A multilayer ceramic capacitor includes a multilayer body in which dielectric layers are layered, first internal electrode layers extending to opposing end surfaces of the multilayer body, second internal electrode layers extending to opposing side surfaces of the multilayer body, first and second external electrodes connected to the first internal electrode layers and provided on the respective opposing end surfaces, and third and fourth external electrodes connected to the second internal electrode layers and provided on the respective opposing side surfaces. A number of the first internal electrode layers is larger than a number of the second internal electrode layers, at least two first internal electrode layers are successively layered, and a thickness of the second internal electrode layers is larger than a thickness of the first internal electrode layers.

A multilayer ceramic capacitor includes a laminate including ceramic layers and internal electrode layers laminated together in a lamination direction, and at a widthwise end of at least one of the internal electrode layers in a cross section of the laminate perpendicular to the lamination direction, a ratio of a length X to a length Y is about 1.2 or more and about 3.0 or less, where the length X denotes a length of a straight boundary line between the internal electrode layer and the ceramic layer when the shape of the internal electrode layer is considered as a polygon, and the length Y denotes a length of an actual boundary line between the internal electrode layer and the ceramic layer.

A multilayer ceramic capacitor includes an external electrode including an underlying electrode layer, a lower plating layer on the underlying electrode layer at a first end surface and a second end surface, and an upper plating layer on the lower plating layer. The underlying electrode layer is a thin film electrode including at least one selected from Ni, Cr, Cu, and Ti. The lower plating layer is a Cu plating layer including a lower layer region located closer to the multilayer body and an upper layer region located between the lower layer region and the upper plating layer, and the Cu plating layer in the lower layer region has a metal grain diameter smaller than that of the Cu plating layer located in the upper layer region.

A multilayer electronic component includes a body including a plurality of dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connected to the first surface and the second surface and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other, a plurality of internal electrodes disposed inside of the body, exposed to the first surface and the second surface, and having one ends exposed to the third or fourth surfaces, side margin portions disposed on the first surface and the second surface, and external electrodes disposed on the third surface and the fourth surface. The side margin portions and the plurality of dielectric layers include a metal, and a total amount of the metal included in the side margin portions is greater than that of the plurality of dielectric layers.

A method for manufacturing a conductive paste, includes: an operation of forming a first mixture including a metal powder, a dispersant, and a hydrophobic solvent; an operation of forming a second mixture including a hydrophilic binder and a hydrophilic solvent; and an operation of forming a third mixture by mixing the first and second mixtures.

A multilayer ceramic capacitor includes a multilayer body including an inner layer portion including internal electrode layers and inner dielectric layers laminated alternately, and internal electrode layers at both ends thereof in a lamination direction, and outer dielectric layers covering the inner layer portion, and two external electrodes on both end surfaces of the multilayer body in a length direction intersecting the lamination direction. The inner and outer dielectric layers each include grains, and a difference between an average grain size of grains in the inner dielectric layers and an average grain size of grains in the outer dielectric layers is about 100 nm or less.

A ceramic electronic device includes a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers including Ni as a main phase are alternately stacked. At least one of the plurality of dielectric layers includes a secondary phase including Si, at an interface between the at least one of the plurality of dielectric layers and one of the plurality of internal electrode layers next to the at least one of the plurality of dielectric layers. The one of the plurality of internal electrode layers includes a layer including an additive element including one or more of Au, Pt, Cu, Fe, Cr, Zn, and In, at a region contacting the secondary phase at the interface.

A capacitor component includes a body including a dielectric layer and an internal electrode layer; and an external electrode disposed on one surface of the body, wherein the external electrode includes first electrode layers disposed on the one surface of the body to be spaced apart from each other, and covering a region of the one surface of the body through which the internal electrode layer is exposed; a second electrode layer including a base resin and a conductive connection portion disposed in the base resin, and disposed on the one surface of the body to cover the first electrode layers; and an intermetallic compound disposed only between each of the first electrode layers and the second electrode layer.

A multilayer ceramic capacitor includes dielectric layers made of a ceramic material and internal electrode layers laminated therein. The internal electrode layers each include dielectric columns provided therein. A solid solution layer in which S is solidly dissolved is provided at an interface between each of the dielectric columns and each of the internal electrode layers.

A multilayer ceramic electronic component includes an internal electrode layer including, on a same ceramic layer, a peripheral internal electrode having a frame shape and an inside internal electrode located inside the peripheral internal electrode. A metallic species included in the peripheral internal electrode is different from a metallic species included in the inside internal electrode. The metallic species included in the peripheral internal electrode includes more than or equal to about 50% of a metallic species different from the metallic species included in the inside internal electrode. In a width direction, a dimension a of a width of the peripheral internal electrode is about 5 μm<a<about 30 μm, and a dimension b of a width of the inside internal electrode is b/a≥about 20.