A method of manufacturing a semiconductor power package includes: embedding a power semiconductor chip in an encapsulation, the encapsulation forming a housing of the semiconductor power package; and extending a layer of a covering material over at least a part of an outer main surface of the encapsulation. The covering material has a thermal conductivity greater than a thermal conductivity of the material of the encapsulation and/or a temperature stability greater than a temperature stability of the pre-molded chip housing.

A mounting structure of the present disclosure includes a package on whose upper surface an electronic component is mounted, a voltage regulator module, a mother board for mounting the package on an upper surface of the mother board, a driver, a plurality of connectors for electrically connecting a conductor layer of the mother board and a conductor layer of the package to each other, and a heat sink.

A device assembly as disclosed herein includes a heat pipe coupled to a heat transfer device, and a thermal interface. The assembly further includes a cold plate rotatably coupled with the heat pipe through a hinge. The thermal interface is coupled with the cold plate through a plane to rotate about the heat pipe together with the cold plate, and the thermal interface includes a material having a thickness and a resiliency configured to make thermal contact with a circuit in a circuit card when the cold plate is rotated over the circuit card. A chassis and a method to build the chassis including the above assembly are also disclosed.

An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).

A locating unit with a base seat locating structure. The base seat locating structure includes a base seat and a locating unit. The base seat has a pair of locating holes each having a first locating hole section and a second locating hole section and a connection section connected therebetween. The second locating hole section has a locating recess. The locating unit has a main body having a first side and a second side and a through hole passing through the main body between the first and second sides. A first protruding key and a second protruding key protrude from the second side beside the through hole. The first and second protruding keys are displaceably assembled and connected with the locating holes. Free ends of the first and second protruding keys respectively have a first end section and a second end section connected and assembled with the locating recesses.

A fixing structure for heat dissipation assembly includes a base and multiple female fastener holders. The base has at least one through bore axially extending through an upper and a lower surface thereof, as well as coupling holes located outside the through bore and respectively having an engaging element disposed therein. The female fastener holder has a lower side formed with coupling protrusions corresponding to the coupling holes. The coupling protrusion has a guiding groove radially provided thereon and having a lower and an upper end recess for engaging with the engaging element in the corresponding coupling hole. The engaging elements in the coupling holes are guided by the guiding grooves to move from the lower to the upper recesses when the female fastener holder is turned relative to the through bore and the coupling holes on the base, bringing the coupling protrusions to axially insert into the coupling holes.

A system for cooling memory modules mounted in parallel on a printed circuit board may include a coolant tube installed in parallel between two of the memory modules, and a heat spreader disposed in parallel between the two memory modules. The heat spreader may include a base having an outer surface thermally coupled to the coolant tube and first and second fins. The first fin has a first spring force toward a first of the two memory modules. The first spring force causes the first fin to provide contact pressure to the first memory module to thermally couple the first fin and the first memory module. The second fin has a second spring force toward a second of the two memory modules. The second spring force causes the second fin to provide contact pressure to the second memory module to thermally couple the second fin and the second memory module.

Implementations of a clip may include a die attach portion including at least one protrusion extending from the die attach portion and a lead frame alignment portion including at least one alignment feature. The at least one alignment feature may be configured to couple into at least one hole in a lead frame thereby aligning the clip with the lead frame. The at least one protrusion may be configured to couple into at least one recess in the die.

The invention in part, is a heat removal system or apparatus providing a method of mounting and electrically connecting heat dissipating electrical devices, preferably in a radial geometry while achieving good surface-to-surface clamping force, in liquid and or air cooled variants. A variation of the invention can provide arc safety for high power density applications. In specific embodiments, the invention also provides low inductance as a result of minimal loop area while also providing high voltage isolation between devices. The N-sided geometry and effective clamping methodology offer low mass and volume. A variation of the invention also provides a signal interface for driving power electronics devices. A unique cylindrical electrical device package with terminals can support capacitor, inductor and transformer integration in a common package. The various elements of the invention can be combined together to minimize size and weight, while addressing high voltage, noise and thermal management.

In one general aspect, an apparatus can include a semiconductor die, a substrate, and a leadframe coupled to the substrate and defining an opening. The apparatus can include a one-body clip having a first portion disposed within the opening and coupled to the semiconductor die. The one-body clip can have a second portion disposed within the same opening and coupled to the substrate.