A server device includes a casing, an electronic assembly, a cover, and a heat dissipation device. The electronic assembly includes a circuit board and at least one heat source. The circuit board is disposed on the casing, and the heat source is disposed on the circuit board. The cover is slidably disposed on the casing. The heat dissipation device includes at least one air cooling heat exchanger and at least one liquid cooling heat exchanger. The air cooling heat exchanger is fixed on and thermally coupled with the heat source. The liquid cooling heat exchanger is fixed on the cover and thermally coupled with the air cooling heat exchanger.

A server rack assembly is provided for an electronics tray and a manifold for delivery of cooling flow to the electronics tray. Mounting and alignment features on the server rack assembly, such as alignment holes and planar support surfaces, can help to provide predictable alignment between fluid ports on the manifold and fluid ports on the electronics tray. The server rack assembly can include a mounting and alignment interface coupled to the manifold and a rack support that can be coupled to the mounting and alignment interface. An equipment stop can be coupled to the rack support and can extend perpendicular to a side portion of the rack support. The equipment stop can be configured to prevent the electronics tray from being installed beyond a predetermined distance.

A validation method relating to the validation of immersion-cooled servers in an air cooling environment obtains a requirement or purchase order, the order including types of immersion-cooled servers and number required. The method builds a validation environment accordingly, the validation environment includes first fans and air cooling power modules. The air cooling power modules includes a number of power supply units and a number of second fans. The method executes one or more tests in an assembled validation environment. The method further generates a result of test. A demo board and a non-transitory storage medium are also disclosed.

A coolant for cooling an electrical/electronic element by direct immersion cooling, comprising a partially fluorinated ether with the structure (of compound 1) wherein R.sup.1, R.sup.2, R.sup.3, R.sup.4 are independently selected from the group CF.sub.3, alkyl, fluoroalkyl, perfluoroalkyl, haloalkyl perfluorohaloalkyl.

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An apparatus for a hybrid single-phase/two-phase cooling loop to enhance cooling of components in a computing device is disclosed. The apparatus includes a single-phase cooling loop routed through a first part of a component. The component includes semiconductor devices. The single-phase cooling loop includes a fluid configured to remain in a liquid state after removing heat from the first part of the component. The apparatus includes a two-phase cooling loop routed through a second part of a component. The two-phase cooling loop includes a dielectric fluid configured to at least partially transition from a liquid state to a gas state at a selected temperature of a semiconductor device of the second part of the component while removing heat from the second part of the component.

An immersion cooling system and level control method thereof, comprising: provide a main tank with a first upper/lower level limit and a storage tank with a second upper/lower level limit, the connection site of the main tank is higher than that of the storage tank and the first upper level limit; measure the level of the two tanks; when the level of the main tank is lower than the first lower level limit and the level of the storage tank is higher than the second lower level limit, open a first valve and a pump so that the liquid is input into the main tank; and when the level of the main tank is higher than the first upper level limit and the level of the storage tank is not higher than the second upper level limit, open the second valve to allow liquid to enter the storage tank.

Example method and apparatus, systems, and articles of manufacture for immersion cooling systems are disclosed herein. An example apparatus disclosed herein includes a tank to hold a coolant, an overflow chamber to direct the coolant toward an outlet, and a plate within the overflow chamber, the plate including a plurality of openings, the coolant to pass through at least one of the plurality of openings before reaching the outlet.

Provided herein are systems and methods for utilizing a natural gas letdown generator at a natural gas regulating station. The system utilizes the gas letdown generator to generate electricity by converting high pressure inlet gas to low pressure outlet gas, which in turn creates low temperature outlet gas. Electricity generated can power a data center. Heat may be transferred, using a heat exchanger, from dielectric fluid of the data center to the natural gas prior to entering the gas letdown generator. Heat may be further transferred, using a second heat exchanger, from the dielectric fluid to the natural gas at the output of the gas letdown generator. The heat exchange may substantially cool the dielectric fluid for transmission to the data center and may heat the low temperature outlet gas for transmission to an end user.

This disclosure relates generally to interfaces between memory modules and circuit boards. More specifically, this disclosure relates to interfaces for coupling a memory module to a circuit board such that the memory module is arranged in a plane that is substantially parallel with a plane of the circuit board. Various embodiments disclosed herein include interfaces, memory modules including interfaces or portions of interfaces, and/or circuit boards including interfaces and/or portions of interfaces. Associated devices and systems are also disclosed.

An immersion cooling system includes a receiving member, a heat dissipation channel, and a heat sink. The receiving member is filled with coolant. The receiving member is connected to an end of the heat sink, and heat-generating entities such as one or more servers are positioned in a cavity of the receiving member. The heat dissipation channel is connected to the cavity and is connected to the heat sink. The heat dissipation channel communicates with the cavity and allows circulation of the coolant in the channel, the heat sink cooling down the coolant flowing into heat dissipation channel from the cavity. The immersion cooling system is compact, occupies very little space, and is easily installed, maintained, and moved. A server system having the immersion cooling system is also disclosed.