A fluid control device includes a housing having plural surfaces defining a cavity within the housing. The housing includes an inlet to receive a fluid mixture and an outlet to direct the fluid mixture out of the housing. The fluid mixture includes a fluid combined with debris. A structure array is disposed within the cavity and includes plural structures. Each of the plural structures includes a first surface coupled with an internal surface of the housing and a second surface disposed a distance away from the internal surface of the housing. The structure array includes a first portion and a second portion. The first portion is configured to interfere with the fluid mixture to separate at least some of the debris from the fluid, and the second portion is configured to direct the fluid and at least some of the debris toward the outlet.

An apparatus includes at least one heat pipe that is adapted to be thermally coupled to an integrated circuit and has an evaporator portion and a first condenser portion, wherein the first condenser portion extends away from the evaporator portion; a first plurality of cooling fins that is attached to the first condenser portion; a first movable support that is thermally coupled to the first condenser portion and is configured to move a second plurality of cooling fins relative to the first plurality of cooling fins; and the second plurality of cooling fins, which is attached to the first movable support.

A cooling apparatus includes a casing, pumping unit, and heat exchange unit. The pumping unit includes a body and housing. The body includes a wishbone-shaped indentation and lollipop shaped indentation separate from the wishbone-shaped indentation. The housing includes a wishbone-shaped flow path and lollipop-shaped flow path separate from the wishbone-shaped flow path. The body is coupled to the housing such that the wishbone-shaped indentation and the wishbone-shaped flow path define a first flow path and the lollipop-shaped indentation and the lollipop-shaped flow path define a second flow path. The pumping unit is coupled to the heat exchange chamber such that the first flow path and the second flow path is in fluid communication with the heat exchange chamber via a first end opening and second end opening, and third opening, respectively.

Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packages are disclosed. An example apparatus includes a carrier plate including a first surface to face a heatsink; a second surface opposite the first surface, and an aperture extending between the first and second surfaces, the aperture dimensioned to surround a semiconductor device, and a spring carried by the carrier plate, the spring to contact a surface of the semiconductor device proximate an outer edge of the semiconductor device.

A semiconductor device includes: a substrate on which wiring is formed; a first semiconductor element flip-chip bonded to the substrate; a second semiconductor element provided on the first semiconductor element; a first resin provided in at least part of a region between the first semiconductor element and the substrate; a second resin provided in at least part of a region between the second semiconductor element and the substrate; and a member having a thermal conductivity higher than a thermal conductivity of the first resin and a thermal conductivity of the second resin, provided between the first resin and the second resin, having a part overlapping with an upper surface of the first semiconductor element, and having another part overlapping with a first wiring part as part of the wiring in a top view.

A heat sink includes: a base plate; and at least one fin secured to the base plate; wherein the base plate has at least one through hole that extends in a first direction parallel to a surface of the base plate, wherein the at least one fin has a projection inserted into the at least one through hole, and wherein, in a second direction that is parallel to the surface of the base plate and that is perpendicular to the first direction, both end surfaces of the projection are in contact with inner wall surfaces of the at least one through hole entirely in a third direction parallel to a thickness direction of the base plate.

A semiconductor package including a base comprising an upper surface and a lower surface that is opposite to the upper surface; a radio-frequency (RF) module embedded near the upper surface of the base; an integrated circuit (IC) die mounted on the lower surface of the base in a flip-chip manner so that a backside of the IC die is available for heat dissipation; a plurality of conductive structures disposed on the lower surface of the base and arranged around the IC die; and a metal thermal interface layer comprising a backside metal layer that is in contact with the backside of the IC die, and a solder paste conformally printed on the backside metal layer.

According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat sources. In exemplary embodiments, a method of establishing a thermal joint for conducting heat between a heat spreader and a heat source of an electronic device generally includes positioning a thermal interface material (TIM1) between the heat spreader and the heat source.

An optical communication system includes a co-packaged optical module and a heatsink mounted to the co-packaged optical module. The co-packaged optical module includes a processor disposed on a substrate and a plurality of light engines disposed at different locations around the processor on the substrate. The processor and the light engines generating different amounts of heat during operation. The heatsink includes a plurality of heat pipes non-uniformly distributed throughout the heatsink to remove the different amounts of heat generated at a location of the processor and respective locations of the different ones of the light engines.

The present invention provides thermal interface materials for the interior, center, and exterior of an electronic component, wherein the interior thereof is a first contact interface between an electronic chip and an integrated heat spreader; the center thereof is a second contact interface between the electronic chip and a heatsink; and the exterior thereof is a third contact interface between the integrated heat spreader and the heatsink. The thermal interface material consists of: a first, a second, a third thermal conductive adhesive layer, along with a thin electrically conductive functional layer. The thin electrically conductive functional layer is at least a conductive foil, a conductive foil with a ceramic and/or graphene heat dissipation layer on one side thereof, and a conductive foil with a ceramic and/or graphene heat dissipation layer on two sides thereof; and is laminated between the first and the second thermal conductive adhesive layer.