A processing apparatus includes a wafer unloading unit, a wafer table, a frame unloading unit, a frame table, a tape affixing unit, a tape-affixed frame transporting unit, a tape compression-bonding unit, a frame unit unloading unit that unloads a frame unit in which a tape of a tape-affixed frame and the undersurface of a wafer are compression-bonded to each other from the wafer table, a reinforcing portion removing unit, a no-ring unit unloading unit, and a frame cassette table.

Substrate holding hand including a base plate spreading from base toward tip end sides, part of base plate located at base end side, fixed to hand tip portion, holding position at base plate, engaging claw at part of base plate located at tip end side, engaging claw configured to engage part of edge of substrate in vertical or inclined postures, part of edge located lower than center of substrate, moving portion at base end side of holding position and configured to move toward tip end side, and plurality of rotating bodies at the moving portion, being pressed by movement against edge of substrate located lower than holding position and engaged with claw, and plurality of rotating bodies pushing substrate upward holding position while rotating along edge of substrate.

A substrate processing system includes a first main surface grinding device configured to grind, while holding a substrate from below with a first main surface of the substrate facing upwards, the first main surface of the substrate; a first inverting device configured to invert the substrate ground by the first main surface grinding device; and a second main surface grinding device configured to grin, while holding the ground first main surface of the substrate from below with a second main surface of the substrate facing upwards, the second main surface of the substrate.

A processing liquid used in a substrate liquid processing apparatus can be supplied in a constant amount with high accuracy. A substrate liquid processing apparatus A1 includes a storage line 61 configured to store a processing liquid therein; an introduction line 62 configured to introduce the processing liquid into the storage line 61; a discharge line 63 configured to discharge the processing liquid from the storage line 61; and a gas supply unit 65 configured to perform a strickling of the processing liquid by jetting a gas to a surface of the processing liquid stored in the storage line 61.

Bonding equipment includes a laminar flow source, a chip handling portion, a cleaning portion for cleaning a chip, a bonding portion for bonding the chip and a substrate, and a transfer mechanism for transferring the chip from the chip handling portion to the bonding portion. Among these, at least the bonding portion and the cleaning portion are disposed in a laminar flow by the laminar flow source.

Methods and apparatuses for cleaning semiconductor wafers(202). Thereinto, a method comprises transferring one or more wafers(202) to at least one first tank(201) containing cleaning chemical, one or more second tanks(207) containing cleaning liquid successively for implementing batch cleaning process; taking the one or more wafers(202) out of the cleaning liquid in the one or more second tanks(207) and transferring the one or more wafers(202) to one or more single wafer cleaning modules(510) for implementing single wafer cleaning and drying processes; wherein control and keep a certain thickness of liquid film(204,504) on the one or more wafers(202) from the moment of the one or more wafers out of the cleaning chemical in the at least one first tank(201) till the one or more wafers(202) are immersed in the cleaning liquid of the one or more second tanks(207), and/or from the moment of the one or more wafers(202) out of the cleaning liquid in the one or more second tanks(207) till the one or more wafers(202) are transferred to the one or more single wafer cleaning modules (510).

An overhead transport vehicle includes: a traveler; a main body; a transferer including a holder, a mover, and a rotator, and which receives or delivers an article from or to a transfer destination; and a controller. The main body has an inner wall at a position at which the article held by the holder comes in contact therewith when the holder set at a storing position is rotated by a predetermined angle by the rotator. The controller causes the traveler to travel while the holder is at the storing position, and when the article is received or delivered, causes the rotator to rotate the holder by a predetermined angle or more about a rotation axis in a state where the holder is set at an exiting position by the mover to align the article with a prescribed orientation of the transfer destination.

A substrate processing system includes a substrate processing set and a substrate holding unit. The substrate processing set includes a substrate supporting part for supporting a vertical substrate. The substrate holding unit includes two cantilevers and two substrate holding parts. Each of the substrate holding parts is respectively located on each of the cantilevers. The two substrate holding parts are used for holding the substrate vertically. When the substrate holding unit moves next to the substrate processing set and the two substrate holding parts touch the substrate, the two substrate holding parts hold the substrate.

A substrate positioning apparatus includes a holder and a rotating device. The holder is configured to hold a substrate. The rotating device is configured to rotate the holder. The rotating device includes a rotation shaft, a bearing member, a base member, a driving unit and a damping device. The rotation shaft is fixed to the holder. The bearing member is configured to support the rotation shaft in a non-contact state. The bearing member is fixed on the base member. The driving unit is configured to rotate the rotation shaft. The damping device includes a rail connected to the base member and a slider connected to the rotation shaft, and is configured to produce a damping force against a relative operation between the rotation shaft and the base member by a resistance generated between the rail and the slider.

In an embodiment, a system includes: a base with a bore hole, wherein the base is configured to secure a wafer at a first position on the base; a pin extending through the bore hole; a focus ring horizontally surrounding the wafer at the first position and extending upwardly from the base, wherein the wafer is configured to be moved vertically between the first position and a second position above the focus ring via the pin; and a slit valve above the focus ring, wherein the wafer is configured to be moved horizontally between the second position and the slit valve via a robotic arm.