A film capacitor includes a stacked body formed by stacking metalized films in each of which a metal electrode is formed on a surface of a dielectric film, at least one of the dielectric films containing a high thermal conductive filler; and external electrodes formed at electrode forming ends provided at opposed positions in the stacked body. The stacked body includes a high thermal conductive portion in which a content of the high thermal conductive filler in the at least one dielectric film is relatively high, and a low thermal conductive portion in which the content of the high thermal conductive filler in the at least one dielectric film is relatively low, or the high thermal conductive filler is not contained. The high thermal conductive portion is provided to continuously extend from an inside of the stacked body to a side portion other than the electrode forming ends.

A dielectric material is provided. The dielectric material includes at least one layer of a substantially continuous phase material. The material is selected from the group consisting of an organic, organometallic, or combination thereof in which the substantially continuous phase material has delocalized electrons.

A resin composition including a 4-methyl-1-pentene copolymer (A) that satisfies particular requirements and a 4-methyl-1-pentene copolymer (B) that satisfies particular requirements, in which the content of the copolymer (A) is 10 to 95 parts by mass and the content of the copolymer (B) is 90 to 5 parts by mass with respect to 100 parts by mass of the total content of the copolymers (A) and (B).

The invention relates to an energy storage device (21) comprising a substrate with a groove (3) having a first and a second face (9a, 9b). A capacitor material (5) in the groove (3), the capacitor material having an upper surface (25). The first and the second face (9a, 9b) of the groove (3) each having a coat of electrically conductive material (7) wherein the coats of electrically conductive materials (7) on the first and second faces (9a, 9b) are electrically separated. And wherein, a non-insulating element (23) is configured to be electrically contactable with the upper surface (25) of the capacitor material and when in electrical contact is electrically separated from the coats of electrically conductive materials (7) on the first and second surfaces by the capacitor material (9a, 9b).

There is provided a resin composition that can greatly improve voltage endurance while ensuring high capacitance and excellent circuit adhesion, when used as the dielectric layer of a capacitor. This resin composition includes a binder component including bisphenol S, an epoxy resin curing agent having a phenolic hydroxyl group, and an epoxy resin; and a dielectric filler.

To provide a thin film capacitor having high adhesion performance with respect to a multilayer substrate. A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the dielectric film without contacting the metal foil. A height of the first electrode layer is lower than a height of the second electrode layer. This enhances adhesion performance when the thin film capacitor is embedded in a multilayer substrate and improves ESR characteristics.

A block copolymer forms a dielectric film with isolated polarizable domains. The block copolymer is a molecule selected to have an ionically functionalized end. The ionically functionalized end is selected to be less soluble in a solvent than another portion of the polymer such that, when a plurality of the block copolymer molecules are dissolved in the solvent, the first ends of the plurality of block copolymers interact with each other and aggregate to form isolated polarizable domains. The block copolymer forms an electrically isolating shell about a core comprised of the ionically functionalized ends. One or more additives may be disposed selectively within the core to increase the dielectric constant of the dielectric film.

Methods of processing a capacitor device with high energy density and high extraction efficiency based on sol-gel films. The films can be formed by use of a single precursor, including siloxane precursors bearing a polar group on a flexible tethering group. The sol-gel compositions used in the formation of films can have high dielectric permittivity, low dielectric loss, high breakdown strength and high-energy storage properties. The methods can be well suited for both high energy density and high power density to provide enhanced energy storage capabilities for discrete, embedded or on-chip integrated capacitor applications, gate dielectrics for transistors and displays, capacitive touch screens, light weight mobile defibrillators, filters for cellular devices, electric propulsion, electric vehicles, power invertors for microgrid storage, load leveling of transients on a wide range of timescales for medium voltage electric grids.

To provide a thin film capacitor in which peeling-off of an electrode layer is less likely to occur. A thin film capacitor includes a metal foil having a roughened upper surface, a dielectric film covering the upper surface of the metal foil and having an opening for partly exposing the metal foil therethrough, a first electrode layer contacting the metal foil through the opening and further contacting the dielectric film, and a second electrode layer contacting the dielectric film without contacting the metal foil. With this configuration, both the first and second electrode layers can be disposed on the upper surface of the metal foil. In addition, the first electrode layer contacts not only the metal foil but also the dielectric film, making peeling of the first electrode layer less likely to occur.

To provide a thin film capacitor having high adhesion with respect to a circuit substrate. A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the dielectric film without contacting the metal foil. An angle θa formed by the other main surface of the metal foil and a side surface thereof is more than 20° and less than 80°. The side surface is thus tapered at an angle of more than 20° and less than 80°, so that it is possible to suppress warpage and to enhance adhesion with respect to a multilayer substrate when the thin film capacitor is embedded in the multilayer substrate.