A semiconductor device or circuit includes a vertical bipolar junction transistor (vBJT) and a vertical filed effect transistor (vFET). The vBJT collector is electrically and/or physically connected to an adjacent vFET source. For example, a vBJT collector and a vFET source may be integrated upon a same semiconductor material substrate or layer. The vFET provides negative feedback for the collector-base voltage and the vBJT emitter and collector allow for low transit times.

Aspects of the disclosure provide a bipolar transistor structure with a sub-collector on a substrate, a first collector region on a first portion of the sub-collector, a trench isolation (TI) on a second portion of the sub-collector and adjacent the first collector region, and a second collector region on a third portion of the sub-collector and adjacent the TI. A base on first collector region and a portion of the TI. An emitter is on a first portion of the base above the first collector region. The base includes a second portion horizontally displaced from the emitter in a first horizontal direction, and horizontally displaced from the second collector region in a second horizontal direction orthogonal to the first horizontal direction.

A microelectronic device includes a PNP transistor and NPN transistor arranged vertically in a P-type doped semiconductor substrate. The PNP and NPN transistors are manufactured by: forming an N+ doped isolating well for the PNP transistor in the semiconductor substrate; forming a P+ doped region in the N+ doped isolating well; epitaxially growing a first semiconductor layer on the semiconductor substrate; forming an N+ doped well for the NPN transistor, where at least part of the N+ doped well extends into the first semiconductor layer; then epitaxially growing a second semiconductor layer on the first semiconductor layer; forming a P doped region forming the collector of the PNP transistor in the second semiconductor layer and in electrical contact with the P+ doped region; and forming an N doped region forming the collector of the NPN transistor in the second semiconductor layer and in electrical contact with the N+ doped well.

A method of forming a complementary metal oxide semiconductor (CMOS) device is provided. The method includes forming a separate gate structure on each of a pair of vertical fins, wherein the gate structures include a gate dielectric layer and a gate metal layer, and forming a protective liner layer on the gate structures. The method further includes heat treating the pair of gate structures, and replacing the protective liner layer with an encapsulation layer. The method further includes exposing a portion of the gate dielectric layer by recessing the encapsulation layer. The method further includes forming a top source/drain on the top surface of one of the pair of vertical fins, and subjecting the exposed portion of the gate dielectric layer to a second heat treatment conducted in an oxidizing atmosphere.

A semiconductor device includes a semiconductor substrate including an active region and an outer peripheral region. The active region includes a transistor portion and a diode portion. The outer peripheral region includes a current sensing unit. A lifetime control region including a lifetime killer is provided from the diode portion to at least a part of the transistor portion. The current sensing unit includes a sense transistor non-irradiation region not provided with the lifetime control region and a sense transistor irradiation region provided with the lifetime control region.

A compound semiconductor device comprises a heterojunction bipolar transistor including a plurality of unit transistors, a capacitor electrically connected between a RF input wire and a base wire for each unit transistor of the unit transistors, and a bump electrically connected to emitters of the unit transistors. The unit transistors are arranged in a first direction. The bump is disposed above the emitters of the unit transistors while extending in the first direction. The transistors include first and second unit transistors, the respective emitters of the first and second unit transistors being disposed on first and second sides, respectively, of a second direction, perpendicular to the first direction, with respect to a center line of the bump extending in the first direction. The capacitor is not covered by the bump, and respective lengths of the respective base wires connected respectively to the first and second unit transistors are different.

Switch circuitry including an input terminal (1), said input terminal connected to the base of a first transistor (Q1) via a first resistor (R3), said first transistor being an NPN Bipolar Gate Transistor (Q1), said circuitry further comprising a second resistor (R5) connected between the base of said first transistor (Q1) and ground, and including an output line or terminal (3) connected to the collector of said first transistor (Q1), and wherein the emitter of said first transistor (Q1) is connected to ground (earth), said circuitry further including a second transistor (Q2), said second transistor being a PNP Bipolar Gate Transistor, wherein the collector of said second transistor (Q2) is connected via a third resistor (R8) to the base of said first transistor (Q1), and the emitter of said second transistor (Q2) is connected to said input terminal (1), and wherein the emitter of said second transistor (Q2) is additionally connected to the base of said second transistor (Q2) via a fourth resistor (R11); and the base of said second transistor (Q2) being additionally connected to the output terminal (3) via a fifth resistor (R10) and a diode (D1).

Switch circuitry including an input terminal (1), said input terminal connected to the base of a first transistor (Q1) via a first resistor (R3), said first transistor being an NPN Bipolar Gate Transistor (Q1), said circuitry further comprising a second resistor (R5) connected between the base of said first transistor (Q1) and ground, and including an output line or terminal (3) connected to the collector of said first transistor (Q1), and wherein the emitter of said first transistor (Q1) is connected to ground (earth), said circuitry further including a second transistor (Q2), said second transistor being a PNP Bipolar Gate Transistor, wherein the collector of said second transistor (Q2) is connected via a third resistor (R8) to the base of said first transistor (Q1), and the emitter of said second transistor (Q2) is connected to said input terminal (1), and wherein the emitter of said second transistor (Q2) is additionally connected to the base of said second transistor (Q2) via a fourth resistor (R11); and the base of said second transistor (Q2) being additionally connected to the output terminal (3) via a fifth resistor (R10) and a diode (D1).

Disclosed is a semiconductor structure including at least one bipolar junction transistor (BJT), which is uniquely configured so that fabrication of the BJT can be readily integrated with fabrication of complementary metal oxide semiconductor (CMOS) devices on an advanced silicon-on-insulator (SOI) wafer. The BJT has an emitter, a base, and a collector laid out horizontally across an insulator layer and physically separated. Extension regions extend laterally between the emitter and the base and between the base and the collector and are doped to provide junctions between the emitter and the base and between the base and the collector. Gate structures are on the extension regions. The emitter, base, and collector are contacted. Optionally, the gate structures and a substrate below the insulator layer are contacted and can be biased to optimize BJT performance. Optionally, the structure further includes one or more CMOS devices. Also disclosed is a method of forming the structure.

Current sharing among bidirectional double-base bipolar junction transistors. One example is a method comprising: conducting current through a first bidirectional double-base bipolar junction transistor (first B-TRAN); conducting current through a second B-TRAN the second B-TRAN coupled in parallel with the first B-TRAN; measuring a value indicative of conduction of the first B-TRAN, and measuring a value indicative of conduction of the second B-TRAN; and adjusting a current flow through the first B-TRAN, the adjusting responsive to the value indicative of conduction of the first B-TRAN being different than the value indicative of conduction of the second B-TRAN.