The, present disclosure relates to a method of fabricating a display panel. The method may include: forming a separation layer having first openings on a surface of the substrate; forming a flexible substrate layer covering the separation layer and the first openings; forming a TFT layer having second openings on a surface of the flexible substrate layer opposite from the substrate; removing a part of the flexible substrate layer that is underneath the second openings; forming a PDL layer covering the TFT layer, side walls of the third openings, and a part of the separation layer in the third openings, thereby forming fourth openings having a fourth width larger than the first width; forming an encapsulation layer covering the PDL layer and the fourth openings; and separating the flexible substrate layer from the substrate.

An electronic device includes a display module including a display panel including a first area in which a pixel is disposed, a second area adjacent to the first area and bent with respect to an imaginary axis, a data line connected to the pixel, and a first line insulated from the pixel, an optical film, and a bending cover layer and a window module including a glass substrate and a window protective layer including a cover portion disposed on the glass substrate and a protrusion portion protruding from the cover portion. An end of the optical film and an end of the bending cover layer, which faces the end of the optical film, defines a separation area, the data line and the first line overlap the separation area when viewed in a plane, and the protrusion portion overlaps the first line in the separation area when viewed in a plane.

A method of manufacturing a flexible display is disclosed. In one aspect, the method includes attaching a protective film to a flexible display panel. The flexible display panel includes a bending region along which the flexible display panel is configured to be bent. The method also includes removing a portion of the protective film that corresponds to the bending region and bending the flexible display panel along the bending region.

A thin film transistor substrate can include a buffer layer on a base substrate and having a first buffer layer and a second buffer layer; a semiconductor layer disposed on the buffer layer; a gate insulating film on the semiconductor layer; and a gate electrode spaced apart from the semiconductor layer, at least a part of the gate electrode overlapping with the semiconductor layer. The base substrate, the first buffer layer, the second buffer layer, the semiconductor layer, the gate insulating film and the gate electrode are sequentially stacked, and a surface oxygen concentration of the first buffer layer is higher than a surface oxygen concentration of the second buffer layer.

An electronic device includes a flexible substrate and a driving component. In the flexible substrate, a first side region, a second side region and a first cutting structure are disposed in a peripheral region, wherein a display region and the first side region are separated by a first edge of the display region, the display region and the second side region are separated by a second edge of the display region, the first edge and the second edge are respectively parallel to a first direction and a second direction perpendicular to the first direction, the first cutting structure has a first endpoint and two edges separated by the first endpoint and respectively belonging to the first side region and the second side region. The driving component overlaps the flexible substrate in a top view direction perpendicular to the first direction and the second direction.

A display device includes a display area, a pixel circuit area adjacent to the display area, and a functional module area between the display area and the pixel circuit area. An inorganic insulating layer is in the display area. A light phase compensation layer is in the functional module area and includes a same material as the inorganic insulating layer. A signal line is disposed in the functional module area, on the light phase compensation layer, and extends from the functional module area to the pixel circuit area. The organic insulating layer is on the inorganic insulating layer and extends from the display area to the functional module area to cover the signal line and the light phase compensation layer.

A display device includes a display area having a curved outer edge, a non-display area extended along the curved outer edge of the display area, the non-display area including a driver, a first non-display area including a first fan-out line having a first resistivity value; and a second non-display area extended along the curved outer edge of the display area and in a direction away from the first non-display area, the second non-display area including a first connection line which connects the driver to the first fan-out line, the first connection line having a second resistivity value less than the first resistivity value of the first fan-out line.

An active matrix substrate includes a glass substrate 26, a plurality of pixel electrodes 40 arrayed in a matrix, a plurality of TFTs 43, a plurality of common electrodes 42, a terminal group 60 provided at one end of a Y-axis direction on top of the glass substrate 26 and constituted by a plurality of terminals 61 and 62 placed along an X-axis direction, wires 71 that electrically connect the terminals 61 to the TFTs 43, and wires 72 that electrically connect the terminals 62 to the common electrodes 42. The terminal group 60 includes a center terminal group 64, constituted by a plurality of the first terminals 61, that constitutes a center portion of the terminal group 60 in the X-axis direction, and end terminal groups 65L and 65R, each constituted by a plurality of the first terminals and a plurality of the second terminals, that constitute both side portions, respectively, of the terminal group 60 in the X-axis direction and in each of which the second terminals 62 are each disposed between two of the first terminals 61 adjacent to each other.

A TFT backplane and a micro-LED display are provided A metal light shielding layer is placed at the lower surface of the substrate and the position of the metal light shield layer is corresponding to the active layer. This reduces the size of the side frame, which is used when assembling multiple displays in a large-size micro LED display application. This could meet the demand of large-size micro-LED display. In addition, this could further reduce the steps of depositing and patterning a conventional shield metal layer in a convention process of manufacturing the TFT. Therefore, the manufacturing steps of the TFT backplane are simplified and thus the manufacturing cost is reduced.

A display device includes a substrate; a semiconductor layer disposed on the substrate; a gate insulating film disposed on the semiconductor layer; a gate layer disposed on the gate insulating film and insulated from the semiconductor layer; an insulating film disposed on the semiconductor layer and the gate layer; and a metal layer disposed on the insulating film, wherein the semiconductor layer and the gate layer are electrically connected through the metal layer, and the semiconductor layer overlaps the gate layer in a plan view.