A ceramic electronic device comprises an element body including a ceramic layer and an internal electrode layer, and an external electrode electrically connected to at least one end of the internal electrode layer. The element body includes an interface part at least at a part of a boundary between the external electrode and the ceramic layer. The interface part includes an oxide containing aluminium and an oxide containing boron.

A multilayer ceramic capacitor includes a multilayer body including internal electrode layers and dielectric layers alternately laminated therein, and external electrodes respectively on end surfaces in a length direction intersecting a lamination direction in the multilayer body, and being electrically connected to the internal electrode layers. The internal electrode layers each include an opposing portion and an extension portion. The opposing portion of one internal electrode layer is opposed to an opposing portion of another internal electrode layer adjacent in the lamination direction. The extension portion extends from the opposing portion and is connected to one of the external electrodes in the length direction. The dielectric layers each have a thickness of about 0.3 μm or more and about 0.5 μm or less, and the internal electrode layers include short-circuit prevention internal electrode layers each including a thin portion with a thickness is no more than about 1/20 the thickness of the dielectric layer in the opposing portion.

A multilayer ceramic electronic component includes a ceramic body, including dielectric layers and internal electrodes, and external electrodes disposed on external surfaces of the ceramic body and electrically connected to the internal electrodes. Each of the internal electrodes includes a nickel-cobalt (Ni—Co) alloy, and a content of the cobalt (Co) is 0.01 at % to 10 at % based on 100 at % of the nickel (Ni).

The electronic component includes an element body 4 having plurality of side faces 5a to 5d along a circumference direction. The element body 4 includes insulation layers 16a to 16d covering the plurality of side faces 5a to 5d along the circumference direction in a continuous manner, and melting points of the insulation layers 16a to 16d are lower than melting points of dielectric layers 10 and 11 included in the element body 4. The main component of the insulation layer is glass.

The present invention provides a conductive paste which leaves less fine undissolved matter when dissolved in an organic solvent and thus can be easily filtrated, which has excellent printability, and which can exhibit excellent surface smoothness after printing. Provided is a conductive paste used for forming an electrode of a multilayer ceramic capacitor, the conductive paste containing: a polyvinyl acetal resin; an organic solvent; and a conductive powder, the polyvinyl acetal resin having a wave number A (cm.sup.−1) of a peak within a range of 3,100 to 3,700 cm.sup.−1 in an IR absorption spectrum measured using an infrared spectrophotometer; and a hydroxy group content (mol %), the wavenumber A of the peak and the hydroxy group content satisfying relations of the following formulas (1) and (2):

[(3,470−A)/Hydroxy group content]≤5.0  (1)

(3,470−A)≤150  (2)

wherein A is a wavenumber which is lower than 3,470 cm.sup.−1 and at which a transmittance a (%) satisfying [100−(100−X)/2] is exhibited, where X (%) is s minimum transmittance of the peak within the wavenumber range of 3,100 to 3,700 cm.sup.−1.

A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces to each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; a plurality of internal electrodes disposed in the ceramic body, each exposed to the first and second surfaces and having one ends exposed to the third or fourth surface; and a first side margin portion and a second side margin portion disposed, respectively, on the first and second surfaces, in which a metal or a metal oxide is disposed in the dielectric layer, and a ratio of a diameter of the metal or the metal oxide to a thickness of the dielectric layer is 0.8 or less.

An electronic component includes a laminate in which a plurality of dielectric layers and a plurality of internal electrodes are alternately laminated and external electrodes electrically connected to the internal electrodes. A side margin portion as a region in which the plurality of internal electrodes is not provided when a section of the laminate having the length direction and the width direction is viewed from the laminating direction includes a plurality of side margin layers laminated in the width direction. An outer layer portion as a region in which the plurality of internal electrodes is not provided except for the side margin portion when a section of the laminate including the laminating direction and the width direction is viewed from the length direction includes a plurality of layer-margin layers laminated in the laminating direction.

A manufacturing method of a ceramic electronic device includes forming a multilayer structure by stacking a plurality of stack units, each of the stack units having a structure in which a pattern of metal conductive paste is provided on a dielectric green sheet including a dielectric material, the metal conductive paste including a metallic material of which a main component is Ni and a co-material of which a main component is barium titanate, the metal conductive paste of each of the stack units being alternately shifted, and firing the multilayer structure. FWHM of the metallic material)/(FWHM of the co-material) is 0.550 or less. The FWHM is of a (111) face evaluated by powder X-ray diffraction. An average particle diameter of the metallic material before the firing is 120 nm or less.

A multilayer capacitor includes a capacitor body including first to sixth surface, and including a plurality of dielectric layers, and first and second internal electrodes; and first and second external electrodes. The first and second internal electrodes include first and second capacitance forming portion, first and second lead-out portion extending from the first and second capacitance forming portion toward the third surface of the capacitor body and connected to the first and second external electrode, and first and second dot pattern portion formed in at least one corner of the first and second capacitance forming portion. The first dot pattern portion and the second dot pattern portion have dot patterns not overlapping each other in the first direction.

A method of manufacturing an electronic component includes preparing an unfired multilayer body, bonding one of first and second side surfaces of each unfired multilayer body to an adhesive sheet such that the unfired multilayer bodies are in at least one row, polishing the other side surface of each unfired multilayer body by rotating a polishing surface of a rotary polishing machine in contact with the other side surface of each unfired multilayer body, and forming a first insulating layer on the polished other side surface, wherein in the polishing the other side surface, at least one of the rotary polishing machine and the adhesive sheet is moved relative to the other to form a polish groove in the length direction, and the rotary polishing machine has a cylindrical shape and includes an outer circumferential surface that defines the polishing surface.