The present disclosure relates to a substrate transfer apparatus. The substrate transfer apparatus includes a first transfer apparatus, a second transfer apparatus, a substrate carrier driver, a sensor, a swing apparatus, and a controller. The first transfer apparatus is configured to transfer a substrate in a first direction. The second transfer apparatus is configured to receive the substrate from the first transfer apparatus and transfer the substrate and comprising a substrate carrier on which the substrate transferred from the first transfer apparatus is seated. The substrate carrier driver is configured to move the substrate carrier. The sensor is configured to detect an abnormal transfer of the substrate from the first transfer apparatus to the second transfer apparatus and generate a detection signal corresponding to the abnormal transfer of the substrate. The swing apparatus is configured to swing the substrate carrier. The controller is connected to the sensor and the swing apparatus and configured to control the swing apparatus based on the detection signal of the sensor.

A substrate liquid processing apparatus includes a placing unit which places thereon a substrate; a liquid processing unit which processes the substrate by immersing the substrate in a processing liquid with a posture in which a plate surface of the substrate is perpendicular to a horizontal direction; a transfer unit which transfers the substrate between the placing unit and the liquid processing unit; and a rotating unit which rotates the substrate, after being subjected to a first processing by the liquid processing unit, around an axis perpendicular to the plate surface, and in a direction different from that when the first processing is performed. Further, the transfer unit transfers the substrate, after being subjected to the first processing, to the rotating unit and transfers the rotated substrate to the liquid processing unit. The liquid processing unit performs a second processing by immersing the rotated substrate in the processing liquid.

In an embodiment, a system includes: a base with a bore hole, wherein the base is configured to secure a wafer at a first position on the base; a pin extending through the bore hole; a focus ring horizontally surrounding the wafer at the first position and extending upwardly from the base, wherein the wafer is configured to be moved vertically between the first position and a second position above the focus ring via the pin; and a slit valve above the focus ring, wherein the wafer is configured to be moved horizontally between the second position and the slit valve via a robotic arm.

Discussed are a device for self-assembling semiconductor light-emitting diodes, in which the device includes an assembly chamber having a space for accommodating a fluid; a magnetic field forming part having at least one magnet for applying a magnetic force to the semiconductor light-emitting diodes dispersed in the fluid and a moving part for changing positions of the at least one magnet so that the semiconductor light-emitting diodes move in the fluid; and a substrate chuck having a substrate support part configured to support a substrate, and a vertical moving part for lowering the substrate so that one surface of the substrate is in contact with the fluid in a state in which the substrate is supported by the substrate support part, wherein the vertical moving part provided at the substrate chuck lowers the substrate on to the fluid so that a force of buoyancy by the fluid is applied to the substrate.

Discussed is a device for self-assembling semiconductor light-emitting diodes, in which the device includes an assembly chamber having a space for accommodating a fluid; a magnetic field forming part having at least one magnet for applying a magnetic force to the semiconductor light-emitting diodes dispersed in the fluid and a moving part for changing positions of the at least one magnet so that the semiconductor light-emitting diodes move in the fluid; a substrate chuck having a substrate support part configured to support a substrate, and a vertical moving part for lowering the substrate so that one surface of the substrate is in contact with the fluid in a state in which the substrate is supported by the substrate support part; and a controller for controlling a movement of the magnetic field forming part and the substrate chuck, wherein the controller controls a depth at which the substrate is submerged in the fluid based on a degree of warping of the substrate.

Disclosed is a substrate treating apparatus that performs a cleaning treatment on substrates. A treating block includes a plurality of treating units in an upper and lower stages, respectively. The treating block includes a front face cleaning unit and a back face cleaning unit, each being at least one in number, in the upper stage. The treating block includes at least one tower unit including the front face cleaning unit and the back face cleaning unit, each being at least one in number, in the lower stage. Moreover, a transportation block is provided that includes a center robot in each of the upper and lower stages.

A flip-chip bonding apparatus for mounting semiconductor chips on a circuit board is provided with: a mounting head, to which a plurality of mounting nozzles for moving, in the vertical direction, mounting tools for vacuum-sucking the semiconductor chips are attached by being aligned in the Y direction, said mounting head moving in the Y direction; and an electronic component handling unit, that moves in the X direction perpendicular to the Y direction, picks up the semiconductor chips such that the semiconductor chips are aligned in the X direction, inverts the semiconductor chips, and at the same time, changes the alignment direction of the semiconductor chips from the X direction to the Y direction. Consequently, in the electronic component mounting apparatus, installation area can be saved and bonding speed can be increased with the simple configuration.

A transporter for transporting an article used in semiconductor fabrication is provided. The transporter includes a robotic arm. The transporter further includes two platens connected to the robotic arm. Each of the two platens an inner surface facing the other, and a number of gas holes are formed on each of the inner surfaces of the two platens. The transporter also includes a gas supplier placed in communication with the gas holes. The gas supplier is used to control the flow of gas through the gas holes.

Provided is a semiconductor wafer placement position determination method making it possible to measure a position deviation at a placement position of a semiconductor wafer when using a susceptor that is N-fold symmetric with respect to the center of the susceptor as a rotation axis. In this method, an opening edge of a counterbore portion of the susceptor is N-fold symmetric with respect to the center of the susceptor as a rotation axis (N2). This method includes: a measurement step of measuring, while rotating the susceptor on which the semiconductor wafer is placed, a gap distance between a periphery of the semiconductor wafer and the opening edge; a first calculation step of performing, based on variation of the gap distance, period regression analysis; and a second calculation step of determining the position deviation based on an amplitude of a trigonometric function obtained by the first calculation step.

A device for manipulating at least a first row of wafers and a second row of wafers, includes: a first holder configured to hold the first row of wafers, the first holder having a first rod and a second rod, the first rod and the second rod of the first holder defining a space therebetween for accommodating the first row of wafers, wherein a distance between the first rod and the second rod of the first holder is variable; and a second holder configured to hold the second row of wafers, the second holder having a first rod and a second rod, the first rod and the second rod of the second holder defining a space therebetween for accommodating the second row of wafers, wherein a distance between the first rod and the second rod of the second holder is variable.