A method for manufacturing a semiconductor device includes preparing a wafer that includes semiconductor elements, placing the wafer on a stage so that a second electrode is in contact with a place surface of the stage, and measuring an on-resistance of at least one of the semiconductor elements with a first measurement terminal and a second measurement terminal. The on-resistance is measured by contacting the first measurement terminal to a first electrode of one of the semiconductor elements to be measured while applying a control signal to a control electrode of the one of the semiconductor elements, contacting the second measurement terminal to a first electrode of another one of the semiconductor elements while applying the control signal to a control electrode of the another one of the semiconductor elements, and measuring a resistance between the first measurement terminal and the second measurement terminal.