Wafers that begin as flat surfaces during a semiconductor manufacturing process may become warped or bowed as layers and features are added to an underlying substrate. This warpage may be detected between manufacturing processes by rotating the wafer adjacent to a displacement sensor. The displacement sensor may generate displacement data relative to a baseline measurement to identify areas of the wafer that bow up or down. The displacement data may then be mapped to locations on the wafer relative to an alignment feature. This mapping may then be used to adjust parameters in subsequent semiconductor processes, including adjusting how a carrier head on a polishing process holds or applies pressure to the wafer as it is polished.

A substrate processing apparatus includes a chamber, a plurality of devices, and a controller. The chamber is subjected to substrate processing. The plurality of devices execute operations related to substrate processing. The controller controls the operations of the plurality of devices. Further, the controller determines whether or not an error has occurred during performing the substrate processing in a chamber, and causes the plurality of devices to automatically execute a recovery operation corresponding to the content of the error that has occurred when the controller determines that the error has occurred and has suspended the substrate processing.

A carrier system and method carries an object to an object mounting member provided with an object mounting section. The system includes: a measurement device which obtains information related to a flatness of the object; a carrier member that carries the object; and a controller which controls a driving speed of the carrier member using the information related to the flatness of the object obtained by the measurement device.

Provided are a waveform analysis method and a waveform analysis device capable of preventing, in advance, a breakage accident during operation and preventing stoppage due to breakdown of machinery and performing efficient maintenance work by specifying a degraded part from among the parts that constitute the machinery. A waveform analysis device 30 is provided with; a signal analysis unit 31 for performing fast Fourier transform for a signal transmitted from a sensor 28 that detects a physical phenomenon in the machinery an impulse extraction unit 32 for extracting an impulse component from spectrum data generated by the signal analysis unit 31; a display unit 35 for displaying waveform data including the impulse component extracted by the impulse extraction unit 32; and a data editing unit 33 for editing, from data of a waveform including the impulse component displayed by the display unit 35, waveform data in a range selected via an input unit 36 by a worker, generating a graph displaying a frequency, a time, and the intensity of the impulse component, and displaying the graph on the display unit 35.

A wafer inspection apparatus according to one embodiment is a wafer inspection apparatus including a plurality of inspection parts arranged in a height direction and a lateral direction, and includes a pair of air circulating means disposed at both ends in a longitudinal direction of an air circulating region including the plurality of inspection parts arranged in the lateral direction and configured to circulate air in the circulating region.

A device for attaching conductive balls to a substrate includes a first plate, a second plate and a controller. The first plate includes first recesses. Each of the first recesses picks up a corresponding conductive ball to be attached to the semiconductor package. The second plate includes second recesses. Each of the second recesses picks up a corresponding conductive ball to be attached to the semiconductor package. The first plate and the second plate are separated from each other. The controller controls each of the first plate and the second plate to be separately moved up or down so that a lower surface of the first plate and a lower surface of the second plate are positioned differently in a first direction normal the lower surface of the first plate.

Embodiments disclosed herein may include a heater pedestal. In an embodiment, the heater pedestal may comprise a heater pedestal body and a conductive mesh embedded in the heater pedestal. In an embodiment, the conductive mesh is electrically coupled to a voltage source In an embodiment, the heater pedestal may further comprise a support surface on the heater pedestal body. In an embodiment, the support surface comprises a plurality of pillars extending out from the heater pedestal body and arranged in concentric rings. In an embodiment pillars in an outermost concentric ring have a height that is greater than a height of pillars in an innermost concentric ring.

A carrier containing a plurality of semiconductor wafers in a lot is transported into a heat treatment apparatus. Thereafter, a recipe specifying treatment procedures and treatment conditions is set for each of the semiconductor wafers. Next, a reflectance of each of the semiconductor wafers stored in the carrier is measured. Based on the set recipe and the measured reflectance of each semiconductor wafer, a predicted attainable temperature of each semiconductor wafer at the time of flash heating treatment is calculated, and the calculated predicted attainable temperature is displayed. This allows the setting of the treatment conditions with reference to the displayed predicted attainable temperature, to thereby easily achieve the setting of the heat treatment conditions.

In this sample stage that adsorbs and holds a sample, the configuration includes: an outer circumference stage that has a first adsorption surface and a pressure receiving chamber that is a recess formed in the center thereof; an inner circumference stage that has a second adsorption surface, and that is housed in the pressure receiving chamber and can project upward from the outer circumference stage; a first flow channel for a sample desorption operation that is formed on the outer circumference stage and is opened on the first adsorption surface; a second flow channel for the sample desorption operation that is formed on the outer circumference stage and the inner circumference stage and is opened on the second adsorption surface; and a third flow channel for inner circumference stage elevating driving that is formed on the outer circumference stage and is opened in the pressure receiving chamber.

According to one aspect of a technique the present disclosure, there is provided a processing apparatus including: an apparatus controller including a memory storing apparatus data containing monitor data containing sensor information and an alarm indicating a failure detected based on the sensor information and an alarm analysis table containing analysis items. The apparatus controller is capable of outputting the alarm containing an alarm ID for specifying a type and an occurrence time of the alarm; specifying candidates of the analysis items from the alarm ID; acquiring monitor data corresponding to the candidates; determining a rank of the cause of the alarm according to a difference between monitor data at the occurrence time and a predetermined threshold value; and displaying a relationship between the monitor data and the threshold value. The display screen displays an occurrence history of the alarm and history of acquiring the monitor data.