A semiconductor device with reduced power consumption that can perform a product-sum operation is provided. The semiconductor device includes first and second circuits, and the second circuit includes first and second switches, a current/voltage converter circuit, and a first transistor. The first circuit is electrically connected to a first terminal of the second circuit; a first terminal of the first switch is electrically connected to the first terminal of the second circuit; a second terminal of the first switch is electrically connected to an input terminal of the current/voltage converter circuit; an output terminal of the current/voltage converter circuit is electrically connected to a first terminal of the first transistor; a second terminal of the first transistor is electrically connected to a first terminal of the second switch; and a second terminal of the second switch is electrically connected to a second terminal of the second circuit. The first circuit has a function of retaining a plurality of pieces of first data and a function of making a current in an amount responsive to the sum of products of the plurality of pieces of first data and a plurality of pieces of second data flow to the first terminal of the second circuit when the plurality of pieces of second data are input to the first circuit.

Embodiments of the disclosure provide an integrated circuit (IC) structure, including: a p-type substrate, a p-well region within the p-type substrate, and an n-type barrier region between the p-type substrate and the p-well region. The n-type barrier region physically isolates the p-type substrate from the p-well region. A field effect transistor (FET) is positioned above the p-well region, and a buried insulator layer on the upper surface of the p-well region separates the transistor from the p-well region. A first voltage source electrically coupled to the p-well region induces a P-N-P junction across the p-well region, the n-type barrier region, and the p-type substrate.

A semiconductor structure includes a semiconductor on insulator (SOI) substrate, a first electrically conductive structure, and a second electrically conductive structure. The SOI substrate includes a base substrate, a buried insulation layer disposed on the base substrate, a semiconductor layer disposed on the buried insulation layer, and a trap rich layer disposed between the buried insulation layer and the base substrate. At least a part of the first electrically conductive structure and at least a part of the second electrically conductive structure are disposed in the trap rich layer. A part of the trap rich layer is disposed between the first electrically conductive structure and the second electrically conductive structure. The first electrically conductive structure, the second electrically conductive structure, and the trap rich layer disposed between the first electrically conductive structure and the second electrically conductive structure are at least a portion of an anti-fuse structure.

A semiconductor device capable of performing product-sum operation with high layout flexibility is provided. In the semiconductor device, a first layer, a second layer, and a third layer are formed in this order. The first layer includes a first cell, a first circuit, a first wiring, and a second wiring adjacent to the first wiring. The second layer includes a third wiring and a fourth wiring adjacent to the third wiring. The third layer includes an electrode and a sensor. The first circuit includes a switch. The sensor is electrically connected to the third wiring through the electrode and a first plug, a first terminal of the switch is electrically connected to the third wiring through a second plug, and a second terminal of the switch is electrically connected to the first cell through the first wiring. The electrode includes a region overlapping with the sensor and a region overlapping with the first plug. Note that the first to fourth wirings are parallel to each other, and the distance between the third wiring and the fourth wiring is greater than or equal to 0.9 times and less than or equal to 1.1 times the distance between the first wiring and the second wiring.

A semiconductor device, the device including: a first silicon layer including a first single crystal silicon; a first metal layer disposed over the first silicon layer; a second metal layer disposed over the first metal layer; a first level including a plurality of transistors, the first level disposed over the second metal layer, where the plurality of transistors include a second single crystal silicon; a third metal layer disposed over the first level; a fourth metal layer disposed over the third metal layer, where the fourth metal layer is aligned to the first metal layer with a less than 40 nm alignment error; and a via disposed through the first level, where the first level thickness is less than two microns.

Various integrated circuits formed using gallium nitride and other materials are described. In one example, an integrated circuit includes a first integrated device formed over a first semiconductor structure in a first region of the integrated circuit, a second integrated device formed over a second semiconductor structure in a second region of the integrated circuit, and a passive component formed over a third region of the integrated circuit, between the first region and the second region. The third region comprises an insulating material, which can be glass in some cases. Further, the passive component can be formed over the glass in the third region. The integrated circuit is designed to avoid electromagnetic coupling between the passive component, during operation of the integrated circuit, and interfacial parasitic conductive layers existing in the first and second semiconductor structures, to improve performance.

A structure includes a semiconductor substrate, and a polycrystalline resistor region over the semiconductor substrate. The polycrystalline resistor region includes a semiconductor material in a polycrystalline morphology. A dopant-including polycrystalline region is between the polycrystalline resistor region and the semiconductor substrate.

An integrated circuit structure includes a first transistor, an interconnect structure, a first dielectric layer, polycrystalline plugs, a semiconductor structure and a second transistor. The first transistor is formed on a substrate. The interconnect structure is over the first transistor. The first dielectric layer is over the interconnect structure. The polycrystalline plugs extend from a top surface of the dielectric layer into the dielectric layer. The semiconductor structure is disposed over the first dielectric layer. The second transistor is formed on the semiconductor structure.

A method of forming a substrate comprises providing a receiver substrate and a donor substrate successively comprising: a carrier substrate, a sacrificial layer, which can be selectively etched in relation to an active layer, and a silicon oxide layer, which is arranged on the active layer. A cavity is formed in the oxide layer to form a first portion that has a first thickness and a second portion that has a second thickness greater than the first thickness. The cavity is filled with a polycrystalline silicon filling layer to form a second free surface that is continuous and substantially planar. The receiver substrate and the donor substrate are assembled at the second free surface, and the carrier substrate is eliminated while preserving the active layer and the sacrificial layer.

A highly reliable display apparatus is provided at a low cost. The display apparatus includes a light-emitting diode included in a pixel circuit, a transistor included in the pixel circuit, and a transistor included in a driver circuit of the pixel circuit, which are stacked to have an overlap region. With such a structure, the display apparatus can be downsized. In addition, in the display apparatus, a plurality of light-emitting diodes can be attached to a circuit board formed with a transistor and the like in one step. Consequently, the manufacturing cost of the display apparatus can be reduced.