A method of making a LED light bulb with the Graphene filament contains steps of: A. providing a flexible substrate, wherein the flexible substrate is flexible printed circuit board (PCB); B. coating graphene-based heat dissipation ink on a back side of the flexible substrate; C. cutting the printed circuit board (PCB) on which a graphene-based heat dissipation film is coated to form plural Graphene filaments; D. fixing the plural Graphene filaments into a light bulb. The flexible substrate has copper lines formed on both sides thereof for electronic circuits and heat conduction, and LED chips are mounted on a front side of the flexible substrate. The graphene-based heat dissipation ink is coated on the back side of the flexible substrate before or after LED chips/phosphor molding and then is dried. In addition, the Graphene filaments are fixed in a bended or arched position.

A touch panel includes: a uni-axially oriented base film; a transparent electrode pattern layer positioned on the uni-axially oriented base film; a first passivation layer formed in an edge region of the transparent electrode pattern layer and covering end portion side walls of the transparent electrode pattern layer; and a contact hole positioned on the first passivation layer and exposing the first passivation layer.

Apparatus, materials, and techniques and techniques herein can include providing a deposited layer comprising a composite material including carbon nanotubes (CNTs). According to various examples, the composite can be applied to a substrate such as using a solution containing CNTs and other constituents such as sulfur. The solution can be spray-applied to a substrate, or spin-coated upon a substrate, such as to provide a uniform, conductive, and optically-transparent film layer. In one application, such a film layer can be clad or otherwise assembled in a stack-up including a substrate and cover layer (e.g., glass layers), such as to provide a transparent assembly. Such an assembly can include a portion of a window, such as a windscreen for a vehicle, where the CNT material can provide a conduction medium for Joule heating.

A printed circuit board has a core made of an aluminum material; a bonding member positioned on opposite surfaces of the core; a base layer bonded to the opposite surface of the core through the bonding member; a receiving hole extending through the core, the bonding member, and the base layer; a zinc substitution layer positioned on a surface of the base layer and a portion of the base layer exposed on an inner surface of the receiving hole; and a plating layer positioned on the zinc substitution layer, and having a circuit pattern.

A process for forming a graphene circuit pattern on an object is described. A graphene layer is grown on a metal foil. A bonding layer is formed on a protective film and a surface of the bonding layer is roughened. The graphene layer is transferred onto the roughened surface of the bonding layer. The protective film is removed and the bonding layer is laminated to a first core dielectric substrate. The metal foil is etched away. Thereafter the graphene layer is etched using oxygen plasma etching to form graphene circuits on the first core dielectric substrate. The first core dielectric substrate having graphene circuits thereon is bonded together with a second core dielectric substrate wherein the graphene circuits are on a side facing the second core dielectric substrate wherein an air gap is left therebetween.

Illustrative embodiments of anisotropic conductive adhesive (ACA) and associated methods are disclosed. In one illustrative embodiment, the ACA may comprise a binder curable using UV light and a plurality of particles suspended in the binder. Each of the plurality of particles may comprise a ferromagnetic material coated with a layer of electrically conductive material. The electrically conducting material may form electrically conductive and isolated parallel paths when the ACA is cured using UV light after being subjected to a magnetic field.

The invention relates to a transparent conductive layer comprising non-conductive areas and conductive areas, wherein the conductive areas comprise an FIG. 1 interconnected network of electrically conductive nanoobjects and in the non-conductive areas the nanoobjects are converted into particles and wherein the thickness of the conductive areas and the non-conductive areas differs less than 10 nm. The invention further relates to a process for producing a patterned transparent conductive film, the film comprising a substrate and a transparent conductive layer, and to a process for producing the patterned transparent conductive film.

A circuit board is disclosed. In addition to insulating layers, the circuit board includes a structure for heat transfer that includes a first layer that is formed of graphite or graphene, a second layer that is formed of metallic material and disposed on one surface of the first layer, and a third layer that is formed of metallic material and disposed on the other surface of the first layer, and at least a portion of the structure for heat transfer is inserted into an insulation layer. Such a circuit board provides improved heat management. Also disclosed is a method of manufacturing the circuit board.

A composite structure for use as a constituent of a mounting device, wherein the composite structure comprises an electrically conductive carrier, an intermediate layer comprising adhesion promoting material and being arranged on the electrically conductive carrier, and a thermally conductive and electrically insulating layer on the intermediate layer.

A flexible electrically conductive structure includes: a first polymer layer; and an electrically conductive layer disposed on a surface of the first polymer layer, wherein the electrically conductive layer includes an electrically conductive metal and a nanocarbon material, and wherein the flexible wiring board is to be used with a bending portion provided at least one position of the electrically conductive layer.