A multilayer capacitor includes a body including a stack structure in which a plurality of dielectric layers are stacked and a plurality of internal electrodes stacked with respective dielectric layers interposed therebetween, external electrodes disposed on external surfaces of the body and connected to the internal electrodes, and an insulating layer covering a surface of the body. One of the external electrodes includes a metal layer connected to the insulating layer, and the insulating layer includes an oxide of a metal component of the metal layer.

A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and first and second internal electrodes alternately stacked with respective dielectric layers interposed therebetween; and a first external electrode connected to the first internal electrodes and a second external electrode connected to the second internal electrodes, wherein the dielectric layer includes silicon (Si), each of the first and second internal electrodes includes Si and a conductive metal, and a ratio (B/A) of an average content (B) (wt %) of Si included in each of the first and second internal electrodes to an average content (A) (wt %) of Si included in the dielectric layer is 0.99 or more and 1.41 or less.

A capacitor component includes a body, including a dielectric layer and an internal electrode layer, and an external electrode disposed on the body and connected to the internal electrode layer. At least one hole is formed in the internal electrode layer, and a region, containing at least one selected from the group consisting of indium (In) and tin (Sn), is disposed in the hole. A method of manufacturing a capacitor component includes forming a dielectric green sheet, forming a conductive thin film, including a first conductive material and a second conductive material, on the dielectric green sheet, and sintering the conductive thin film to form an internal electrode layer. The internal electrode layer includes the first conductive material, and a region, including the second conductive material, is formed in the internal electrode layer.

A capacitor includes cup-shaped lower electrodes disposed on a substrate, a capacitor dielectric layer conformally covering inner surfaces and outer surfaces of the cup-shaped lower electrodes, and a support layer disposed between outer surfaces of the cup-shaped lower electrodes to connect the cup-shaped lower electrodes. The capacitor further includes an annealed oxide layer, which is interposed between the inner surfaces of the cup-shaped lower electrodes and the capacitor dielectric layer, and is also interposed between a portion of the outer surfaces of the cup-shaped lower electrodes and the capacitor dielectric layer. A method for forming the capacitor is also provided.

A multi-layer ceramic capacitor includes: a first region including a polycrystal including, as a main component, crystal grains free from intragranular pores; a second region that includes a polycrystal including, as a main component, crystal grains including intragranular pores and includes a higher content of silicon than a content of silicon in the first region; a capacitance forming unit including ceramic layers laminated along a first direction, and internal electrodes disposed between the ceramic layers; and a protective portion including a cover that covers the capacitance forming unit and constitutes a main surface facing in the first direction, a side margin constituting a side surface facing in a second direction orthogonal to the first direction, and a ridge constituting a connection portion, the connection portion connecting the main surface and the side surface to each other. The ceramic layers include the first region. The ridge includes the second region.

A multilayer ceramic electronic component includes a ceramic body having a capacitance forming portion in which first and second internal electrodes are alternately laminated with respective dielectric layers interposed therebetween, and first and second external electrodes respectively disposed on surfaces of the ceramic body. The first and second internal electrodes are respectively exposed to surfaces of the ceramic body, and first and second protrusions, each including a carbon compound, are respectively disposed on end portions of the first and second internal electrodes exposed to the surfaces of the ceramic body.

There is provided a multilayer electronic component in which a short circuit between the internal electrodes, a decrease in capacitance, a decrease in breakdown voltage, and the like, may be suppressed by controlling an area fraction occupied by a region in which an intensity of brightness in a capacitance formation portion is 110% or more and 126% or less of an average value of an intensity of brightness of a cover portion.

A method of manufacturing an electronic component that includes preparing unfired multilayer bodies each including main surfaces opposite to each other in a stacking direction, side surfaces opposite to each other in a width direction, and end surfaces opposite to each other in a length direction. One of the side surfaces of each of the unfired multilayer bodies is bonded to an adhesive sheet, and the other side surface of each of the unfired multilayer bodies is polished by rotating a polishing surface of a rotary polishing machine while contacting the other side surface. An insulating layer is formed on the polished other side surface. In the polishing of the other side surface, at least one of the rotary polishing machine and the adhesive sheet is moved relative to the other thereof to form a polish groove in the length direction.

Disclosed is a broadband capacitor in which an electrode unit comprises a main electrode and a plurality of side electrodes so as to facilitate changing of capacitance value. The disclosed broadband capacitor is formed by alternately stacking a first electrode set, which comprises a first main electrode and a plurality of side electrodes spaced apart from the first main electrode, and a second electrode set, which comprises a second main electrode and a plurality of side electrodes spaced apart from the second main electrode.

A dielectric composition includes dielectric particles and first segregations. The dielectric particles each include a perovskite compound represented by ABO.sub.3 as a main component. The first segregations each include at least Ba, P, and O. A molar ratio (Ba/Ti) of Ba to Ti in the first segregations is 1.20 or more.