A film capacitor 1 that includes: a capacitor element including a metallized film with a resin film and a metal layer on a surface of the resin film; an outer case that houses the capacitor element; and a filling resin that fills a space between the capacitor element and the outer case, wherein the outer case includes a resin composition that contains a liquid crystal polymer and an inorganic filler, and an amount of exposure of the inorganic filler from an outer surface of the outer case is 5% to 90%.

A film capacitor 1 that includes: a capacitor element including a metallized film with a resin film and a metal layer on a surface of the resin film; an outer case that houses the capacitor element; and a filling resin that fills a space between the capacitor element and the outer case, wherein the outer case includes a resin composition that contains a liquid crystal polymer and an inorganic filler, and an amount of exposure of the inorganic filler from an outer surface of the outer case is 5% to 90%.

A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes disposed with the dielectric layer interposed therebetween and disposed in point-symmetry with each other; first and second connection electrodes penetrating the body in a direction perpendicular to the dielectric layer and connected to the first internal electrode; third and fourth connection electrodes penetrating the body in a direction perpendicular to the dielectric layer and connected to the second internal electrode; first and second external electrodes disposed on both surfaces of the body and connected to the first and second connection electrodes; and third and fourth external electrodes spaced apart from the first and second external electrodes and connected to the third and fourth connection electrodes, and the first and second internal electrodes include a region in which an electrode is not disposed.

A multilayer ceramic electronic component includes an element body, a via-hole electrode, and a terminal electrode. The element body includes internal electrode layers and insulation layers alternately laminated in a lamination direction. The via-hole electrode penetrates from an upper surface of the element body thereinto and is connected with at least one of the internal electrode layers. The terminal electrode is formed on the upper surface of the element body and connected with the via-hole electrode. The via-hole electrode is embedded in a via hole formed on the element body so that a predetermined clearance space is formed in the via hole.

A multilayer ceramic electronic component includes an element body, a via-hole electrode, and a terminal electrode. The element body includes internal electrode layers and insulation layers alternately laminated in a lamination direction. The via-hole electrode penetrates from an upper surface of the element body thereinto and is connected with at least one of the internal electrode layers. The terminal electrode is formed on the upper surface of the element body and connected with the via-hole electrode. The via-hole electrode is embedded in a via hole formed on the element body so that a predetermined clearance space is formed in the via hole.

A capacitor unit formed by a capacitor integrated structure is provided. The capacitor integrated structure is cut to form capacitor units separated from each other, and each of the capacitor units includes: a substrate; an isolation layer located on the substrate; a capacitor stacked structure located on the isolation layer, wherein the isolation layer electrically isolates the substrate from the capacitor stacked structure; and two electrode connectors located on the capacitor stacked structure and being exposed.

A box-shaped inner case (3) is accommodated in a box-shaped outer case (2), and refrigerant flow passages (27) are formed at five surfaces except opening surfaces (14, 24) by gaps between the inner and outer cases. A Gap of an opening edge of the outer case (2) and an opening edge of the inner case (3) is covered with a frame-shaped cover (6), A capacitor element (4) formed from a film capacitor is placed in the inner case (3), and the inner case (3) is filled with potting material (5) having thermal conductivity so that the capacitor element (4) except the terminals (4a, 4b) is embedded. Cooling water flows along a longitudinal direction of the outer case (2) with one of refrigerant pipe connecters (15) being a refrigerant inlet and the other of the refrigerant pipe connecters (15) being a refrigerant outlet.

A ceramic electronic component of the present invention includes: a ceramic element body; a terminal electrode formed on from an end surface to a side surface of the ceramic element body; and a lead terminal joined to the terminal electrode by a solder. A fillet of the solder is formed between the terminal electrode of a side surface at the ceramic element body and the lead terminal, and a coating layer is formed on a surface of the lead terminal that is in contact with the solder. The coating layer is formed of a metal component having a contact angle with the solder smaller than that of the lead terminal.

A ceramic electronic component of the present invention includes: a ceramic element body; a terminal electrode formed on from an end surface to a side surface of the ceramic element body; and a lead terminal joined to the terminal electrode by a solder. A fillet of the solder is formed between the terminal electrode of a side surface at the ceramic element body and the lead terminal, and a coating layer is formed on a surface of the lead terminal that is in contact with the solder. The coating layer is formed of a metal component having a contact angle with the solder smaller than that of the lead terminal.

A capacitor includes: a capacitor element; a pair of external electrodes provided at opposite ends of the capacitor element; and a pair of metal caps and or a metal foil, the pair of metal caps each covering a corresponding one of the pair of external electrodes, the metal foil covering at least part of the capacitor element.