Patent classifications
H05K2201/10151
METAL NANOWIRE INK FOR THE FORMATION OF TRANSPARENT CONDUCTIVE FILMS WITH FUSED NETWORKS
Fusing nanowire inks are described that can also comprise a hydrophilic polymer binder, such as a cellulose based binder. The fusing nanowire inks can be deposited onto a substrate surface and dried to drive the fusing process. Transparent conductive films can be formed with desirable properties.
Mouth Guard Having Internal Components For Sensing Impact Forces
A mouth guard senses impact forces and determines if the forces exceed an impact threshold. If so, the mouth guard notifies the user of the risk for injury by haptic feedback, vibratory feedback, and/or audible feedback. The mouth guard system may also remotely communicate the status of risk and the potential injury. The mouth guard uses a local memory device to store impact thresholds based on personal biometric information obtained from the user and compares the sensed forces relative to those threshold values. The mouth guard and its electrical components on the printed circuit board are custom manufactured for the user such that the mouth guard provides a comfortable and reliable fit, while ensuring exceptional performance.
Apparatus for sensing comprising a flexible substrate
An apparatus includes a flexible substrate; at least one sensor mounted on the flexible substrate arranged to provide an electrical output signal dependent upon a first parameter; and at least one conductive trace provided on the flexible substrate arranged to provide a direct current path to the at least one sensor and having an electrical property dependent upon a second parameter and arranged to provide an electrical output signal indicative of the second parameter.
PERMEABLE ELEMENT
The invention relates to an element in the shape of a sensor, an active electronic component, a switch, a circuit, or an electric conducting path for integration into a surrounding medium. The element is penetrable by the surrounding medium and has a porous, non-conductive substrate and at least one circuit trace made of conductive material present on the substrate. The openings of the substrate are open in an area of the circuit trace. The use and manufacture of the element are also provided.
ELECTRONIC MODULE, MANUFACTURING METHOD FOR ELECTRONIC MODULE, AND ENDOSCOPE
An electronic module includes a first structure including a flat mounting surface on which an integrated circuit is mounted and a wiring surface including a surface including a portion that changes in a direction perpendicular to the mounting surface, a wire connected to the integrated circuit being extended on the wiring surface, a second structure disposed with a dielectric region interposed with respect to the wiring surface of the first structure, a metal pattern being provided on the second structure, and at least one spacer member that equalizes thickness of the dielectric region between the wire and the metal pattern in an entire range between the mounting surface and the wiring surface including the surface including the portion that changes in the direction perpendicular to the mounting surface.
JOYSTICK DEVICE AND HANDLE
A joystick device is provided. The joystick device includes a housing, a joystick assembly, a reset assembly, a translation assembly, and a circuit board. A magnetic component is located on the translation assembly, and a magnetic induction element is located on the circuit board. The joystick assembly pushes the translation assembly to translate, and the magnetic induction element generate an output that changes with the movement of the translation assembly. A handle using the joystick device also provided.
Apparatus and method for measuring temperature of battery
An apparatus and method for measuring temperature of a battery, which may effectively measure a temperature of a secondary battery. The apparatus measures a temperature of a secondary battery at an integrated circuit board configured to contact an electrode lead of the secondary battery, and includes a lead connector mounted on the integrated circuit board and configured such that the electrode lead is connected thereto, a temperature sensor mounted on the integrated circuit board and configured to receive an operation power from the secondary battery as a first terminal provided at one end thereof among a plurality of terminals included therein is in direct contact with the lead connector, and a calculating unit electrically connected to the temperature sensor and configured to measure the temperature of the secondary battery based on an electric signal measured by the temperature sensor.
SENSOR-DEVICE ATTACHMENT STRUCTURE
Provided is a sensor-device attachment structure including: a thin portion that is thinner than other parts of a member; a flexible board; an at least one sensor device installed to the flexible board; a spacer that is formed into a shape of a film having a uniform thickness, that is sandwiched between the thin portion and the flexible board, and that includes a through portion which is formed through the spacer in a thickness direction of the spacer at a position corresponding to the at least one sensor device; and an adhesive that is charged in the through portion, and that bonds the thin portion and the flexible board to each other.
Electric toothbrush adopting force sensing array
There is provided an electric toothbrush including a toothbrush head, a toothbrush handle and a force sensing array. The force sensing array is arranged on the toothbrush head and/or the toothbrush handle. When the force sensing array is arranged on the toothbrush head, it is able to detect the force uniformity of brush hairs. When the force sensing array is arranged on the toothbrush handle, it is able to control the vibration strength of the brush hairs and detect the pressing force of the brush hairs.
APPARATUS FOR TEMPERATURE MEASUREMENT AND METHOD OF PROCESSING SUBSTRATE
A temperature measuring apparatus with improved accuracy is provided. The temperature measuring apparatus comprises a test substrate having a thermal conductivity, a circuit board layer laminated on the test substrate and including a plurality of through holes exposing a top surface of the test substrate, bonding agent disposed in the plurality of through holes and having a thermal conductivity, and a plurality of sensors disposed on the bonding agent and for measuring a temperature.