A multilayer ceramic capacitor includes a body including first and second internal electrodes laminated with a respective dielectric layer interposed therebetween, and having fifth and sixth surfaces opposing each other, third and fourth surfaces opposing each other, and first and second surfaces opposing each other. A first through-electrode penetrates through the body to be connected to the first internal electrode, a second through-electrode penetrates through the body to be connected to the second internal electrode, first and second external electrodes are disposed on the first and second surfaces, respectively, and third and fourth external electrodes are disposed on the first and second surfaces, respectively, to be spaced apart from the first and second external electrodes. Each of the first and second through-electrodes has a taper.

A multilayer ceramic capacitor includes a body including first and second internal electrodes laminated with a respective dielectric layer interposed therebetween, and having fifth and sixth surfaces opposing each other, third and fourth surfaces opposing each other, and first and second surfaces opposing each other. A first through-electrode penetrates through the body to be connected to the first internal electrode, a second through-electrode penetrates through the body to be connected to the second internal electrode, first and second external electrodes are disposed on the first and second surfaces, respectively, and third and fourth external electrodes are disposed on the first and second surfaces, respectively, to be spaced apart from the first and second external electrodes. Each of the first and second through-electrodes has a taper.

A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes disposed with the dielectric layer interposed therebetween in a stacking direction, and including a first surface and a second surface opposing each other in the stacking direction, a first through electrode penetrating the body and connected to the first internal electrode; a second through electrode penetrating the body and connected to the second internal electrode, first and second external electrodes disposed on the first surface and the second surface, respectively, and connected to the first through electrode, third and fourth external electrodes spaced apart from the first and second external electrodes and connected to the second through electrode, and an identifier disposed on the first surface or the second surface of the body, and the first and second through electrodes protrude from the first surface of the body.

A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes disposed with the dielectric layer interposed therebetween and disposed in point-symmetry with each other; first and second connection electrodes penetrating the body in a direction perpendicular to the dielectric layer and connected to the first internal electrode; third and fourth connection electrodes penetrating the body in a direction perpendicular to the dielectric layer and connected to the second internal electrode; first and second external electrodes disposed on both surfaces of the body and connected to the first and second connection electrodes; and third and fourth external electrodes spaced apart from the first and second external electrodes and connected to the third and fourth connection electrodes, and the first and second internal electrodes include a region in which an electrode is not disposed.

A high power radiofrequency (RF) capacitor, integrated circuit board/capacitor and methods for manufacture therefor can include a dielectric substrate, and a first metallic layer and a second metallic layer that can be deposited on opposite sides of the dielectric substrate, and a ground plane that can be co-planar with one of the metallic layers. This can establish a broadside coupling capacitance effect between the first metallic layer and the second metallic layer. The first metallic layer and the second metallic layer can have a circular profile when viewed in plan view; alternatively, the first metallic layer and second metallic layer can have a T-shaped profile when viewed in plan view. The desired profile and the desired profile geometry can depend on the design power and operating frequency for the capacitor can depend on whether the capacitor must operate as a series capacitor or a shunt capacitor.

In electronic devices, as a result of miniaturization, the distance between a mounting board and an upper board or a shield case and the like, or the distance between the mounting board and other electronic components mounted adjacent thereto has become smaller. An electronic component is provided with: an element body internally containing a circuit element; and a terminal formed on the element body. The terminal is formed over an end surface of the element body and a surface adjacent to the end surface. An insulating film covering the terminal is formed on the element body. The terminal is exposed from the insulating film at least at a mounting surface of the element body, and a plating film containing tin is formed on a portion of the terminal exposed from the insulating film.

In electronic devices, as a result of miniaturization, the distance between a mounting board and an upper board or a shield case and the like, or the distance between the mounting board and other electronic components mounted adjacent thereto has become smaller. An electronic component is provided with: an element body internally containing a circuit element; and a terminal formed on the element body. The terminal is formed over an end surface of the element body and a surface adjacent to the end surface. An insulating film covering the terminal is formed on the element body. The terminal is exposed from the insulating film at least at a mounting surface of the element body, and a plating film containing tin is formed on a portion of the terminal exposed from the insulating film.

A multilayer ceramic capacitor includes a multilayer body which includes stacked dielectric layers, first and second principal surfaces facing each other, first and second end surfaces facing each other, first inner electrode layers alternately stacked with the dielectric layers and exposed on the first end surface, second inner electrode layers alternately stacked with the dielectric layers and exposed on the second end surface, a first outer electrode connected to the first inner electrode layers and disposed on the first end surface, and a second outer electrode connected to the second inner electrode layers and disposed on the second end surface.

A multilayer ceramic capacitor includes a multilayer body which includes stacked dielectric layers, first and second principal surfaces facing each other, first and second end surfaces facing each other, first inner electrode layers alternately stacked with the dielectric layers and exposed on the first end surface, second inner electrode layers alternately stacked with the dielectric layers and exposed on the second end surface, a first outer electrode connected to the first inner electrode layers and disposed on the first end surface, and a second outer electrode connected to the second inner electrode layers and disposed on the second end surface.

An electronic component that includes a substrate having a first main surface and a second main surface, an element on the first main surface of the substrate, a first contact electrode electrically connected to the element, an insulating film defining a first opening at a position that has an overlap with the first contact electrode in the plan view of the first main surface, a protective film covering the insulating film in a region including at least a part of the periphery of the first opening, and a first external electrode electrically connected to the first contact electrode and extending over the protective film.