Patent classifications
H01L21/67294
WORKPIECE MANAGEMENT METHOD AND SHEET CUTTING MACHINE
A workpiece management method includes a frame unit forming step of forming a frame unit with a workpiece supported in an opening of an annular frame via a resin sheet, a printing step of, after performing the frame unit forming step, printing identification information of the workpiece on the resin sheet in an area between an outer periphery of the workpiece and an inner periphery of the annular frame, a processing step of processing the workpiece by a processing machine, a separation step of separating the processed workpiece from the resin sheet, and a storage step of storing the resin sheet from which the workpiece has been separated. A sheet cutting machine suitable for use in the workpiece management method is also disclosed.
RETICLE POD PROVIDED WITH HOLDING PINS AND METHOD FOR HOLDING RETICLE
The invention discloses a reticle pod having a lid and multiple pin assemblies. The pin assembly includes a movable member movable relatively to a ceiling of the lid and an elastic member configured to arrange the movable member in between the elastic member and the ceiling of the lid. In the case where the reticle pod is provided without receiving a reticle, the ceiling of the reticle pod determines the movable member stays at a first level. In the case where the reticle pod is provided with a reticle, the elastic member collaborates with the movable member such that the movable member holds the reticle at a second level that is higher than the first level.
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE TRANSPORT METHOD
A substrate processing apparatus includes a load port, a load lock chamber, a processing module, a substrate transport mechanism, and a controller. The substrate transport mechanism includes a plurality of substrate holders, each of which is configured hold one substrate. The controller is configured to control, when the processing module is configured to process one substrate at a time, the substrate transport mechanism such that a first substrate holder transports the substrate between the load port and the processing module and a second substrate holder transports the substrate between the load lock chamber and the processing module. The controller is further configured to control, when the processing module is configured to simultaneously process the plurality of substrates, the substrate transport mechanism such that the plurality of substrate holders simultaneously transport the plurality of substrates between the load port, the load lock chamber, and the processing module.
Wafer jig with identification mark
Disclosed herein is a wafer jig with an identification mark for use in inspecting the function of an identification mark reading mechanism for reading an identification mark on a device wafer. The wafer jig includes a wafer piece cut from a region of a device wafer where an identification mark is formed, and a circular plate having the same diameter as the device wafer. The wafer piece is fixed to the circular plate such that the identification mark on the wafer piece is positionally aligned with the identification mark on the device wafer.
Multiple semiconductor die container load port
A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.
CONTROL METHOD, TRANSPORT SYSTEM, AND COMMUNICATION DEVICE
In a control method, a controller obtains equipment specifying information that specifies an equipment to which a transportable object is to be delivered, and a transport carriage obtains carriage position information indicating the position of the transport carriage. Any one of the transport carriage, a specific communication device, and the controller calculates the distance between the transport carriage and the specific communication device based on delivery position information indicating the position of a specific equipment and the carriage position information, and determines whether the distance is not more than a predetermined distance. When the distance is not more than the predetermined distance, one of the transport carriage and the specific communication device transmits, wirelessly to the surroundings, a trigger signal to start wireless communication between the transport carriage and the specific equipment, and performs wireless communication to deliver the transportable object between the transport carriage and the specific equipment.
METHOD FOR DIE-LEVEL UNIQUE AUTHENTICATION AND SERIALIZATION OF SEMICONDUCTOR DEVICES USING ELECTRICAL AND OPTICAL MARKING
A method for marking a semiconductor substrate at the die level for providing unique authentication and serialization includes projecting a first pattern of actinic radiation onto a layer of photoresist on the substrate using mask-based photolithography, the first pattern defining semiconductor device structures and projecting a second pattern of actinic radiation onto the layer of photoresist using direct-write projection, the second pattern defining a unique wiring structure having a unique electrical signature.
FRONT SURFACE AND BACK SURFACE ORIENTATION DETECTION OF TRANSPARENT SUBSTRATE
A system includes a substrate support on which to receive a transparent substrate, a non-contact sensor adapted to detect and image a dot pattern etched on a front surface of the transparent substrate, and a processing device attached to the non-contact sensor. The processing device may determine, using imaging data from the non-contact sensor, an orientation of a right-angled edge of the dot pattern. The processing device may determine, based on the orientation of the right-angled edge, whether a front surface of the transparent substrate is facing up or facing down. The processing device may also direct a robot to transfer the transparent substrate to a processing chamber dependent on whether the front surface of the transparent substrate is facing up or facing down.
METHOD OF SUPPLYING CHEMICAL LIQUID
A method includes moving a drum containing a chemical liquid into a chamber of a chemical liquid supplying system. The drum is connected with a testing pipe. The chemical liquid is pumped from the drum to the testing pipe. A condition of the chemical liquid flowing through the testing pipe is monitored. Whether the chemical liquid is supplied to a processing tool is determined based on the condition of the chemical liquid.
Pad structure for transferring flat panel
Disclosed is a pad structure for transferring a flat panel that includes a circular adhesive force adjustment pattern having a predetermined diameter in the center of the pad body, and a ring-shaped microciliated member having a circumferential surface surrounding the first adhesive force adjustment pattern and including a plurality of cilia spaced apart from one another, and thus provides advantages of improving the adhesive force per unit area due to the functions of the pad, without a separate vacuum device, of being easily and simply attached to and detached from the blade at a desired position thereon, and of maximizing productivity by easily and smoothly performing quality control, preventive maintenance, and inventory management of the pad for transferring a flat panel based on serial number standardization (product information standardization).