An imprint device includes a load port for receiving a substrate to be processed, a sensor that acquires information from the substrate about a film on the substrate, and a primer forming unit configured to receive the substrate from the load port. A controller is configured to select primer process conditions corresponding to the film information. The primer forming unit receives primer process conditions from the controller and forms a primer layer on the substrate over the film. The primer layer is formed according to the selected process conditions. An imprinting unit of the imprint device is configured to receive the substrate from the primer forming unit and perform imprint lithography on the substrate.

An inspection system for a semiconductor package includes an inspection apparatus that includes a stage on which the semiconductor package is loaded, and a computer coupled to the inspection apparatus. The semiconductor package may include a first semiconductor chip and a second semiconductor chip on the first semiconductor chip, the computer may provide first identification information about the first semiconductor chip and second identification information about the second semiconductor chip, and the computer may control the inspection apparatus to selectively perform a package test process on one of the first and second semiconductor chips, the one of the first and second semiconductor chips being identified as a good chip based on the first identification information and the second identification information.

In certain embodiments, a system includes: a source lane configured to move a first die container between a load port and a source lane staging area; an inspection sensor configured to produce a sensor result based on a die on the first die container; a pass target lane configured to move a second die container between a pass target lane out port and a pass target lane staging area; a fail target lane configured to move a third die container between a fail target lane out port and a fail target lane staging area; and a conveyor configured to move the die from the first die container at the source lane staging area to either the second die container at the pass target lane staging area or the fail target lane staging area based on the sensor result.

A package comprising a carrier, an electronic component mounted on the carrier, and an identifier indicative of an origin of the package and being formed on and/or in the carrier is disclosed.

A method for marking a semiconductor substrate at the die level for providing unique authentication and serialization includes projecting a first pattern of actinic radiation onto a layer of photoresist on the substrate using mask-based photolithography, the first pattern defining semiconductor device structures and projecting a second pattern of actinic radiation onto the layer of photoresist using direct-write projection, the second pattern defining a unique identifier.

A method for marking a semiconductor substrate at the die level for providing unique authentication and serialization includes projecting a first pattern of actinic radiation onto a layer of photoresist on the substrate using mask-based photolithography, the first pattern defining semiconductor device structures and projecting a second pattern of actinic radiation onto the layer of photoresist using direct-write projection, the second pattern defining a unique wiring structure having a unique electrical signature.

A substrate transport apparatus auto-teach system for auto-teaching a substrate station location, the system including a frame, a substrate transport connected to the frame, the substrate transport having an end effector configured to support a substrate, and a controller configured to move the substrate transport so that the substrate transport biases the substrate supported on the end effector against a substrate station feature causing a change in eccentricity between the substrate and the end effector, determine the change in eccentricity, and determine the substrate station location based on at least the change in eccentricity between the substrate and the end effector.

A workpiece unit includes a wafer, a tape stuck to the wafer, and an annular frame to which an outer circumferential edge of the tape is stuck and which has an opening defined centrally therein. The wafer is disposed in the opening in the annular frame and supported on the annular frame by the tape. An irreversible ultraviolet radiation detecting seal that discolors when irradiated with an ultraviolet radiation as an external stimulus is stuck to the annular frame.

The present invention provides an apparatus for packing wafer cassettes, the apparatus including: a loading part to which a wafer cassette is loaded; an accessory inspecting part configured to check a recipe attached to the wafer cassette and inspect accessories of the wafer cassette; a first label attaching part configured to attach a first label to the wafer cassette on which the accessory inspection has been completed; a primary film packing part configured to receive a primary film according to the recipe and pack the wafer cassette using the primary film; a secondary film packing part configured to receive a secondary film according to the recipe and secondarily pack the wafer cassette using the secondary film; a second label attaching part configured to attach a second label to the secondary film with which the wafer cassette has been packed; and an unloading part configured to discharge the wafer cassette which has been completely packaged.

A computer-implemented method executed on a processor for detecting whether a wafer has been tampered during a semiconductor fabrication process, the method including, at a plurality of patterning steps where lithographic patterns are defined and etched or at a plurality of fabrication processing steps, marking, via an identification tool, each die with an unclonable identification in a memory array, inspecting, via an inspection tool, each of the dies, and removing compromised wafers from a wafer pool during the semiconductor fabrication process.