An electronic component includes an element body and outer electrodes on the element body. The element body includes top and bottom opposed surfaces, and side surfaces connecting the top and bottom surfaces. An outer electrode includes a lower layer electrode on the top surface and the bottom surface, and an upper layer electrode overlying the lower layer electrode and extending from an upper side of the lower electrode onto the side surface. When viewed from a direction orthogonal to the top and bottom surfaces, an edge of the lower layer electrode is disposed at a position farther from the side surface at which the upper layer electrode is provided than a position of an edge of the upper layer electrode, and a radius of curvature of the edge of the lower electrode is larger than a radius of curvature of the edge of the upper layer electrode.

An electronic component includes an element body and outer electrodes on the element body. The element body includes top and bottom opposed surfaces, and side surfaces connecting the top and bottom surfaces. An outer electrode includes a lower layer electrode on the top surface and the bottom surface, and an upper layer electrode overlying the lower layer electrode and extending from an upper side of the lower electrode onto the side surface. When viewed from a direction orthogonal to the top and bottom surfaces, an edge of the lower layer electrode is disposed at a position farther from the side surface at which the upper layer electrode is provided than a position of an edge of the upper layer electrode, and a radius of curvature of the edge of the lower electrode is larger than a radius of curvature of the edge of the upper layer electrode.

A multilayer electronic component includes a body, a protrusion disposed on at least one surface of the body, and an external electrode having an electrode layer disposed on a side surface of the body and extending to be in contact with a side surface of the protrusion and a conductive resin layer disposed on the electrode layer and extending to cover a portion of the protrusion.

A chip electronic component includes spacers that each have a predetermined thickness direction dimension on a mounting surface in a direction perpendicular to the mounting surface. The spacers each contain, as a main component, an intermetallic compound containing at least one high-melting-point metal selected from Cu and Ni, and Sn defining a low-melting-point metal.

A chip component includes a substrate that has a first surface and a second surface on a side opposite to the first surface, a plurality of wall portions that are formed on a side of the first surface by using a part of the substrate, that have one end portion and one other end portion, and that are formed of a plurality of pillar units, a support portion that is formed around the wall portions by using a part of the substrate and that is connected to at least one of the end portion and the other end portion of the wall portions, and a capacitor portion formed by following a surface of the wall portion, in which each of the pillar units includes a central portion and three convex portions that extend from the central portion in three mutually different directions in a plan view and in which the wall portion is formed by a connection between the convex portions of the pillar units that adjoin each other.

A chip component includes a substrate that has a first surface and a second surface on a side opposite to the first surface, a plurality of wall portions that are formed on a side of the first surface by using a part of the substrate, that have one end portion and one other end portion, and that are formed of a plurality of pillar units, a support portion that is formed around the wall portions by using a part of the substrate and that is connected to at least one of the end portion and the other end portion of the wall portions, and a capacitor portion formed by following a surface of the wall portion, in which each of the pillar units includes a central portion and three convex portions that extend from the central portion in three mutually different directions in a plan view and in which the wall portion is formed by a connection between the convex portions of the pillar units that adjoin each other.

The present invention relates to a ceramic material for a multilayer capacitor. The ceramic material has a composition according to the following general formula:

Pb.sub.(y−1.5a−0.5b+c+0.5d−0.5e−f)Ca.sub.aA.sub.b(Zr.sub.1−xTi.sub.x).sub.(1−c−d−e−d)E.sub.cFe.sub.dNb.sub.eW.sub.fO.sub.3,

where
A is one or more of the group of Na, K and Ag;
E is one or more of the group of Cu, Ni, Hf, Si and Mn; and
0<a<0.14,
0.05≤x≤0.3,
0≤b≤0.12,
0<c≤0.12,
0≤d≤0.12,
0≤e≤0.12,
0≤f≤0.12,
0.9≤y≤1.5 and
0.001<b+c+d+e+f
applies.

Further, the invention includes a capacitor comprising the described ceramic material.

The present invention relates to a ceramic material for a multilayer capacitor. The ceramic material has a composition according to the following general formula:

Pb.sub.(y−1.5a−0.5b+c+0.5d−0.5e−f)Ca.sub.aA.sub.b(Zr.sub.1−xTi.sub.x).sub.(1−c−d−e−d)E.sub.cFe.sub.dNb.sub.eW.sub.fO.sub.3,

where
A is one or more of the group of Na, K and Ag;
E is one or more of the group of Cu, Ni, Hf, Si and Mn; and
0<a<0.14,
0.05≤x≤0.3,
0≤b≤0.12,
0<c≤0.12,
0≤d≤0.12,
0≤e≤0.12,
0≤f≤0.12,
0.9≤y≤1.5 and
0.001<b+c+d+e+f
applies.

Further, the invention includes a capacitor comprising the described ceramic material.

A multilayer electronic component includes a body including first and second surfaces opposing each other and third and fourth surfaces connected to the first and second surfaces and opposing each other, the body including dielectric layers and internal electrodes interposed between the dielectric layers, and an external electrode disposed on the body to be connected to the internal electrodes. The external electrode includes first and second plating layers respectively covering the third and fourth surfaces, a first electrode layer covering portions of the first and second surfaces and having one side surface in contact with one side surface of the first plating layer, a second electrode layer covering the portions of the first and second surfaces and having one side surface in contact with one side surface of the second plating layer, and third and fourth plating layers respectively covering the first and second plating layers.

A multilayer ceramic capacitor includes ceramic layers, internal electrodes, opposed principal surfaces, opposed end surfaces, and opposed side surfaces, and external electrodes on a surface of the capacitive body. The external electrodes include Ni and Sn, and have a C-shape on the end surface of the capacitive body and the principal surfaces when a section parallel to the side surfaces is viewed, the C-shape external electrodes include a first region and a second region completely surrounding the first region, an area of Sn is greater than or equal to about 90% with respect to a total of an area of Ni and the area of Sn, and in the first region, the area of Sn is less than about 90% with respect to the total of the area of Ni and the area of Sn appearing in a measurement region.