A power electronics system has a housing, a cooling device, a power semiconductor module and a capacitor device, wherein a cooling section of a capacitor connection device is in thermally conducting contact with a cooling surface of the cooling device.

An apparatus suitable for use in an air-conditioning system and configured to provide a plurality of selectable capacitance values includes a plurality of capacitive devices and a pressure interrupter cover assembly. Each of the capacitive devices has a first capacitor terminal and a second capacitor terminal. The pressure interrupter cover assembly includes a deformable cover, a set of capacitor cover terminals, a common cover terminal, and a set of insulation structures. The apparatus also includes a conductor configured to electrically connect the second capacitor terminal of at least one of the capacitive devices to the common cover terminal.

An apparatus suitable for use in an air-conditioning system and configured to provide a plurality of selectable capacitance values includes a plurality of capacitive devices and a pressure interrupter cover assembly. Each of the capacitive devices has a first capacitor terminal and a second capacitor terminal. The pressure interrupter cover assembly includes a deformable cover, a set of capacitor cover terminals, a common cover terminal, and a set of insulation structures. The apparatus also includes a conductor configured to electrically connect the second capacitor terminal of at least one of the capacitive devices to the common cover terminal.

A multilayer ceramic capacitor (MLCC) includes: a ceramic body having a plurality of dielectric layers, first internal electrodes, and second internal electrodes; and a first external electrode and a second external electrode, disposed on an exterior of the ceramic body. A plurality of via electrodes are disposed in the ceramic body; a first via electrode connects the first internal electrodes to the first external electrode; a second via electrode connects the second internal electrodes to the second external electrode; and the plurality of via electrodes have a stepped shape, and a distance in a length direction from a first vertical edge of each step to a second vertical edge of each step in the plurality of via electrodes is increased in a direction from the substrate toward an upper portion of the ceramic body.

A multilayer ceramic capacitor (MLCC) includes: a ceramic body having a plurality of dielectric layers, first internal electrodes, and second internal electrodes; and a first external electrode and a second external electrode, disposed on an exterior of the ceramic body. A plurality of via electrodes are disposed in the ceramic body; a first via electrode connects the first internal electrodes to the first external electrode; a second via electrode connects the second internal electrodes to the second external electrode; and the plurality of via electrodes have a stepped shape, and a distance in a length direction from a first vertical edge of each step to a second vertical edge of each step in the plurality of via electrodes is increased in a direction from the substrate toward an upper portion of the ceramic body.

A method of assembling a capacitor assembly comprises positioning a plurality of capacitors in respective sockets formed in a non-conductive matrix by vibrating the plurality of capacitors and disposing the array of capacitors and the non-conductive matrix between a positive terminal plate and a negative terminal plate. The capacitors are electrically coupled with the positive terminal plate and the negative terminal plate and mechanically secured between the positive terminal plate and the negative terminal plate. The array of capacitors includes a void cooperating with a first opening in the positive plate and a second opening in the negative plate to form a passage. The void includes a location where at least one capacitor is omitted from the array.

The present disclosure provides a film capacitor, including: a plurality of capacitor cores, including: a first group of capacitor cores connected in parallel, having first and second end surfaces; and a second group of capacitor cores connected in parallel, connected with the first group of capacitor cores in series, having a third end surface opposite to the first end surface of the first group of capacitor cores and a fourth end surface; a positive electrode busbar, connected to the first end surface; a negative electrode busbar, connected to the third end surface; an intermediate busbar, connected to the second end surface and the fourth end surface respectively; a first connection sheet connected to the positive electrode busbar; a second connection sheet connected to the negative electrode busbar; and a third connection sheet connected to the intermediate busbar.

The present disclosure provides a film capacitor, including: a plurality of capacitor cores, including: a first group of capacitor cores connected in parallel, having first and second end surfaces; and a second group of capacitor cores connected in parallel, connected with the first group of capacitor cores in series, having a third end surface opposite to the first end surface of the first group of capacitor cores and a fourth end surface; a positive electrode busbar, connected to the first end surface; a negative electrode busbar, connected to the third end surface; an intermediate busbar, connected to the second end surface and the fourth end surface respectively; a first connection sheet connected to the positive electrode busbar; a second connection sheet connected to the negative electrode busbar; and a third connection sheet connected to the intermediate busbar.

A capacitor unit and a manufacturing method thereof are provided. The manufacturing method includes the following steps. An isolation layer is formed on a substrate. A first capacitor stacked structure and a second capacitor stacked structure are formed on the isolation layer. Electrode connectors are formed on the first capacitor stacked structure and the second capacitor stacked structure. The electrode connectors are exposed, so that the electrode connectors, the first capacitor stacked structure, the second capacitor stacked structure, the isolation layer, and the substrate are combined to form a capacitor integrated structure, wherein the isolation layer electrically isolates the substrate from the first capacitor stacked structure and the second capacitor stacked structure. The capacitor integrated structure is cut to form a first capacitor unit and a second capacitor unit separated from each other.

A hermetic feedthrough terminal pin connector for an active implantable medical device (AIMD) includes an electrical insulator hermetically sealed to an opening of an electrically conductive ferrule. A feedthrough terminal pin is hermetically sealed to and disposed through the insulator, the feedthrough terminal pin extending outwardly beyond the insulator on the inside of the casing of the AIMD. A circuit board is disposed on the inside of the casing of the AIMD. A terminal pin connector includes: an electrically conductive connector housing disposed on the circuit board, wherein the connector housing is electrically connected to at least one electrical circuit disposed on the circuit board; and at least one electrically conductive prong supported by the connector housing, the at least one prong contacting and compressed against the feedthrough terminal pin, the at least one prong making a removable electrical connection.