A semiconductor apparatus a semiconductor module including a semiconductor device and a resin section covering the periphery of the semiconductor device, and a cooler arranged below the semiconductor device. The cooler includes a top plate that is attached to a lower surface of the resin section. The resin section has a protrusion protruding downward from an outer peripheral edge of the lower surface of the resin section. The protrusion includes a first straight section extending in a predetermined direction in a plan view of the semiconductor apparatus, and a first curved section having a curved shape convex inward the semiconductor module and being connected to the first straight section. The top plate includes a first notch that is engageable with the protrusion, and the resin section and the top plate are bonded to each other with an adhesive interposed therebetween.

The resin-sealed semiconductor device is configured in such a way that a second bonding material has a higher melting point than a first bonding material made of a solder-bonding material has, in such a way that one of bonding surfaces in each of which a power module and a cooling device are bonded to each other with the first bonding material is the other surface portion of a copper plate, and the other one of the bonding surfaces is the surface portion, at the power module side, of the cooling device, and in such a way that the surface portion, at the power module side, of the cooling device is formed of copper or metal having solder wettability the same as or higher than solder wettability of copper.

Provided are a semiconductor device and an inverter device with a decrease in yield being suppressed by preventing the adhesive from leaking into the inside of the semiconductor device. A heat sink, a wiring board provided on the heat sink, a semiconductor chip provided on the wiring board, a case housing provided on the heat sink so as to surround the wiring board and the semiconductor chip, an adhesive that adheres a lower surface joint portion of the case housing and an upper surface joint portion of the heat sink, a sealing material that fills the case housing and covers the wiring board and the semiconductor chip, and a convex portion provided on the lower surface joint portion of the case housing or the upper surface joint portion of the heat sink, that separates the adhesive from the sealing material are included.

A heat conduction structure includes a shell, a wick structure, a separating sheet, and a working fluid. The shell includes a chamber. The chamber is divided into an evaporation room, a condensation room and a connection room formed between the evaporation room and the condensation room. The wick structure covers an inner bottom wall of the chamber. The separating sheet is received in the connection room and stacked on the wick structure. An airflow channel is formed between the separating sheet and the inner top wall of the connection room. The working fluid is disposed in the chamber. Therefore, the liquid working fluid and the gaseous working fluid are split by the separating sheet to increase the heat dissipating efficiency of the heat conduction structure.

The embodiments include a stackable computing device that includes an integrated heatsink and antenna structure and a housing structure. The housing structure includes a housing casing that surrounds the integrated heatsink and antenna structure. The integrated heatsink and antenna structure includes a heatsink base and one or more radio frequency (RF) antenna portions. The heatsink base includes a connector port that provides an interface between components of the computing device and other computing or peripheral devices. For example, the heatsink base may include platform that is configured to have circuitry fixedly secured on a first side of the platform with a connector of the circuitry aligned with an aperture of the connector port such that a connection to the circuitry is accepted by circuitry of another computing device.

A heat dissipation device includes a base plate and a plurality of fins arranged on the base plate. Each fin includes a fin body including a first metal sheet and a second metal sheet coupled to each other, wherein the fin body is curved and includes a first portion and a second portion transverse to the first portion, an evaporation channel defined in the first portion, one or more connecting channels disposed in the first portion and in fluid communication with the evaporation channel, a condensation channel defined in the second portion, and one or more auxiliary channels disposed in the second portion and in fluid communication with the one or more connecting channels and the condensation channel.

A package structure includes a circuit substrate, a semiconductor package, a thermal interface material, a lid structure and a heat dissipation structure. The semiconductor package is disposed on and electrically connected to the circuit substrate. The thermal interface material is disposed on the semiconductor package. The lid structure is disposed on the circuit substrate and surrounding the semiconductor package, wherein the lid structure comprises a supporting part that is partially covering and in physical contact with the thermal interface material. The heat dissipation structure is disposed on the lid structure and in physical contact with the supporting part of the lid structure.

Enhanced thermal energy transfer systems for semiconductor packages are provided. A thermally conductive member is disposed in the interstitial space between an upper surface of a semiconductor package and a lower surface of a thermal member. The thermally conductive member is disposed above a first portion of the upper surface of the semiconductor package having a relatively higher thermal energy output when the semiconductor package is operating. A thermal interface material is disposed in the interstitial space and a force applied to the thermal member. The thermally conductive member forms a relatively higher pressure region above the first portion of the semiconductor package and a relatively lower pressure region in other portions of the semiconductor package remote from the thermally conductive member. The increased pressure region proximate the thermally conductive member beneficially enhances the flow of thermal energy from the first portion of the semiconductor package to the thermal member.

A heat sink includes a base plate; a cover overlapping the base plate; fins, each having a plate-like shape projecting from the base plate in a direction perpendicular to the base plate, located between the base plate and the cover; one or a plurality of first fin groups composed of a plurality of the fins arranged with a gap therebetween in a first direction; and one or a plurality of second fin groups composed of a plurality of the fins arranged with a gap therebetween in the first direction, and adjacent to the first fin group with a gap therebetween in a second direction. Positions in the first direction of the fins belonging to the second fin group are displaced with respect to positions in the first direction of the fins belonging to the first fin group. Each of the fines has an S-shape.

A cooling device that cools a semiconductor component mounted on a surface of a substrate includes a base attached to a back surface of the substrate, and a bottom plate disposed spaced apart from the base. A recessed part recessed toward the substrate side is formed in a region that is a surface, of the base, facing the bottom plate side and corresponds to the semiconductor component.