A multilayer ceramic capacitor includes a multilayer body including dielectric layers which are stacked and internal electrode layers which are stacked, and external electrodes, each connected to the internal electrode layers. The external electrodes each include a conductive resin layer and a plated layer on the conductive resin layer. The conductive resin layer includes a resin portion, conductive fillers dispersed in the resin portion, and metal particles dispersed unevenly in a distribution differing from that of the conductive fillers in the conductive resin layer. An abundance ratio of the metal particles to the resin portion is higher on a side of the plated layer of the conductive resin layer than on a side of the conductive resin layer close to the multilayer body.

A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and first internal electrodes and second internal electrodes disposed to face each other and alternately stacked with the respective dielectric layers interposed therebetween; a first external electrode connected to the first internal electrodes; a second external electrode connected to the second internal electrodes; and a protective layer disposed on the ceramic body, the first external electrode, and the second external electrode, wherein the protective layer includes an adhesion assisting layer and a coating layer.

A multilayer ceramic capacitor may include: a ceramic body including a plurality of dielectric layers; first and second internal electrodes disposed in the ceramic body, the first internal electrode having first and second lead portions exposed to a first surface of the ceramic body in a width direction, and the second internal electrode having a third lead portion exposed to the first surface of the ceramic body in the width direction; first to third external electrodes disposed on the first surface of the ceramic body in the width direction to be connected to the first to third lead portions, respectively; and an insulation layer disposed on the first surface of the ceramic body in the width direction. Each of the first and second lead portions may be spaced apart from the third lead portion by a predetermined distance.

A multilayer ceramic capacitor may include: a ceramic body including a plurality of dielectric layers; first and second internal electrodes disposed in the ceramic body, the first internal electrode having first and second lead portions exposed to a first surface of the ceramic body in a width direction, and the second internal electrode having a third lead portion exposed to the first surface of the ceramic body in the width direction; first to third external electrodes disposed on the first surface of the ceramic body in the width direction to be connected to the first to third lead portions, respectively; and an insulation layer disposed on the first surface of the ceramic body in the width direction. Each of the first and second lead portions may be spaced apart from the third lead portion by a predetermined distance.

In a multilayer capacitor, a multilayer capacitor main body includes first and second main surfaces, first and second side surfaces, and first and second end surfaces, the first and second main surfaces extending in a length direction and a width direction, the first and second side surfaces extending in the length direction and a thickness direction, and the first and second end surfaces extending in the width direction and the thickness direction. The second main surface is depressed in a portion extending from opposite ends of the second main surface toward a center of the second main surface in the length direction.

In a multilayer capacitor, a multilayer capacitor main body includes first and second main surfaces, first and second side surfaces, and first and second end surfaces, the first and second main surfaces extending in a length direction and a width direction, the first and second side surfaces extending in the length direction and a thickness direction, and the first and second end surfaces extending in the width direction and the thickness direction. The second main surface is depressed in a portion extending from opposite ends of the second main surface toward a center of the second main surface in the length direction.

The capacitor includes a dielectric body portion including ceramic layers and internal-electrode layers laminated in an alternating manner, and a cover portion provided in a periphery of the dielectric body portion. The cover portion includes pores. A part of the cover portion located in a position in a direction perpendicular to a lamination direction of the ceramic layers and the internal-electrode layers is a side surface cover portion. When the side surface cover portion is divided into three equal regions in a width direction, the regions being a dielectric body portion-side region, a central region, and a surface-side region, the number of the pores is higher in the dielectric body portion-side region than in the central region and the surface-side region.

A film capacitor that includes first and second dielectric films, first and second inner electrodes, and first and second outer electrodes. The first inner electrode includes a first connection portion, a first main electrode portion joined to the first connection portion and thinner than the first connection portion, and a first thin portion extending from the first main electrode portion and thinner than the first main electrode portion. The second inner electrode includes a second connection portion and a second main electrode portion joined to the second connection portion and thinner than the second connection portion. The first main electrode portion opposes the second main electrode portion across the first dielectric film. The second connection portion includes a reduction region having a thickness that decreases from the second connection portion toward the second main electrode portion. The first thin portion opposes the reduction region across the first dielectric film.

A metal capacitor provided includes a first metal layer and a second metal layer disposed above a substrate. The first metal layer includes a first electrode sheet and a second electrode sheet, and the second metal layer includes a third electrode sheet and a fourth electrode sheet. The first electrode sheet and the second electrode sheet collectively form a first coplanar capacitor. The third electrode sheet and the fourth electrode sheet collectively form a second coplanar capacitor. At least a portion of the fourth electrode sheet is arranged above the first electrode sheet, and the first electrode sheet and the fourth electrode sheet collectively form a first vertical capacitor. At least a portion of the third electrode sheet is arranged above the second electrode sheet, and the second electrode sheet and the third electrode sheet collectively form a second vertical capacitor.

A metal capacitor provided includes a first metal layer and a second metal layer disposed above a substrate. The first metal layer includes a first electrode sheet and a second electrode sheet, and the second metal layer includes a third electrode sheet and a fourth electrode sheet. The first electrode sheet and the second electrode sheet collectively form a first coplanar capacitor. The third electrode sheet and the fourth electrode sheet collectively form a second coplanar capacitor. At least a portion of the fourth electrode sheet is arranged above the first electrode sheet, and the first electrode sheet and the fourth electrode sheet collectively form a first vertical capacitor. At least a portion of the third electrode sheet is arranged above the second electrode sheet, and the second electrode sheet and the third electrode sheet collectively form a second vertical capacitor.