A wafer carrier that exhibits a thin, low-profile includes a bottom support plate upon which a thinned semiconductor wafer may be positioned, with a holding ring disposed to surround the periphery of the wafer and engage with the bottom support plate to hold the wafer in a fixed position between the two components. The bottom support plate is formed to include a plurality of apertures for pulling a vacuum through the carrier, as well as features that engage with the holding ring and alignment fiducials for properly registering the orientation of the wafer's surface with respect to the wafer carrier and other testing equipment using the wafer carrier.

A processing apparatus includes a chuck table, a processing unit configured to process a workpiece held on the chuck table, a height measuring unit fitted to the processing unit, the height measuring unit measuring, as height data, heights at a plurality of coordinates of the holding surface measured while a moving unit is moved, a reading unit capable of reading an information medium, and a control unit. The chuck table includes an information medium on which identifying information distinguishing the chuck table is recorded. The control unit includes a height data recording section configured to record the height data and the identifying information in association with each other, and a processing control section configured to control a height of the processing unit during processing on the basis of the height data associated with the identifying information read by the reading unit.

The present disclosure relates to a substrate transfer system, which includes a main body, a tray cassette base, a tray aligner, a tray robot, a substrate cassette base, a substrate aligner, a substrate robot and a Bernoulli robot. The tray can be transferred to the tray aligner by the tray robot. The substrate can be transferred to the substrate aligner by the substrate robot. By the Bernoulli robot, the substrate can be transferred from the substrate aligner to the tray on the tray aligner.

A substrate transfer system and method includes a mobile robot configured to handle a substrate carrier and comprising a power receiver; a mobile robot interface device configured to handle the substrate carrier and comprising a power feeder configured to supply an electromotive force to the power receiver of the mobile robot; at least one of: a first actuator configured to move the power feeder to adjust a distance between the power feeder and the power receiver and a second actuator configured to move the power receiver to adjust a distance between the power feeder and the power receiver; an identification tag disposed on any one of the mobile robot and the mobile robot interface device; a tag reader configured to recognize the identification tag; and a controller configured to control an operation of the mobile robot and to control an operation of the first and/or second actuator and the controller is further configured to control the first and/or second actuator to adjust the distance between the power feeder and the power receiver.

A treatment solution supply apparatus for supplying a treatment solution to a substrate treatment apparatus which treats a substrate using the treatment solution, includes: an accommodating part having a plurality of compartments in each of which a storage container storing the treatment solution is installed from one side surface side; an acquirer provided for each of the compartments and configured to acquire identification information about the storage container from an identification information holder attached to a side surface of the storage container installed in the compartment corresponding thereto; and a report part provided for each of the compartments and configured to report an installation state of the storage container in the compartment based on an acquisition result by the acquirer for the corresponding compartment, by a light emitting state of a light-emitting element, the light-emitting element of the report part emitting light toward the one side surface side.

A stocker may include a load port which a cassette for receiving wafers is either loaded on or unloaded from, an aligner configured to align the wafers and to confirm identification codes of the wafers, a plurality of shelves each having slots for receiving the wafers, a first transfer robot having a first robot arm for transferring the wafers between the load port and the aligner and a second transfer robot having a second robot arm for transferring the wafers between the aligner and the shelves.

A method for a substrate measurement subsystem is provided. An indication is received that a substrate being processed at a manufacturing system has been loaded into a substrate measurement subsystem. First positional data of the substrate within the substrate measurement subsystem is determined. One or more portions of the substrate to be measured by one or more sensing components of the substrate measurement subsystem are determined based on the first positional data of the substrate and a process recipe for the substrate. Measurements of each of the determined portions of the substrate are obtained by one or more sensing components of the substrate measurement subsystem. The obtained measurements of each of the determined portions of the substrate are transmitted to a system controller.

An alignment device which aligns notch portions of wafers includes mounting tables that hold the wafers, movement units that move the mounting tables, notch portion detection units that detect a circumferential positions of the notch portion, and a controller that controls positions of the mounting tables by the movement units. The mounting tables includes a mounting table main body portion and a pad member attached to an opening in the mounting table main body portion to hold the wafers. The pad member includes the main body portion that is attached to the opening and has a through hole in a center portion thereof, the first annular portion on an end side of the pad member to abut against wafers, and the first collar portion that is integrally provided with the first annular portion and the main body portion and extends toward outside of the main body portion.

The instant disclosure discloses a reticle retaining system comprising an inner pod and an outer pod. The inner pod is configured to receive a reticle that includes a first identification feature. The inner pod comprises an inner base having a reticle accommodating region generally at a geometric center thereof and surrounded by a periphery region, and an inner cover configured to establish sealing engagement with the inner base. The inner base has a first observable zone defined in the reticle accommodating region correspondingly arranged to allow observation of the first identification feature. The outer pod is configured to receive the inner base. The outer pod comprises an outer base having a second observable zone defined thereon observably aligned to the first observable zone of the inner pod upon receiving the inner pod, and an outer cover configured to engage the outer base and cover the inner pod.

A travel path of an article transport facility provided with a plurality of article transport vehicles that travel along the travel path and transport articles, and a control device that controls operation of the article transport vehicles includes a path set in an inspection area for causing a target transport vehicle designated as an inspection target from among the plurality of article transport vehicles to travel along. The target transport vehicle includes a sensor that detects behavior of the target transport vehicle during travel. The control device controls the plurality of article transport vehicles such that only the one target transport vehicle is present in the inspection area, and causes the target transport vehicle to travel in the inspection area in an inspection travel pattern prescribed in advance.