. The first metal layer forms ohmic contact with the first terminating electrode and the second metal layer forms ohmic contact with the second terminating electrode. The energy storage material comprises material selected from the list comprising rylene fragments, doped oligoaniline and p-oligo-phenylene, supramolecular structures, colloidal composite with dispersion (suspension) of electro-conductive anisometric particles in an insulator matrix, material comprises a surfactant.

A self-healing metal structure is provided for transferring heat between an electronics component and a substrate. The self-healing metal structure includes a base metal structural component. A phase change material is provided adjacent at least a portion of the base metal structural component. A protective component at least partially encapsulates the phase change material. Upon the presence of a spatial defect in the base metal structural component, the phase change material reacts with the base structural component to form an intermetallic compound to at least partially occupy the spatial defect. The phase change material at least partially encapsulated with the protective component may be disposed within the base metal structural component as a plurality of separate capsules incorporated therein, or the phase change material at least partially surrounds the base metal structural component.

A film capacitor that includes first and second dielectric films, first and second inner electrodes, and first and second outer electrodes. The first inner electrode includes a first connection portion, a first main electrode portion joined to the first connection portion and thinner than the first connection portion, and a first thin portion extending from the first main electrode portion and thinner than the first main electrode portion. The second inner electrode includes a second connection portion and a second main electrode portion joined to the second connection portion and thinner than the second connection portion. The first main electrode portion opposes the second main electrode portion across the first dielectric film. The second connection portion includes a reduction region having a thickness that decreases from the second connection portion toward the second main electrode portion. The first thin portion opposes the reduction region across the first dielectric film.

A metalized film includes a dielectric film having a strip-shape, and a metal vapor-deposited electrode. An insulation margin is provided on a first end portion located at one end in a width direction of the dielectric film. A plurality of first slits each extending in a longitudinal direction of the dielectric film and a plurality of fuses are provided close to a second end portion located at an other end in the width direction. The metal vapor-deposited electrode includes a plurality of divided electrodes separated by a corresponding one of a plurality of second slits. Each of the plurality of second slits extends from the insulation margin to a corresponding one of the plurality of first slits. When the metalized film is cut along a cutting line extending in the width direction, at least two divided electrodes among the plurality of divided electrodes are respectively cut at the cutting line.

A metalized film includes a dielectric film having a strip-shape, and a metal vapor-deposited electrode. An insulation margin is provided on a first end portion located at one end in a width direction of the dielectric film. A plurality of first slits each extending in a longitudinal direction of the dielectric film and a plurality of fuses are provided close to a second end portion located at an other end in the width direction. The metal vapor-deposited electrode includes a plurality of divided electrodes separated by a corresponding one of a plurality of second slits. Each of the plurality of second slits extends from the insulation margin to a corresponding one of the plurality of first slits. When the metalized film is cut along a cutting line extending in the width direction, at least two divided electrodes among the plurality of divided electrodes are respectively cut at the cutting line.

A film capacitor including a first dielectric film, a second dielectric film, a first internal electrode, a second internal electrode, a first external electrode, and a second external electrode. The first internal electrode includes a first connection portion, a first main electrode portion contiguous with the first connection portion and thinner than the first connection portion, and a first thin film portion extending from the first main electrode portion and thinner than the first main electrode portion. The second internal electrode includes a second connection portion and a second main electrode portion contiguous with the second connection portion and thinner than the second connection portion. The first main electrode portion opposes the second main electrode portion with the first dielectric film interposed therebetween and does not oppose the second connection portion, and the first thin film portion opposes the second connection portion with the first dielectric film interposed therebetween.

A chip capacitor and a method for manufacturing the chip capacitor, where the chip capacitor includes a substrate, a first external electrode disposed on the substrate, a second external electrode disposed on the substrate, capacitor elements formed on the substrate and connected between the first external electrode and the second external electrode, and fuses that are formed on the substrate, are each interposed between the capacitor elements and the first external electrode or the second external electrode, and are capable of disconnecting each of the capacitor elements.

A chip capacitor and a method for manufacturing the chip capacitor, where the chip capacitor includes a substrate, a first external electrode disposed on the substrate, a second external electrode disposed on the substrate, capacitor elements formed on the substrate and connected between the first external electrode and the second external electrode, and fuses that are formed on the substrate, are each interposed between the capacitor elements and the first external electrode or the second external electrode, and are capable of disconnecting each of the capacitor elements.

The present disclosure provides a coiled capacitor comprising a coil formed by a flexible multilayered tape, and a first terminating electrode and a second terminating electrode which are located on butts of the coil. The flexible multilayered tape contains the following sequence of layers: first metal layer, a layer of a plastic, second metal layer, a layer of energy storage material. The first metal layer forms ohmic contact with the first terminating electrode and the second metal layer forms ohmic contact with the second terminating electrode. The energy storage material comprises material selected from the list comprising rylene fragments, doped oligoaniline and p-oligo-phenylene, supramolecular structures, colloidal composite with dispersion (suspension) of electro-conductive anisometric particles in an insulator matrix, material comprises a surfactant.