A semiconductor apparatus includes: a semiconductor module; a cooler including flow paths through which a refrigerant flows; a casing including a bottom surface; at least one first fixing member fixing the cooler to the bottom surface; and at least one second fixing member fixing the cooler to the bottom surface. The cooler includes: an outer surface directed to the bottom surface of the casing; an inner surface that is a part of wall surfaces of the flow paths on an opposite side to the outer surface; an outer wall to which the at least one first fixing member is connected; and an outer wall that is on an opposite side to the outer wall and to which the at least one second fixing member is connected. The semiconductor module is positioned between the bottom surface of the casing and the outer surface of the cooler, and is pressed by these two surfaces.

A semiconductor apparatus includes: a semiconductor module; a cooler including flow paths through which a refrigerant flows; a casing including a bottom surface; at least one first fixing member fixing the cooler to the bottom surface; and at least one second fixing member fixing the cooler to the bottom surface. The cooler includes: an outer surface directed to the bottom surface of the casing; an inner surface that is a part of wall surfaces of the flow paths on an opposite side to the outer surface; an outer wall to which the at least one first fixing member is connected; and an outer wall that is on an opposite side to the outer wall and to which the at least one second fixing member is connected. The semiconductor module is positioned between the bottom surface of the casing and the outer surface of the cooler, and is pressed by these two surfaces.

A cooler includes a main body extending in the Y direction. The main body includes: (i) an outer wall including an outer surface on which a semiconductor module is to be arranged, and an inner surface; (ii) an inflow path extending in the Y direction, and having an end into which a refrigerant flows; (iii) an outflow path extending in the Y direction, and having an end from which the refrigerant flows out; and (iv) cooling flow paths having the inner surface as a part of a wall surface. The cooling flow paths are arrayed in the Y direction, extend in the X direction, and are positioned between the inflow and outflow paths and the outer wall in the Z direction. Each of the cooling flow paths causes the inflow path and the outflow path to communicate with each other in the X direction.

A cooler includes a main body extending in the Y direction. The main body includes: (i) an outer wall including an outer surface on which a semiconductor module is to be arranged, and an inner surface; (ii) an inflow path extending in the Y direction, and having an end into which a refrigerant flows; (iii) an outflow path extending in the Y direction, and having an end from which the refrigerant flows out; and (iv) cooling flow paths having the inner surface as a part of a wall surface. The cooling flow paths are arrayed in the Y direction, extend in the X direction, and are positioned between the inflow and outflow paths and the outer wall in the Z direction. Each of the cooling flow paths causes the inflow path and the outflow path to communicate with each other in the X direction.

An outer frame (outer wall) of a housing of a semiconductor device has a spacer portion that protrudes beyond a bottom surface of a cooling bottom plate in an opposite direction to a semiconductor chip. When the semiconductor device is placed on an arbitrary placement surface for example, the spacer portion produces a gap between a rear surface of a cooling device (that is, a bottom surface of the cooling bottom plate) and the placement surface. This means that the bottom surface of the cooling bottom plate does not directly touch the placement surface and is less likely to be damaged. Favorable sealing is maintained between pipes, which are attached to the cooling device of the semiconductor device, and an inlet and an outlet on the cooling bottom plate.

An outer frame (outer wall) of a housing of a semiconductor device has a spacer portion that protrudes beyond a bottom surface of a cooling bottom plate in an opposite direction to a semiconductor chip. When the semiconductor device is placed on an arbitrary placement surface for example, the spacer portion produces a gap between a rear surface of a cooling device (that is, a bottom surface of the cooling bottom plate) and the placement surface. This means that the bottom surface of the cooling bottom plate does not directly touch the placement surface and is less likely to be damaged. Favorable sealing is maintained between pipes, which are attached to the cooling device of the semiconductor device, and an inlet and an outlet on the cooling bottom plate.

A semiconductor device includes functional circuits electrically coupled to each other and each coupled to a different thermal circuit. The different thermal circuits are configured to maintain different operating temperatures targeted for each corresponding functional circuit. One of the thermal circuits may use a cryogenic liquid to cool the corresponding functional circuit.

A semiconductor device includes functional circuits electrically coupled to each other and each coupled to a different thermal circuit. The different thermal circuits are configured to maintain different operating temperatures targeted for each corresponding functional circuit. One of the thermal circuits may use a cryogenic liquid to cool the corresponding functional circuit.

In one general aspect, an apparatus can include a first module including a first semiconductor die, and a first heatsink coupled to the first module where the first heatsink includes a substrate and a first plurality of protrusions. The apparatus can also include a second module including a second semiconductor die, and a second heatsink coupled to the second module and including a second plurality of protrusions. The apparatus can also include a cover defining a channel where the first plurality of protrusions of the first heatsink and the second plurality of protrusions of the second heatsink are disposed within the channel.

A water cooling radiator includes a water pump assembly and a water drain assembly. The water pump assembly includes a base and a housing spliced with the base to form an accommodating cavity. A water inlet portion and a water outlet portion in the accommodating cavity are formed on the base. The water inlet portion includes a water inlet tank provided on the base, a water inlet pump arranged in the water inlet tank and connected with the base, and a water inlet nozzle connected to the base and communicated with the water inlet tank, The water inlet tank is communicated with the water drain assembly. The water outlet portion includes a water outlet tank provided on the base, a water outlet pump arranged in the water outlet tank and connected with the base, and a water outlet nozzle connected to the base and communicated with the water outlet tank.