A MMIC support and cooling structure having a three-dimensional, thermally conductive support structure having a plurality of surfaces and a circuit having a plurality of heat generating electrical components disposed on a first portion of the surfaces and interconnected by microwave transmission lines disposed on a second portion of the plurality of surfaces of the thermally conductive support structure

An electronic module includes a circuit board having a mounting surface; a heat generating component mounted on the mounting surface; a frame supporting the circuit board; a cover covering the heat generating component and the mounting surface; and a heatsink mounted on the mounting surface. The heatsink includes at least one wall including a particular wall to which the heat generating component is attached. The heatsink further includes a shade portion provided at the at least one wall. The shade portion is located between the cover and the heat generating component in a direction perpendicular to the mounting surface.

A programmable circuit includes an array of printed groups of microscopic transistors or diodes having pn junctions. The devices are pre-formed and printed as an ink and cured. The devices have a proper orientation and a reverse orientation after settling on a conductor layer. The devices are connected in parallel within small groups. To neutralize the reverse-oriented devices, a sufficient voltage is applied across the parallel-connected diodes to forward bias only the devices having the reverse orientation. This causes a sufficient current to flow through each of the reverse-orientated devices to destroy an electrical interface between an electrode of the devices and the conductor layer to create an open circuit, such that those devices do not affect a rectifying function of the devices in the group having the proper orientation. An interconnection conductor pattern may then interconnect the groups to form complex logic circuits.

The present disclosure provides a display device which includes a display panel, a connecting circuit board, a composite circuit board, and flexible circuit units, an absolute value of a difference between the maximum thickness of the connecting circuit board and the maximum thickness of the composite circuit board is less than or equal to a first preset thickness.

A semiconductor device includes a first circuit board on which a first switching element and a first diode connected in inverse parallel are mounted, a second circuit board on which a second switching element and a second diode connected in inverse parallel are mounted, a printed circuit board disposed opposite the first circuit board and the second circuit board, and a plurality of conductive posts which electrically connect the first switching element, the second switching element, the first diode, the second diode, the first circuit board, or the second circuit board and metal layers of the printed circuit board. The first switching element and the second switching element are connected in anti-series to form a bidirectional switch.

The power semiconductor module includes a power semiconductor assembly and a heat transfer member. The power semiconductor assembly includes a circuit board and a case. The circuit board includes an insulating substrate. The second attachment surface to which the heat transfer member is attached is recessed from the first attachment surface to which the heat sink is attached. The maximum recessed distance of the second attachment surface from the first attachment surface is smaller than the original thickness of the heat transfer member, and is greater than the lower limit thickness of the heat transfer member.

A first heat dissipation member is thermally connected to a first busbar. A second heat dissipation member is thermally connected to a second busbar. The first busbar and the second busbar respectively have a first facing part and a second facing part that face each other. The first facing part has a first surface on which a first electronic component is mounted and a second surface opposite to the first surface. The second facing part has a third surface that faces the second surface and a fourth surface that is positioned opposite to the third surface and on which a second electronic component is mounted. A circuit board has a wiring board that is positioned behind the first facing part and is positioned in front of the second facing part when the second facing part side is seen from the first facing part side.

A molded electronic assembly including a circuit substrate, a plurality of electronic devices, and at least one patterned heat dissipation structure is provided. The circuit substrate includes a substrate and a circuit, where the substrate has a top surface, and the circuit has a plurality of signal contacts distributed on the top surface. The electronic devices are disposed on the circuit substrate, and each of the electronic devices has a plurality of device pins connected to the signal contacts. The at least one patterned heat dissipation structure corresponds to a signal contact of the signal contacts and starts from the corresponding signal contact and extends toward a plurality of directions on the top surface of the substrate.

To enable in a circuit arrangement (8) with a transformer with center tap the voltage measurement on the secondary side simply and safely, it is provided that at least two series-connected resistors (R3, R4) are connected between the two outer connections (A1, A2) of the secondary side of the transformer (T) to form a measurement point (P) between the two resistors (R3, R4), and a voltage measurement unit (V) is provided to measure the voltage (U.sub.P) between the measurement point (P) and the second output pole (13), which corresponds to the output voltage (U.sub.A).

This disclosure presents a power switching module combining a novel gate driver with a photonic isolated power source which can output a high voltage and high power at the same time, and thus can drive a power semiconductor device. The disclosed power switching module could simplify the switched mode power supply structure to (1) replace the isolated power supply module; (2) simplify circuitry of the gate driver by integrating gate driver signaling opto-electronics; and (3) provide a module with power semiconductor device under switched mode power supply structure.